# US 8,786,041 B2 · Solid-state imaging apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,786,041 B2 - Document ID: US8786041B2 - Status: Granted - Kind: B2 - Application number: 13/357,883 - Filed: 2012-01-25 - Published: 2012-08-23 - Granted: 2014-07-22 - Earliest claimed: 2011-02-18 - Assignees: Sony Corporation - Applicants: Toshiaki Iwafuchi; Masahiko Shimizu; Hirotaka Kobayashi - Inventors: Toshiaki Iwafuchi; Masahiko Shimizu; Hirotaka Kobayashi - Web page: https://patentgrep.com/patent/US8786041B2 ## CPC - H10F 39/8057: {Optical shielding} - G02B 5/208: {for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation} - G02B 27/0018: {with means for preventing ghost images (anti-reflection coatings G02B1/11)} - H10F 39/024: {of coatings or optical elements} - H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors - H10F 39/184: {Infrared image sensors} - H10F 39/804: {Containers or encapsulations} - H10F 39/805: {Coatings} - H10F 39/8053: {Colour filters} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10F 39/8063: {Microlenses} - H10F 39/8067: {Reflectors} - H10F 39/811: {Interconnections} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5522: {comprising gold [Au]} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member. ## Claims ### Claim 1 A solid-state imaging apparatus comprising: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member. ### Claim 2 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the angle made between the edge surface of the light shielding member and the optical axis direction of the lens is larger than the incident angle of light whose incident angle is the largest of light incident on the edge portion of the light shielding member. ### Claim 3 (depends on 2) The solid-state imaging apparatus according to claim 2, wherein pads to which metal wires connected to a substrate are connected are provided at an peripheral portion of a light receiving surface of the solid-state imaging device, and the pads are not arranged on an area closer to the light receiving surface in areas defined by an intersection between a surface of the solid-state imaging device and a virtual extension surface of the edge surface of the light shielding member. ### Claim 4 (depends on 2) The solid-state imaging apparatus according to claim 2, wherein the light receiving surface of the solid-state imaging device receives light incident from an opening of a substrate having the opening, and an edge surface of the opening does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 5 (depends on 2) The solid-state imaging apparatus according to claim 2, further comprising: a sealing member sealing a gap on the light receiving surface of the solid-state imaging device, wherein the light shielding member is provided on a surface of the sealing member facing the lens or a surface thereof facing the solid-state imaging device. ### Claim 6 (depends on 5) The solid-state imaging apparatus according to claim 5, wherein a side surface of the sealing member does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 7 (depends on 5) The solid-state imaging apparatus according to claim 5, wherein the sealing member is made of transparent materials transmitting light. ### Claim 8 (depends on 7) The solid-state imaging apparatus according to claim 7, wherein the sealing member is made of glass or resin. ### Claim 9 (depends on 2) The solid-state imaging apparatus according to claim 2, wherein the light shielding member is formed by printing a material for printing on an optical filter arranged on an optical path once or plural times. ### Claim 10 (depends on 2) The solid-state imaging apparatus according to claim 2, further comprising; an optical member arranged on an optical path between the lens and the solid-state image device, wherein the light shielding member is bonded to a surface of the optical member facing the solid-state imaging device. ### Claim 11 (depends on 10) The solid-state imaging apparatus according to claim 10, wherein the optical member is an infrared ray cut filter. ### Claim 12 (depends on 10) The solid-state imaging apparatus according to claim 10, further comprising: a bonding pad arranged on a peripheral portion of the solid-state imaging device excluding a light receiving surface, wherein the solid-state imaging apparatus is configured to satisfy the following expressions: θM>arctan [ tan θU+{(D−2σ)/G], wherein θM is the angle made between the edge surface of the light shielding member and the optical axis, θU is an incident angle of an upper ray, D is a distance between the edge portion of the light receiving surface and the bonding pad, σ is a deviation from a position in design of the light shielding member, and G is a gap length between the optical member and the solid-state imaging device. ### Claim 13 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the angle made between the edge surface of the light shielding member and the optical axis is 50 degrees. ### Claim 14 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the light shielding member is made of an antireflection film. ### Claim 15 (depends on 14) The solid-state imaging apparatus according to claim 14, wherein the light shielding member has UV curability or heat curability. ### Claim 16 (depends on 15) The solid-state imaging apparatus according to claim 15, wherein the light shielding member is made of a material selected from the group consisting of a carbon filler, epoxy resin or acrylic resin colored black with dye and an epoxy/acrylic hybrid resin. ### Claim 17 (depends on 9) The solid-state imaging apparatus according to claim 9, wherein the light shielding member is colored black. ### Claim 18 A solid-state imaging apparatus comprising: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from lens, wherein the light shielding member has an opening, a first size of the opening facing the solid-state imaging device is greater than a second size of the opening facing the lens, and wherein an edge surface of the opening of the light shielding member forms an angle with respect to an optical axis direction of the lens. ### Claim 19 (depends on 18) The solid-state imaging apparatus according to claim 18, wherein the angle made between the edge surface of the light shielding member and the optical axis direction of the lens is larger than the incident angle of light whose incident angle is the largest of light incident on the edge portion of the light shielding member. ### Claim 20 (depends on 19) The solid-state imaging apparatus according to claim 19, wherein pads to which metal wires connected to a substrate are connected are provided at an peripheral portion of a light receiving surface of the solid-state imaging device, and wherein the pads are not arranged on an area closer to the light receiving surface in areas defined by an intersection between a surface of the solid-state imaging device and a virtual extension surface of the edge surface of the light shielding member. ### Claim 21 (depends on 19) The solid-state imaging apparatus according to claim 19, wherein the light receiving surface of the solid-state imaging device receives light incident from an opening of a substrate having the opening, and an edge surface of the opening does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 22 (depends on 19) The solid-state imaging apparatus according to claim 19, further comprising: a sealing member sealing a gap on the light receiving surface of the solid-state imaging device, wherein the light shielding member is provided on a surface of the sealing member facing the lens or a surface thereof facing the solid-state imaging device. ### Claim 23 (depends on 22) The solid-state imaging apparatus according to claim 22, wherein a side surface of the sealing member does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 24 (depends on 19) The solid-state imaging apparatus according to claim 19, wherein the light shielding member is formed by printing a material for printing on an optical filter arranged on an optical path once or plural times. ### Claim 25 (depends on 18) The solid-state imaging apparatus according to claim 18, wherein the angle made between the edge surface of the light shielding member and the optical axis is 50 degrees. ### Claim 26 (depends on 18) The solid-state imaging apparatus according to claim 18, wherein the light shielding member is made of an antireflection film. ### Claim 27 (depends on 26) The solid-state imaging apparatus according to claim 26, wherein the light shielding member is colored black. ### Claim 28 (depends on 26) The solid-state imaging apparatus according to claim 26, wherein the light shielding member has UV curability or heat curability. ### Claim 29 (depends on 28) The solid-state imaging apparatus according to claim 28, wherein the light shielding member is made of a material selected from the group consisting of a carbon filler, epoxy resin or acrylic resin colored black with dye and an epoxy/acrylic hybrid resin. ### Claim 30 (depends on 19) The solid-state imaging apparatus according to claim 19, further comprising; an optical member arranged on an optical path between the lens and the solid-state image device, wherein the light shielding member is bonded to a surface of the optical member facing the solid-state imaging device. ### Claim 31 (depends on 30) The solid-state imaging apparatus according to claim 30, wherein the optical member is an infrared ray cut filter. ### Claim 32 (depends on 30) The solid-state imaging apparatus according to claim 30, further comprising: a bonding pad arranged on a peripheral portion of the solid-state imaging device excluding a light receiving surface, wherein the solid-state imaging apparatus is configured to satisfy the following expressions: θM>arctan [ tan θU+{(D−2σ)/G], wherein θM is the angle made between the edge surface of the light shielding member and the optical axis, θU is an incident angle of an upper ray, D is a distance between the edge portion of the light receiving surface and the bonding pad, σ is a deviation from a position in design of the light shielding member, and G is a gap length between the optical member and the solid-state imaging device. ### Claim 33 (depends on 22) The solid-state imaging apparatus according to claim 22, wherein the sealing member is made of transparent materials transmitting light. ### Claim 34 (depends on 33) The solid-state imaging apparatus according to claim 33, wherein the sealing member is made of glass or resin. ### Claim 35 A solid-state imaging apparatus comprising: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein the light shielding member has an opening, wherein a portion of the light shielding member is folded at an angle in a direction of the solid-state imaging device, and wherein the portion of the light shielding member extends a given distance from an edge of the opening of the light shielding member. ### Claim 36 (depends on 35) The solid-state imaging apparatus according to claim 35, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member. ### Claim 37 (depends on 36) The solid-state imaging apparatus according to claim 36, wherein the angle made between the edge surface of the light shielding member and the optical axis direction of the lens is larger than the incident angle of light whose incident angle is the largest of light incident on the edge portion of the light shielding member. ### Claim 38 (depends on 37) The solid-state imaging apparatus according to claim 37, wherein pads to which metal wires connected to a substrate are connected, are provided at an peripheral portion of a light receiving surface of the solid-state imaging device, and the pads are not arranged on an area closer to the light receiving surface in areas defined by an intersection between a surface of the solid-state imaging device and a virtual extension surface of the edge surface of the light shielding member. ### Claim 39 (depends on 37) The solid-state imaging apparatus according to claim 37, wherein the light receiving surface of the solid-state imaging device receives light incident from an opening of a substrate having the opening, and an edge surface of the opening does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 40 (depends on 37) The solid-state imaging apparatus according to claim 37, further comprising: a sealing member sealing a gap on the light receiving surface of the solid-state imaging device, wherein the light shielding member is provided on a surface of the sealing member facing the lens or a surface thereof facing the solid-state imaging device. ### Claim 41 (depends on 40) The solid-state imaging apparatus according to claim 40, wherein a side surface of the sealing member does not intersect the virtual extension surface of the edge surface of the light shielding member. ### Claim 42 (depends on 37) The solid-state imaging apparatus according to claim 37, wherein the light shielding member is formed by printing a material for printing on an optical filter arranged on an optical path once or plural times. ### Claim 43 (depends on 36) The solid-state imaging apparatus according to claim 36, wherein the angle made between the edge surface of the light shielding member and the optical axis is 50 degrees. ### Claim 44 (depends on 35) The solid-state imaging apparatus according to claim 35, wherein the light shielding member is made of an antireflection film. ### Claim 45 (depends on 44) The solid-state imaging apparatus according to claim 44, wherein the light shielding member has UV curability or heat curability. ### Claim 46 (depends on 45) The solid-state imaging apparatus according to claim 45, wherein the light shielding member is made of a material selected from the group consisting of a carbon filler, epoxy resin or acrylic resin colored black with dye and an epoxy/acrylic hybrid resin. ### Claim 47 (depends on 37) The solid-state imaging apparatus according to claim 37, further comprising; an optical member arranged on an optical path between the lens and the solid-state image device, wherein the light shielding member is bonded to a surface of the optical member facing the solid-state imaging device. ### Claim 48 (depends on 47) The solid-state imaging apparatus according to claim 47, wherein the optical member is an infrared ray cut filter. ### Claim 49 (depends on 47) The solid-state imaging apparatus according to claim 47, further comprising: a bonding pad arranged on a peripheral portion of the solid-state imaging device excluding a light receiving surface, wherein the solid-state imaging apparatus is configured to satisfy the following expressions: θM>arctan [ tan θU+{(D−2σ)/G], wherein θM is the angle made between the edge surface of the light shielding member and the optical axis, θU is an incident angle of an upper ray, D is a distance between the edge portion of the light receiving surface and the bonding pad, σ is a deviation from a position in design of the light shielding member, and G is a gap length between the optical member and the solid-state imaging device. ### Claim 50 (depends on 40) The solid-state imaging apparatus according to claim 40, wherein the sealing member is made of transparent materials transmitting light. ### Claim 51 (depends on 50) The solid-state imaging apparatus according to claim 50, wherein the sealing member is made of glass or resin.