# US 8,786,069 B1 · Reconfigurable pop

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- Number: US 8,786,069 B1
- Document ID: US8786069B1
- Status: Granted
- Kind: B1
- Application number: 13/898,952
- Filed: 2013-05-21
- Granted: 2014-07-22
- Earliest claimed: 2013-03-15
- Assignees: Invensas Corporation
- Applicants: Invensas Corporation
- Inventors: Belgacem Haba; Richard Dewitt Crisp; Wael Zohni
- Web page: https://patentgrep.com/patent/US8786069B1

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- G11C 5/025: {Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device (geometrical lay-out of the components in integrated circuits, geometrical lay-out of the components in integrated circuits H10D89/10)}
- G11C 5/04: Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports
- G11C 5/063: {Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/00: Package configurations
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G11C: STATIC STORES (semiconductor memory devices H10B)

## Abstract

A microelectronic package can include lower and upper package faces, lower terminals at the lower package face configured for connection with a first component, upper terminals at the upper package face configured for connection with a second component, first and second microelectronic elements each having memory storage array function, and conductive interconnects each electrically connecting at least one lower terminal with at least one upper terminal. The conductive interconnects can include first conductive interconnects configured to carry address information, signal assignments of a first set of the first interconnects having 180° rotational symmetry about a theoretical rotational axis with signal assignments of a second set of first interconnects. The conductive interconnects can also include second conductive interconnects configured to carry data information, the position of each second conductive interconnect having 180° rotational symmetry about the rotational axis with a position of a corresponding no-connect conductive interconnect.

## Claims

### Claim 1

A microelectronic package, comprising:
a lower package face, an upper package face opposite the lower package face, and peripheral package edges bounding the lower and upper package faces;
lower terminals at the lower package face configured for connection with a first component,
upper terminals at the upper package face configured for connection with a second component,
first and second microelectronic elements each having memory storage array function, element faces of the first and second microelectronic elements arranged in a single plane parallel to the lower package face, the first and second microelectronic elements each having contacts at the respective element face; and
conductive interconnects each electrically connecting at least one lower terminal with at least one upper terminal, at least some of the conductive interconnects electrically connected with the contacts of the microelectronic elements, the conductive interconnects including:
first conductive interconnects configured to carry address information and including first and second sets of interconnects disposed on respective first and second opposite sides of a theoretical plane normal to the lower package face, signal assignments of the first set of interconnects having 180° rotational symmetry about a theoretical rotational axis of the microelectronic package with signal assignments of the second set of interconnects, the rotational axis being normal to the lower package face and extending in the theoretical plane; and
second conductive interconnects configured to carry data information to and from one of the microelectronic elements and including third and fourth sets of interconnects disposed on the respective first and second sides of the theoretical plane, the position of each second conductive interconnect having 180° rotational symmetry about the rotational axis with a position of a corresponding no-connect conductive interconnect that is electrically insulated from the microelectronic elements within the microelectronic package.

### Claim 2 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the lower package face has corners located at intersections between adjacent ones of the peripheral package edges, the lower package face defining a center at an intersection between a first line extending between a first opposite pair of the corners and a second line extending between a second opposite pair of the corners, and wherein the rotational axis intersects a location at or near the center the lower package face.

### Claim 3 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the element faces of the microelectronic elements are spaced apart from one another in a direction of the single plane to define a central region between adjacent edges of the microelectronic elements and peripheral regions between peripheral edges of the element faces and respective adjacent peripheral package edges, the first conductive interconnects being aligned with the central region.

### Claim 4 (depends on 3)

The microelectronic package as claimed in claim 3, wherein the second conductive interconnects are aligned with at least one of the peripheral regions.

### Claim 5 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the at least some of the first conductive interconnects are configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array of at least one of the microelectronic elements.

### Claim 6 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the first conductive interconnects are configured to carry all of the address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.

### Claim 7 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the first conductive interconnects are configured to carry address information and command information.

### Claim 8 (depends on 1)

The microelectronic package as claimed in claim 1, wherein a dielectric layer is formed on surfaces of the microelectronic elements, the microelectronic package further comprising traces formed on the dielectric layer and connected with the contacts of the microelectronic elements and the first and second conductive interconnects.

### Claim 9 (depends on 1)

The microelectronic package as claimed in claim 1, wherein the traces include first and second traces, the first traces extending in a first direction perpendicular to the first axis between the contacts of the microelectronic elements and the first conductive interconnects, and the second traces extending in a second direction parallel to the first axis between the contacts of the microelectronic elements and the second conductive interconnects.

### Claim 10 (depends on 1)

The microelectronic package as claimed in claim 1, further comprising a substrate, and a surface of a dielectric layer that defines one of the upper package face or the lower package face is a first surface of the substrate.

### Claim 11 (depends on 10)

The microelectronic package as claimed in claim 10, wherein the substrate has at least one aperture extending through a thickness thereof, and wherein the contacts of one or more of the microelectronic elements are aligned with the at least one aperture and electrically connected with substrate contacts at the first surface of the substrate by a plurality of leads.

### Claim 12 (depends on 11)

The microelectronic package as claimed in claim 11, wherein at least some of the leads include wire bonds extending through the at least one aperture.

### Claim 13 (depends on 1)

The microelectronic package as claimed in claim 1, further comprising a heat spreader in thermal communication with at least one of the microelectronic elements.

### Claim 14 (depends on 1)

The microelectronic package as claimed in claim 1, further comprising third and fourth microelectronic elements each having memory storage array function, element faces of the first, second, third, and fourth microelectronic elements arranged in the single plane parallel to the lower package face, the third and fourth microelectronic elements each having contacts at the respective element face.

### Claim 15 (depends on 14)

The microelectronic package as claimed in claim 14, wherein the theoretical plane is a first theoretical plane, the microelectronic package defining a second theoretical plane normal to the lower package face and the first theoretical plane, the microelectronic package further comprising third conductive interconnects configured to carry chip select information to and from the microelectronic elements, and
wherein signal assignments of the first conductive interconnects and the third conductive interconnects on the first side of the first theoretical plane are a mirror image of the signal assignments of the first conductive interconnects on the second side of the first theoretical plane, and signal assignments of the first conductive interconnects and the third conductive interconnects on a first side of the second theoretical plane are a mirror image of the signal assignments of the first conductive interconnects on a second side of the second theoretical plane opposite the first side of the second theoretical plane.

### Claim 16 (depends on 1)

The microelectronic package as claimed in claim 1, further comprising third conductive interconnects configured to carry chip select information to and from the microelectronic elements and including fifth and sixth sets of interconnects disposed on the respective first and second sides of the theoretical plane,
the position of each third conductive interconnect of one of the fifth or sixth sets of interconnects having 180° rotational symmetry about the rotational axis with a position of a corresponding third conductive interconnect of the other of the fifth or sixth sets of interconnects.

### Claim 17 (depends on 16)

A stacked microelectronic assembly including first and second identical microelectronic packages each as claimed in claim 16, wherein the first microelectronic package has the same rotational orientation about its rotational axis relative to the second microelectronic package, such that
each of the first, second, and third conductive interconnects of the first microelectronic package overlies and is electrically connected with a corresponding one of the respective first, second, and third conductive interconnects of the second microelectronic package having the same signal assignment, and
each no-connect conductive interconnect of the first microelectronic package overlies and is electrically connected with a no-connect conductive interconnect of the second microelectronic package.

### Claim 18 (depends on 16)

A stacked microelectronic assembly including first and second identical microelectronic packages each as claimed in claim 16, wherein the first microelectronic package is rotated about its rotational axis by 180° relative to the second microelectronic package, such that
each of the first and third conductive interconnects of the first microelectronic package overlies and is electrically connected with a corresponding one of the respective first and third conductive interconnects of the second microelectronic package having the same signal assignment, and
each second conductive interconnect of the first microelectronic package overlies and is electrically connected with a no-connect conductive interconnect of the second microelectronic package, and each second conductive interconnect of the second microelectronic package underlies and is electrically connected with a no-connect conductive interconnect of the first microelectronic package.

### Claim 19 (depends on 18)

A stacked microelectronic component including first and second stacked microelectronic assemblies each as claimed in claim 18, the rotational axis of each of the microelectronic packages being coincident with one another,
wherein the first and second conductive interconnects of the first microelectronic package of the first stacked microelectronic assembly have identical locations and signal assignments as the first microelectronic package of the second stacked microelectronic assembly, and the first and second conductive interconnects of the second microelectronic package of the first stacked microelectronic assembly have identical locations and signal assignments as the second microelectronic package of the second stacked microelectronic assembly, and
wherein each third conductive interconnect of each microelectronic package of the first microelectronic assembly is electrically connected with a no-connect conductive interconnect of each microelectronic package of the second microelectronic assembly, and each third conductive interconnect of each microelectronic package of the second microelectronic assembly is electrically connected with a no-connect conductive interconnect of each microelectronic package of the second microelectronic assembly.

### Claim 20 (depends on 18)

The microelectronic assembly as claimed in claim 18, further comprising at least one passive element electrically connected to the first microelectronic package.

### Claim 21 (depends on 20)

The microelectronic assembly as claimed in claim 20, wherein the at least one passive element includes at least one decoupling capacitor.

### Claim 22 (depends on 18)

The microelectronic assembly as claimed in claim 18, further comprising a circuit panel having plurality of panel contacts at a panel face thereof and at least one of: a decoupling capacitor, a termination resistor, or a driving element thereon, and wherein at least at least some of the upper terminals of the first microelectronic package are joined to the panel contacts.

### Claim 23 (depends on 18)

The microelectronic assembly as claimed in claim 18, further comprising a circuit panel having a plurality of panel contacts at a panel face thereof, wherein at least some of the lower terminals of the second microelectronic package are joined to the panel contacts.

### Claim 24 (depends on 23)

The microelectronic assembly as claimed in claim 23, wherein the panel contacts are electrically connected with the microelectronic elements of the first microelectronic package through the conductive interconnects of the second microelectronic package.

### Claim 25 (depends on 18)

The microelectronic assembly as claimed in claim 18, further comprising a device electrically connected to the first conductive interconnects of the first and second microelectronic packages, the device operable to drive the address information to the contacts of the microelectronic elements of the first and second microelectronic packages.

### Claim 26

A system comprising a microelectronic assembly as claimed 18 and one or more other electronic components electrically connected to the microelectronic assembly.

### Claim 27 (depends on 26)

The system as claimed in claim 26, further comprising a housing, the microelectronic assembly and the one or more other electronic components being assembled with the housing.