# US 8,785,792 B2 · Case structure having film type electronic circuit and method of manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,785,792 B2
- Document ID: US8785792B2
- Status: Granted
- Kind: B2
- Application number: 13/177,199
- Filed: 2011-07-06
- Published: 2012-01-26
- Granted: 2014-07-22
- Earliest claimed: 2010-07-22
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Ja Myeong Koo; Soon Min Hong; Tae Sang Park; Young Jun Moon; Gyun Heo; Sun Gu Yi
- Inventors: Ja Myeong Koo; Soon Min Hong; Tae Sang Park; Young Jun Moon; Gyun Heo; Sun Gu Yi
- Web page: https://patentgrep.com/patent/US8785792B2

## CPC

- H05K 3/0058: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)}
- B32B 37/1207: {Heat-activated adhesive (B32B37/04 takes precedence)}
- B32B 37/185: {Laminating sheets, panels or inserts between two discrete plastic layers}
- B32B 38/145: {Printing}
- B32B 2037/1223: {film-shaped}
- B32B 2038/0092: {Metallizing}
- B32B 2309/105: Thickness
- B32B 2457/14: Semiconductor wafers
- H05K 2201/0999: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- Y02E 10/542: Dye sensitized solar cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

## Claims

### Claim 1

A case structure of an electronic product comprising:
a case, the case being comprised of a material having a heat-resisting temperature;
a first film adhered to the case, the first film having a first melting temperature;
a second film adhered to the first film such that one surface of the second film contacts the first film; and
an electronic circuit layer between the first film and the second film, the electronic circuit layer being adhered to the first film
wherein the heat-resisting temperature of the case is higher than the first melting temperature.

### Claim 2 (depends on 1)

The case structure according to claim 1, wherein the first film is a hot melt adhesive film.

### Claim 3 (depends on 1)

The case structure according to claim 1, wherein a thickness of the first film is about 100 μm or less.

### Claim 4 (depends on 1)

The case structure according to claim 1, wherein the second film is in a solid state at the first melting temperature.

### Claim 5 (depends on 1)

The case structure according to claim 1, wherein a portion of the electronic circuit layer is exposed through a connection part of the second film.

### Claim 6 (depends on 1)

The case structure according to claim 1, wherein the second film is a thermoplastic resin film having a second melting temperature and the electronic circuit layer is adhered to the first film and the second film.

### Claim 7 (depends on 6)

The case structure according to claim 6, further comprising:
a protective layer adhered to the second film, the protective layer being configured to protect the electronic circuit layer.

### Claim 8

A method for manufacturing a case structure of an electronic product case, comprising:
preparing a case having a heat-resisting temperature;
preparing a first film having a first melting temperature;
forming an electronic circuit layer on the first film;
adhering a second film to the first film such that one surface of the second film contacts the first film, and the electronic circuit layer is between the first film and the second film; and
thermally adhering the first film to the case by heating the first film to a temperature which is higher than the first melting temperature and is lower than a heat-resisting temperature of the case.

### Claim 9 (depends on 8)

The method according to claim 8, wherein forming the electronic circuit layer on the first film includes thermally adhering a metal foil to the first film at the first melting temperature or higher and etching the metal foil to form of a circuit pattern.

### Claim 10 (depends on 8)

The method according to claim 8, wherein forming the electronic circuit layer on the first film includes plating a metal in the form of a circuit pattern on the first film.

### Claim 11 (depends on 8)

The method according to claim 8, wherein forming the electronic circuit layer on the first film includes processing a metal foil in the form of a circuit pattern and thermally adhering the processed metal foil to the first film at the first melting temperature or higher.

### Claim 12 (depends on 8)

The method according to claim 8, wherein the first film is a hot melt adhesive film.

### Claim 13 (depends on 8)

The method according to claim 8, wherein adhering the second film to the first film includes heating the first film to a temperature between the first melting temperature and the heat-resisting temperature.

### Claim 14 (depends on 8)

The method according to claim 8, further comprising:
forming a connection part through at least one of the first and the second films to expose the electronic circuit layer to the outside.

### Claim 15 (depends on 8)

The method according to claim 8, further comprising:
adhering the second film to the electronic circuit layer, wherein the second film is a thermoplastic resin film having a second melting temperature, and adhering the second film to the electronic circuit layer includes thermally adhering the second film to the electronic circuit layer by heating the second film to a temperature that is at or above the second melting temperature.

### Claim 16 (depends on 15)

The method according to claim 15, further comprising:
adhering a protective layer to the second film to protect the second film.

### Claim 17 (depends on 8)

The method according to claim 8, wherein the case, the electronic circuit layer and the second film are adhered to the first film by performing thermal adhesion once.