# US 8,785,821 B2 · Substrate processing apparatus with heater element held by vacuum

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- Number: US 8,785,821 B2
- Document ID: US8785821B2
- Status: Granted
- Kind: B2
- Application number: 12/823,802
- Filed: 2010-06-25
- Published: 2011-01-06
- Granted: 2014-07-22
- Earliest claimed: 2009-07-06
- Assignees: Sokudo Co., Ltd.
- Applicants: Harald Herchen
- Inventors: Harald Herchen
- Web page: https://patentgrep.com/patent/US8785821B2

## CPC

- H05B 3/283: {the insulating material being an inorganic material, e.g. ceramic}
- H10P 72/0432: {mainly by conduction}
- H10P 72/0434: {mainly by convection}
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A substrate processing apparatus for heating a substrate is provided. The substrate processing apparatus can include a top and bottom planar member. A heater layer can be disposed between the top and the bottom planar member and held in place by evacuating a region between the two planar members. The heater layer can be made of alternating insulating and conducting layers with heater elements formed on the conducting layers in predetermined pattern.

## Claims

### Claim 1

A substrate processing apparatus comprising:
a first planar member;
a second planar member disposed below the first planar member;
an evacuated region between the first planar member and the second planar member, the evacuated region being characterized by vacuum;
a heating layer disposed in the evacuated region, wherein the heating layer is coupled to a lower surface of the first planar member and an upper surface of the second planar member; and
a first cooling member configured to travel in a vertical direction between a lower surface of the second planar member and an upper surface of a second cooling member, the second cooling member being disposed below the first cooling member, wherein an upper surface of the first cooling member is configured to contact the lower surface of the second planar member at a first position and a lower surface of the first cooling member is configured to contact the upper surface of the second cooling member at a second position.

### Claim 2 (depends on 1)

The apparatus of claim 1 wherein the first planar member comprises at least one of aluminum, copper, silicon carbide, aluminum nitride, hexagonal boron nitride, or a copper-tungsten alloy.

### Claim 3 (depends on 2)

The apparatus of claim 2 wherein the copper-tungsten alloy comprises about 10% copper and about 90% tungsten.

### Claim 4 (depends on 1)

The apparatus of claim 1 wherein the second cooling member is fixed and includes one or more cooling channels adapted to accept a cooling fluid.

### Claim 5 (depends on 1)

The apparatus of claim 1 further comprising a plurality of proximity pins disposed on an upper surface of the first planar member.

### Claim 6 (depends on 1)

The apparatus of claim 1 wherein the heating layer comprises a plurality of heating elements arranged in one or more independent zones.