# US 8,785,953 B2 · Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,953 B2 - Document ID: US8785953B2 - Status: Granted - Kind: B2 - Application number: 13/428,726 - Filed: 2012-03-23 - Published: 2012-09-27 - Granted: 2014-07-22 - Earliest claimed: 2011-03-25 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Hak Hwan Kim; Min Jung Kim; Kyung Mi Moon; Jong Sup Song; Jae Sung You; Ill Heoung Choi; Cheol Jun Yoo - Inventors: Hak Hwan Kim; Min Jung Kim; Kyung Mi Moon; Jong Sup Song; Jae Sung You; Ill Heoung Choi; Cheol Jun Yoo - Web page: https://patentgrep.com/patent/US8785953B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/0361: {of wavelength conversion means} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/682: {comprising holes having chips therein} - H10W 72/0198: {batch processes} - H10W 72/073: {of die-attach connectors} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/874: {On different surfaces} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/9413: {on encapsulations} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips. ## Claims ### Claim 1 A manufacturing method of a light emitting diode (LED), comprising: manufacturing a plurality of LED chips which are separated from one another; manufacturing a phosphor pre-form comprising a plurality of mounting areas for mounting the plurality of LED chips and a plurality of protruding areas for dividing the plurality of mounting areas; applying adhesive in the phosphor pre-form; mounting each of the plurality of LED chips in a corresponding one of the plurality of mounting areas; and cutting the phosphor pre-form in the plurality of protruding areas for dividing the plurality of mounting areas, into units including individual LED chips, wherein sidewalls of each of the plurality of LED chips are in contact with the corresponding mounting area. ### Claim 2 (depends on 1) The manufacturing method of claim 1, wherein the mounting of each of the plurality of LED chips in a corresponding one of the plurality of mounting areas comprises: bonding a light emission surface of each of the plurality of LED chips having a flip chip structure in the corresponding mounting area. ### Claim 3 (depends on 1) The manufacturing method of claim 1, wherein the manufacturing of the plurality of LED chips comprises: forming a first bump having a first size on at least one electrode disposed on one surface of each of the plurality of LED chips. ### Claim 4 (depends on 3) The manufacturing method of claim 3, wherein the manufacturing of the phosphor pre-form comprises: forming a bump receiving portion in a position corresponding to the first bump on a bottom surface of each of the plurality of mounting areas. ### Claim 5 (depends on 4) The manufacturing method of claim 4, wherein the mounting of each of the plurality of LED chips in a corresponding one of the plurality of mounting areas is performed such that the first bump is received in the bump receiving portion. ### Claim 6 (depends on 5) The manufacturing method of claim 5, further comprising: polishing the phosphor pre-form such that the bump receiving portion is opened after the mounting of each of the plurality of LED chips in the corresponding mounting area. ### Claim 7 (depends on 6) The manufacturing method of claim 6, further comprising: forming a second bump on the first bump exposed through the bump receiving portion at an outer portion of the phosphor pre-form, the second bump having a second size greater than the first size and a width greater than a width of the bump receiving portion. ### Claim 8 (depends on 1) The manufacturing method of claim 1, wherein the manufacturing of the phosphor pre-form comprises: forming at least one supporter indicating a proper thickness of the adhesive in each of the plurality of mounting areas. ### Claim 9 (depends on 8) The manufacturing method of claim 8, wherein the at least one supporter has a protruding structure in each of the plurality of mounting areas and has a width, a length, and a height in units of μm. ### Claim 10 (depends on 1) The manufacturing method of claim 1, wherein the manufacturing of the phosphor pre-form comprises: manufacturing phosphor resin by mixing phosphor particles with transparent resin; injecting the phosphor resin in a first mold; pressurizing the phosphor resin injected in the first mold by a second mold having a structure corresponding to the phosphor pre-form; partially curing the pressurized phosphor resin; and removing the first mold and the second mold. ### Claim 11 (depends on 1) The manufacturing method of claim 1, wherein each of the plurality of mounting areas includes a recess receiving a corresponding LED chip up to a lateral surface. ### Claim 12 A light emitting diode (LED), comprising: a phosphor sheet comprising a mounting area and a plurality of supporters protruding from a bottom surface of the mounting area; and an LED chip supported by the plurality of supporters such that a light emission surface of the LED chip is bonded to an inside of the mounting area with adhesive filled in the phosphor sheet at a height not exceeding a height of the plurality of supporters, wherein sidewalls of the LED chip are in contact with the mounting area. ### Claim 13 (depends on 12) The LED of claim 12, wherein the LED chip comprises at least one electrode disposed on the light emission surface and a first bump disposed on the at least one electrode, the first bump having a first size. ### Claim 14 (depends on 13) The LED of claim 13, wherein the phosphor sheet comprises a bump receiving portion to receive the first bump, and the LED chip further comprises a second bump disposed on the first bump exposed through the bump receiving portion, the second bump having a second size greater than the first size. ### Claim 15 (depends on 12) The LED of claim 12, wherein the plurality of supporters have any one of an axial symmetry structure and a point symmetry structure. ### Claim 16 A manufacturing method of a light emitting diode (LED) module, the manufacturing method comprising: manufacturing a plurality of LED chips which are separated from one another; manufacturing a phosphor pre-form comprising a plurality of mounting areas for mounting the plurality of LED chips and a plurality of protruding areas for dividing the plurality of mounting areas; applying adhesive in the phosphor pre-form; mounting each of the plurality of LED chips in a corresponding one of the plurality of mounting areas; cutting the phosphor pre-form in the plurality of protruding areas for dividing the plurality of mounting areas, into units including individual LED chips; and mounting the individual LED chips on a substrate, wherein sidewalls of each of the plurality of LED chips are in contact with the corresponding mounting area. ### Claim 17 (depends on 16) The manufacturing method of claim 16, wherein the mounting of each of the plurality of LED chips in a corresponding one of the plurality of mounting areas comprises: bonding a light emission surface of each of the plurality of LED chips having a flip chip structure in the corresponding mounting area. ### Claim 18 (depends on 16) The manufacturing method of claim 16, wherein the manufacturing of the plurality of LED chips comprises: forming a first bump having a first size on at least one electrode disposed on one surface of each of the plurality of LED chips. ### Claim 19 (depends on 18) The manufacturing method of claim 18, wherein the manufacturing of the phosphor pre-form comprises: forming a bump receiving portion on a bottom surface of each of the plurality of mounting areas in a position corresponding to the first bump. ### Claim 20 (depends on 19) The manufacturing method of claim 19, wherein the mounting of each of the plurality of LED chips in a corresponding one of the plurality of mounting areas comprises: mounting of each of the plurality of LED chips in the corresponding mounting area such that the first bump is received in the bump receiving portion; and polishing the phosphor pre-form such that the bump receiving portion is opened. ### Claim 21 (depends on 20) The manufacturing method of claim 20, further comprising: forming a second bump on the first bump exposed through the bump receiving portion at an outer portion of the phosphor pre-form, the second bump having a second size greater than the first size and a width greater than a width of the bump receiving portion. ### Claim 22 (depends on 16) The manufacturing method of claim 16, wherein each of the plurality of mounting areas includes a recess receiving a corresponding LED chip up to a lateral surface.