# US 8,785,791 B2 · Through wiring substrate and manufacturing method thereof

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- Number: US 8,785,791 B2
- Document ID: US8785791B2
- Status: Granted
- Kind: B2
- Application number: 13/344,091
- Filed: 2012-01-05
- Published: 2012-05-03
- Granted: 2014-07-22
- Earliest claimed: 2009-07-06
- Assignees: Fujikura Ltd.
- Applicants: Satoshi Yamamoto; Hirokazu Hashimoto
- Inventors: Satoshi Yamamoto; Hirokazu Hashimoto
- Web page: https://patentgrep.com/patent/US8785791B2

## CPC

- H05K 3/101: {by casting or moulding of conductive material}
- H10W 70/635: {Through-vias}
- H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes}
- H05K 3/4053: {by thick-film techniques}
- H05K 2201/09272: Layout details of angles or corners
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 70/692: Ceramics or glasses
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.

## Claims

### Claim 1

A through wiring substrate comprising:
a substrate having a first face and a second face; and
a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole which penetrates between the first face and the second face
and which has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and has a first liner part extending in a thickness direction of the substrate and a second linear part extending in a direction parallel with the first face of the substrate, wherein:
the outer peripheral part is a quandrant of a circular arc part with a radius of R1, and the inner peripheral part is a quandrant of a circular arc part with a radius of r1;
centers of the quardrant of the outer peripheral part and the quandrant of the inner peripheral part are at the same position; and
a difference between R1 and r1 is equal to a diameter of the through-wire at least in one of the first linear part and the second linear part.

### Claim 2 (depends on 1)

The through wiring substrate according to claim 1, wherein at least one of the outer peripheral part and the inner peripheral part is formed in a circular arc shape with a radius of curvature within a range of 10 μm to 1000 μm in the longitudinal cross-section.

### Claim 3 (depends on 1)

The through wiring substrate according to claim 1, wherein a flow path is formed in the substrate.