# US 8,785,786 B2 · Wiring board and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,786 B2 - Document ID: US8785786B2 - Status: Granted - Kind: B2 - Application number: 13/325,767 - Filed: 2011-12-14 - Published: 2012-06-21 - Granted: 2014-07-22 - Earliest claimed: 2010-12-15 - Assignees: Ngk Spark Plug Co., Ltd. - Applicants: Erina Yamada; Kazunaga Higo; Hironori Sato - Inventors: Erina Yamada; Kazunaga Higo; Hironori Sato - Web page: https://patentgrep.com/patent/US8785786B2 ## CPC - B23K 1/0016: {Soldering of electronic components} - H05K 3/3473: Plating of solder - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/687: {characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - B23K 2101/42: Printed circuits - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 2201/0341: Intermediate metal, e.g. before reinforcing of conductors by plating - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2203/054: Continuous temporary metal layer over resist, e.g. for selective electroplating - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may comprise a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder; the conductor post includes a lower conductor post, which is located within the through-hole and includes an external side surface and a lower end surface, and an upper conductor post, which is located above the lower conductor post and is projected outside the solder resist layer; and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer. ## Claims ### Claim 1 A wiring board comprising: a conductor layer; a solder resist layer comprised of thermosetting resin and laminated on the conductor layer, the solder resist layer defining a through-hole extending through the solder resist layer such that a portion of the conductor layer is located below the through-hole; and a conductor post comprised of tin, copper, or a solder that is electrically connected to the portion of the conductor layer below the through-hole, the conductor post including a lower conductor post and an upper conductor post located above the lower conductor post; wherein the lower conductor post is located within the through-hole and includes an external side surface with an external alloy layer comprised of copper and tin, and a lower end surface with a lower end alloy layer comprised of copper and tin; and wherein the upper conductor post projects outside the solder resist layer and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein the part of the lower end surface of the upper conductor post that is brought into intimate contact with the outer surface of the solder resist layer comprises palladium. ### Claim 3 (depends on 1) The wiring board according to claim 1, wherein a part of the external side surface of the lower conductor post is brought into intimate contact with an internal side surface of the through-hole of the solder resist layer and comprises palladium. ### Claim 4 (depends on 1) The wiring board according to claim 1, wherein at least a part of the lower end surface of the lower conductor post is brought into intimate contact with the conductor layer and comprises nickel and gold. ### Claim 5 (depends on 1) The wiring board according to claim 1, wherein the external alloy layer is thicker than the lower end alloy layer.