# US 8,785,788 B2 · Wiring board with built-in electronic component and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,788 B2 - Document ID: US8785788B2 - Status: Granted - Kind: B2 - Application number: 13/273,532 - Filed: 2011-10-14 - Published: 2012-07-26 - Granted: 2014-07-22 - Earliest claimed: 2011-01-20 - Assignees: Ibiden Co., Ltd. - Applicants: Keisuke Shimizu; Yukinobu Mikado - Inventors: Keisuke Shimizu; Yukinobu Mikado - Web page: https://patentgrep.com/patent/US8785788B2 ## CPC - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/614: {the multiple chips being integrally enclosed} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 2201/09154: Bevelled, chamferred or tapered edge - H05K 2201/09827: Tapered, e.g. tapered hole, via or groove - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - H05K 2201/10015: Non-printed capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2203/063: of preperforated insulating layer - H05K 2203/1469: Circuit made after mounting or encapsulation of the components - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/073: {of die-attach connectors} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - Y10T 29/49133: with component orienting - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface. ## Claims ### Claim 1 A wiring board with a built-in electronic component, comprising: a substrate having an opening portion and having a first surface and a second surface on an opposite side of the first surface; and an electronic component having a third surface and a fourth surface on an opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces a same direction as the first surface of the substrate, wherein the electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate is partially tapered and has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface, and the substrate has a thickness which is larger than a thickness of the electronic component, and the tapered surface is formed from the first surface to a deeper point than the third surface of the electronic component. ### Claim 2 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the opening portion of the substrate has a space formed between the substrate and the electronic component and filled with an insulator. ### Claim 3 (depends on 1) The wiring board with a built-in electronic component according to claim 1, further comprising a resin insulation layer on the substrate and the opening portion, wherein the opening portion of the substrate has a space formed between the substrate and the electronic component and filled with an insulator, and the insulator is made of a resin which forms the insulation layer. ### Claim 4 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the electronic component is a passive component. ### Claim 5 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the electronic component is a chip capacitor. ### Claim 6 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the inner wall of the opening portion is a cut surface formed by a laser. ### Claim 7 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a first layer and a second layer, and the first layer and the second layer are made of different materials. ### Claim 8 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a first layer and a second layer, the first layer and the second layer are made of different resin materials and are formed in an order of the first layer and the second layer from the first surface toward the second surface, the second layer includes a first amount of an inorganic material, and the first layer includes either no inorganic material or a second amount of an inorganic material which is less than the first amount of the inorganic material in the second layer. ### Claim 9 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the electronic component has an electrode having a surface which forms the curved surface of the electronic component. ### Claim 10 (depends on 9) The wiring board with a built-in electronic component according to claim 9, wherein the electronic component has an electrode having a surface which forms the curved surface of the electronic component, and at least the surface of the electrode of the electronic component is made of a plated film. ### Claim 11 (depends on 1) The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer on the substrate and on the electronic component, wherein a via conductor is formed in the insulation layer to be electrically connected to an electrode of the electronic component. ### Claim 12 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the inner wall of the opening portion is a plane substantially perpendicular to the second surface. ### Claim 13 (depends on 1) The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer on the second surface of the substrate, wherein the opening portion is a hole penetrating through the substrate, and the insulation layer covers an opening of the hole. ### Claim 14 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate and the electronic component have a clearance between the substrate and the electronic component, and the clearance has the maximum value in a range of approximately 0 μm to approximately 100 μm. ### Claim 15 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the curved surface has a radius of curvature in a range of approximately 20 μm to approximately 40 μm. ### Claim 16 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a thickness which is larger than a thickness of the electronic component, and the thickness of the substrate and the thickness of the electronic component have a difference of approximately 20 μm or greater. ### Claim 17 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet. ### Claim 18 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, and the metal sheet has a thickness which is approximately 30 μm or greater. ### Claim 19 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the second insulator is made of a material which is different from a material of the first insulator. ### Claim 20 (depends on 1) The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the first insulator has a thermal expansion coefficient which is lower than a thermal expansion coefficient of the second insulator. ### Claim 21 (depends on 1) The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer formed on the substrate and the electronic component, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the first insulator is made of a resin from the insulation layer which extends over the space between the electronic component and the substrate. ### Claim 22 (depends on 1) The wiring board of claim 1, wherein said electronic component includes electrodes on the third surface of the electronic component such that the electrodes face the first surface of the substrate which includes a relatively wider portion of the taper.