# US 8,786,063 B2 · Integrated circuit packaging system with leads and transposer and method of manufacture thereof

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- Number: US 8,786,063 B2
- Document ID: US8786063B2
- Status: Granted
- Kind: B2
- Application number: 12/467,146
- Filed: 2009-05-15
- Published: 2010-11-18
- Granted: 2014-07-22
- Earliest claimed: 2009-05-15
- Assignees: STATS ChipPAC, Ltd.
- Applicants: Zigmund Ramirez Camacho; Henry Descalzo Bathan; Arnel Senosa Trasporto
- Inventors: Zigmund Ramirez Camacho; Henry Descalzo Bathan; Arnel Senosa Trasporto
- Web page: https://patentgrep.com/patent/US8786063B2

## CPC

- H10W 70/468: {Circuit boards}
- H10W 70/415: {Leadframe inner leads serving as die pads}
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/07554: {changes in dispositions}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of manufacture of an integrated circuit packaging system includes: conductively bonding a first surface of a transposer to an inner end of a lead separate from the transposer; conductively bonding a die to the first surface of the transposer; and encapsulating the inner end with a mold compound having a bottom mold surface that is exposed and is coplanar with a surface of the transposer opposite the first surface.

## Claims

### Claim 1

An integrated circuit packaging system comprising:
a transposer;
an adhesive pad attached to the transposer, the adhesive pad in a form of a continuous ring;
a lead having an inner end wire bonded to a first surface of the transposer, the inner end attached to the adhesive pad;
a die conductively bonded to the first surface of the transposer, the die and the adhesive pad attached to the first surface; and
a mold compound encapsulating the inner end, the mold compound having a bottom mold surface exposed and coplanar with a surface of the transposer opposite the first surface.

### Claim 2 (depends on 1)

The system as claimed in claim 1 wherein the mold compound has the bottom mold surface coplanar with an outer end of the lead.

### Claim 3 (depends on 1)

The system as claimed in claim 1 wherein the transposer has a terminal pad on the surface opposite the first surface.

### Claim 4 (depends on 1)

The system as claimed in claim 1 further comprising:
a die pad attached to the die and also attached to the first surface of the transposer.

### Claim 5 (depends on 1)

The system as claimed in claim 1 further comprising:
a multiplicity of die pads attached to the first surface of the transposer.

### Claim 6 (depends on 1)

The system as claimed in claim 1 further comprising:
a tiebar connected to the transposer.

### Claim 7 (depends on 6)

The system as claimed in claim 6 further comprising:
a rivet riveting a tiebar contact pad of the tiebar to the transposer.

### Claim 8 (depends on 6)

The system as claimed in claim 6 further comprising:
a passive device attached to the first surface of the transposer.

### Claim 9 (depends on 6)

The system as claimed in claim 6 wherein the transposer is a substrate transposer having a ring shape and surrounding the die.

### Claim 10 (depends on 6)

The system as claimed in claim 6 wherein the transposer is a substrate transposer having a recessed center portion and a die pad is attached to the recessed center portion.