# US 8,785,962 B2 · Semiconductor light emitting device having current blocking layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,962 B2 - Document ID: US8785962B2 - Status: Granted - Kind: B2 - Application number: 13/481,463 - Filed: 2012-05-25 - Published: 2012-11-29 - Granted: 2014-07-22 - Earliest claimed: 2011-05-27 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Wan Ho Lee - Inventors: Wan Ho Lee - Web page: https://patentgrep.com/patent/US8785962B2 ## CPC - H10H 20/8316: {Multi-layer electrodes comprising at least one discontinuous layer} - H10H 20/816: having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract There is provided a semiconductor light emitting device including: a semiconductor light emitting laminate including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed therebetween; a first electrode having at least one bonding pad formed on a portion of an upper surface of the first conductive semiconductor layer; a second electrode having an ohmic contact layer formed on the second conductive semiconductor layer; and a current blocking layer between the second conductive semiconductor layer and the ohmic contact layer having a plurality of patterns formed thereon, the plurality of patterns being arrayed such that intervals between patterns adjacent to a region overlapped with the bonding pad are smaller an interval between patterns of another regions. ## Claims ### Claim 1 A semiconductor light emitting device, comprising: a semiconductor light emitting laminate including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed therebetween; a first electrode having at least one bonding pad disposed on a portion of an upper surface of the first conductive semiconductor layer; a second electrode having an ohmic contact layer disposed on the second conductive semiconductor layer; and a current blocking layer disposed between the second conductive semiconductor layer and the ohmic contact layer and having a plurality of patterns formed thereon, the plurality of patterns being arrayed such that intervals between the plurality of patterns become smaller toward a region overlapped with the bonding pad, wherein the current blocking layer includes an electrically insulating material or damaged crystals disposed on the second conductive semiconductor layer. ### Claim 2 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first electrode is disposed on the first conductive semiconductor layer and further includes a plurality of electrode branches extending from the bonding pad. ### Claim 3 (depends on 2) The semiconductor light emitting device of claim 2, wherein the plurality of electrode branches are arrayed in parallel in a direction in which the plurality of patterns are arrayed. ### Claim 4 (depends on 3) The semiconductor light emitting device of claim 3, wherein the intervals between the plurality of patterns become larger in a direction away from the region overlapped with the bonding pad. ### Claim 5 (depends on 3) The semiconductor light emitting device of claim 3, wherein the plurality of electrode branches are arrayed to have an identical predetermined interval therebetween. ### Claim 6 (depends on 3) The semiconductor light emitting device of claim 3, wherein the plurality of patterns are formed to be disposed on a region overlapped with the plurality of electrode branches. ### Claim 7 (depends on 1) The semiconductor light emitting device of claim 1, wherein the at least one bonding pad is a plurality of bonding pads formed on different regions of the upper surface of the first conductive semiconductor layer. ### Claim 8 (depends on 7) The semiconductor light emitting device of claim 7, wherein: the plurality of bonding pads are respectively disposed on opposing corners, and the intervals between the plurality of patterns become larger toward a region overlapped with the center of the first conductive semiconductor layer. ### Claim 9 (depends on 1) The semiconductor light emitting device of claim 1, wherein widths of the plurality of patterns become larger toward the region overlapped with the bonding pad. ### Claim 10 (depends on 9) The semiconductor light emitting device of claim 9, wherein the widths of the plurality of patterns become smaller away from the region overlapped with the bonding pad. ### Claim 11 (depends on 1) The semiconductor light emitting device of claim 1, wherein: the current blocking layer includes a region in which the second conductive semiconductor layer has damaged crystals, and the damaged crystals of the second conductive semiconductor layer have a schottky junction with the ohmic contact layer. ### Claim 12 (depends on 1) The semiconductor light emitting device of claim 1, further comprising a conductive substrate provided with the second electrode in order to support the semiconductor light emitting laminate. ### Claim 13 (depends on 12) The semiconductor light emitting device of claim 12, wherein the second electrode further includes a barrier layer disposed between the ohmic contact layer and the conductive substrate. ### Claim 14 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first electrode further includes a transparent electrode layer disposed on the first conductive semiconductor layer, and the bonding pad is disposed on the transparent electrode layer. ### Claim 15 (depends on 14) The semiconductor light emitting device of claim 14, further comprising an additive current blocking layer having a plurality of additional patterns formed between the first conductive semiconductor layer and the transparent electrode layer. ### Claim 16 (depends on 15) The semiconductor light emitting device of claim 15, wherein the plurality of additional patterns are arrayed such that intervals between the plurality of additional patterns become smaller toward the region overlapped with the bonding pad. ### Claim 17 (depends on 16) The semiconductor light emitting device of claim 16, wherein the plurality of additional patterns are disposed on a position not overlapped with the plurality of patterns. ### Claim 18 A semiconductor light emitting device, comprising: a semiconductor light emitting laminate including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed therebetween; a first electrode having a transparent electrode layer disposed on an upper surface of the first conductive semiconductor layer, and at least one bonding pad disposed on a portion of the transparent electrode layer; a second electrode having an ohmic contact layer disposed on the second conductive semiconductor layer; and a current blocking layer disposed between the first conductive semiconductor layer and the transparent electrode layer and having a plurality of patterns disposed thereon, the plurality of patterns being arrayed such that intervals between the plurality of patterns become smaller toward a region overlapped with the bonding pad, wherein the current blocking layer includes an electrically insulating material or damaged crystals disposed on the second conductive semiconductor layer. ### Claim 19 (depends on 18) The semiconductor light emitting device of claim 18, wherein intervals between the plurality of patterns become larger in a direction away from the region overlapped with the bonding pad. ### Claim 20 (depends on 19) The semiconductor light emitting device of claim 19, wherein the at least one bonding pad is a plurality of bonding pads disposed on different regions of the upper surface of the transparent electrode layer. ### Claim 21 (depends on 20) The semiconductor light emitting device of claim 20, wherein: the plurality of bonding pads are respectively disposed on opposing corners, and the intervals between the plurality of patterns become larger toward the center of the first conductive semiconductor layer. ### Claim 22 (depends on 18) The semiconductor light emitting device of claim 18, wherein widths of the plurality of patterns become larger toward the region overlapped with the bonding. ### Claim 23 (depends on 22) The semiconductor light emitting device of claim 22, wherein the widths of the plurality of patterns become smaller away from the region overlapped with the bonding pad. ### Claim 24 (depends on 18) The semiconductor light emitting device of claim 18, further comprising a conductive substrate provided with the second electrode in order to support the semiconductor light emitting laminate. ### Claim 25 (depends on 24) The semiconductor light emitting device of claim 24, wherein the second electrode further includes a barrier layer disposed between the ohmic contact layer and the conductive substrate.