# US 8,786,065 B2 · Substrate, light emitting device and method for manufacturing substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,786,065 B2 - Document ID: US8786065B2 - Status: Granted - Kind: B2 - Application number: 13/667,540 - Filed: 2012-11-02 - Published: 2013-05-09 - Granted: 2014-07-22 - Earliest claimed: 2011-11-07 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Yasuyuki Kimura; Tadashi Arai; Tsuyoshi Kobayashi; Toshiyuki Okabe - Web page: https://patentgrep.com/patent/US8786065B2 ## CPC - H10H 20/8582: {characterised by their shape} - H10W 90/00: Package configurations - H10H 20/8506: {Containers} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8585: {being an interconnection} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other. ## Claims ### Claim 1 A substrate comprising: a first lead frame including a heat sink and a plurality of electrodes for external connection; a second lead frame laminated on the first lead frame and including a plurality of wirings for mounting light emitting elements; and a resin layer filled between the first lead frame and the second lead frame, wherein the plurality of wirings are arranged above the heat sink, the plurality of electrodes and part of the plurality of wirings are joined with each other, the plurality of wirings of the second lead frame includes: a plurality of first wirings including connecting portions with the light emitting elements; and a pair of second wirings including connecting portions with the electrodes and the light emitting elements, the plurality of first wirings are arranged adjacent to one another in parallel between the pair of second wirings, upper surfaces of the first wirings and upper surfaces of the second wirings serve as mounting portions for the light emitting elements, and lower surfaces of the second wirings serve as connecting portions with the electrodes. ### Claim 2 (depends on 1) The substrate according to claim 1, wherein the resin layer is filled between the first lead frame and the second lead frame, between the first wirings, between the second wirings, between the first wirings and the second wirings, and between the heat sink and the electrodes, the upper surfaces of the first wirings and the upper surfaces of the second wirings are exposed from an upper surface of the resin layer, and lower surfaces of the electrodes and a lower surface of the heat sink are exposed from a lower surface of the resin layer. ### Claim 3 (depends on 1) The substrate according to claim 1, wherein the resin layer includes an upper surface flush with the upper surfaces of the first wirings and the upper surfaces of the second wirings, and a lower surface flush with lower surfaces of the electrodes and a lower surface of the heat sink. ### Claim 4 (depends on 1) The substrate according to claim 1, wherein the first lead frame includes: a pair of the electrodes; and the heat sink arranged between the pair of electrodes, upper surfaces of the electrodes serve as connecting portions with the lower surfaces of the second wirings, and lower surfaces of the electrodes exposed from a lower surface of the resin layer serve as connecting portions with an external substrate. ### Claim 5 (depends on 1) The substrate according to claim 1, further comprising an insulating layer formed between the first wirings that are not joined with the electrodes and the heat sink, wherein the heat sink is arranged between the electrodes, and the resin layer is also filled between the heat sink and the electrodes. ### Claim 6 (depends on 1) The substrate according to claim 1, wherein the second lead frame includes a frame portion that surrounds the first wirings and the second wirings, and the resin layer is also filled between the frame portion and the electrodes. ### Claim 7 (depends on 1) The substrate according to claim 1, further comprising: a first metal layer that forms lower surfaces of the electrodes exposed from a lower surface of the resin layer; and a second metal layer that forms the upper surfaces of the first wirings and the upper surfaces of the second wirings exposed from an upper surface of the resin layer. ### Claim 8 (depends on 1) The substrate according to claim 1, wherein the resin layer is a molded resin. ### Claim 9 A light emitting device comprising: a first lead frame including a heat sink and a plurality of electrodes for external connection; a second lead frame laminated on the first lead frame and including a plurality of wirings; a resin layer filled between the first lead frame and the second lead frame; light emitting elements mounted on the wirings; and an encapsulating resin formed to encapsulate the light emitting elements, wherein the plurality of wirings is arranged above the heat sink, the plurality of electrodes and part of the plurality of wirings are joined with each other, the plurality of wirings of the second lead frame includes: a plurality of first wirings including connecting portions with the light emitting elements; and a pair of second wirings including connecting portions with the electrodes and the light emitting elements, the plurality of first wirings are arranged adjacent to one another in parallel between the pair of second wirings, upper surfaces of the first wirings and upper surfaces of the second wirings serve as mounting portions for the light emitting elements, and lower surfaces of the second wirings serve as connecting portions with the electrodes. ### Claim 10 A substrate comprising: a first lead frame including a heat sink and a plurality of electrodes for external connection; a second lead frame laminated on the first lead frame and including a plurality of wirings for mounting light emitting elements; a resin layer filled between the first lead frame and the second lead frame; a first metal layer that forms lower surfaces of the electrodes exposed from a lower surface of the resin layer; and a second metal layer that forms upper surfaces of the wirings exposed from an upper surface of the resin layer, wherein the plurality of wirings are arranged above the heat sink, and the plurality of electrodes and part of the plurality of wirings are joined with each other. ### Claim 11 (depends on 10) The substrate according to claim 10, wherein the resin layer is filled between the first lead frame and the second lead frame, between the wirings, and between the heat sink and the electrodes, the upper surfaces of the wirings are exposed from the upper surface of the resin layer, and the lower surfaces of the electrodes and a lower surface of the heat sink are exposed from the lower surface of the resin layer. ### Claim 12 (depends on 10) The substrate according to claim 10, wherein the upper surface of the resin layer is flush with the upper surfaces of the wirings, and the lower surface of the resin layer is flush with the lower surfaces of the electrodes and a lower surface of the heat sink. ### Claim 13 (depends on 10) The substrate according to claim 10, wherein the first lead frame includes: a pair of the electrodes; and the heat sink arranged between the pair of electrodes, upper surfaces of the electrodes serve as connecting portions with the part of the plurality of wirings, and the lower surfaces of the electrodes exposed from the lower surface of the resin layer serve as connecting portions with an external substrate. ### Claim 14 (depends on 10) The substrate according to claim 10, further comprising an insulating layer formed between the other part of the plurality of wirings that is not joined with the electrodes and the heat sink, wherein the heat sink is arranged between the electrodes, and the resin layer is also filled between the heat sink and the electrodes. ### Claim 15 (depends on 10) The substrate according to claim 10, wherein the second lead frame includes a frame portion that surrounds the wirings, and the resin layer is also filled between the frame portion and the electrodes. ### Claim 16 (depends on 10) The substrate according to claim 10, wherein the resin layer is a molded resin. ### Claim 17 A light emitting device comprising: a first lead frame including a heat sink and a plurality of electrodes for external connection; a second lead frame laminated on the first lead frame and including a plurality of wirings; a resin layer filled between the first lead frame and the second lead frame; light emitting elements mounted on the wirings; an encapsulating resin formed to encapsulate the light emitting elements; a first metal layer that forms lower surfaces of the electrodes exposed from a lower surface of the resin layer; and a second metal layer that forms upper surfaces of the wirings exposed from an upper surface of the resin layer, wherein the plurality of wirings are arranged above the heat sink, and the plurality of electrodes and part of the plurality of wirings are joined with each other.