# US 8,786,078 B1 · Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,786,078 B1 - Document ID: US8786078B1 - Status: Granted - Kind: B1 - Application number: 14/143,377 - Filed: 2013-12-30 - Published: 2014-07-10 - Granted: 2014-07-22 - Earliest claimed: 2013-01-04 - Assignees: Toyota Motor Engineering & Manufacturing North America, Inc.; Purdue Research Foundation - Applicants: Toyota Motor Engineering & Manufacturing North America, Inc.; Purdue Research Foundation - Inventors: Matthew Joseph Rau; Ercan Mehmet Dede; Shailesh N. Joshi; Suresh V. Garimella - Web page: https://patentgrep.com/patent/US8786078B1 ## CPC - H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K 7/20845: {for automotive electronic casings (H05K7/2089 takes precedence)} - H10W 40/475: {using jet impingement (H10W40/776 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity. ## Claims ### Claim 1 A cooling apparatus comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; and a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions. ### Claim 2 (depends on 1) The cooling apparatus of claim 1, wherein the two-phase surface enhancement features comprise micro- and/or nano-features. ### Claim 3 (depends on 2) The cooling apparatus of claim 2, wherein the micro- and/or nano-features are pillars. ### Claim 4 (depends on 1) The cooling apparatus of claim 1, wherein the two-phase surface enhancement features are defined by roughened portions of the target surface. ### Claim 5 (depends on 4) The cooling apparatus of claim 4, wherein the roughened portions are laser roughened, chemically roughened, or mechanically roughened. ### Claim 6 (depends on 1) The cooling apparatus of claim 1, wherein the two-phase surface enhancement features comprise a film applied to the target surface. ### Claim 7 (depends on 6) The cooling apparatus of claim 6, wherein the film comprises micro- and/or nano-features. ### Claim 8 (depends on 1) The cooling apparatus of claim 1, wherein: the jet orifice is cross-shaped; the single-phase surface enhancement features are arranged in four groups of single-phase surface enhancement features; the two-phase surface enhancement features are arranged in four regions of two-phase surface enhancement features; and the four groups of single-phase surface enhancement features and the four regions of two-phase enhancement features alternate about the impingement region of the target surface. ### Claim 9 (depends on 8) The cooling apparatus of claim 8, wherein the four regions of two-phase enhancement features are arranged at a perimeter of the target surface. ### Claim 10 (depends on 8) The cooling apparatus of claim 8, wherein: the four groups of single-phase surface enhancement features radially extend from the impingement region; and individual groups of the four groups of single-phase surface enhancement features are arranged at ninety degrees with respect to adjacent groups of single-phase surface enhancement features. ### Claim 11 (depends on 10) The cooling apparatus of claim 10, wherein each group of single-phase surface enhancement features comprise a plurality of thermally conductive fins. ### Claim 12 (depends on 11) The cooling apparatus of claim 11, wherein: the plurality of thermally conductive fins comprises a center thermally conductive fin; and a length of individual thermally conductive fins decrease in directions away from the center thermally conductive fin. ### Claim 13 (depends on 1) The cooling apparatus of claim 1, wherein: the jet orifice has three circular lobes; the single-phase surface enhancement features are configured as a plurality of radially extending, thermally conductive fins; and the two-phase surface enhancement features are arranged in three regions of two-phase surface enhancement features. ### Claim 14 (depends on 13) The cooling apparatus of claim 13, wherein the three regions of two-phase surface enhancement features are arranged at a perimeter of the target surface. ### Claim 15 (depends on 13) The cooling apparatus of claim 13, wherein: a first region and a second region of the three regions of two-phase surface enhancement features are positioned at a first corner and a second corner of the target surface, respectively; and a third region of the three regions of two-phase surface enhancement features is positioned proximate an edge of the target surface opposite from the first corner and the second corner. ### Claim 16 (depends on 13) The cooling apparatus of claim 13, wherein the single-phase surface enhancement features and the two-phase surface enhancement features are symmetrical about one axis. ### Claim 17 (depends on 1) The cooling apparatus of claim 1, further comprising an intermediate substrate assembly thermally coupled to a heat transfer surface of the target layer. ### Claim 18 (depends on 17) The cooling apparatus of claim 17, wherein the intermediate substrate layer comprises a directed bonded substrate assembly. ### Claim 19 A power electronics module comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions; and a semiconductor device thermally coupled to the heat transfer surface. ### Claim 20 A vehicle comprising a power electronics module, the power electronics module comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions; and a semiconductor device thermally coupled to the heat transfer surface.