# US 8,785,585 B2 · Temporary adhesive composition, and method of producing thin wafer

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- Number: US 8,785,585 B2
- Document ID: US8785585B2
- Status: Granted
- Kind: B2
- Application number: 13/343,930
- Filed: 2012-01-05
- Published: 2012-07-12
- Granted: 2014-07-22
- Earliest claimed: 2011-01-11
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Masahiro Furuya; Shohei Tagami; Hideto Kato; Hideyuki Ito; Masahiro Yoshizawa
- Inventors: Masahiro Furuya; Shohei Tagami; Hideto Kato; Hideyuki Ito; Masahiro Yoshizawa
- Web page: https://patentgrep.com/patent/US8785585B2

## CPC

- C09J 183/04: Polysiloxanes
- C08L 83/00: Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C09J 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09J183/10 takes precedence)
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 90/123: {by grinding or lapping}
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08G 77/50: by carbon linkages
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10P 72/7442: {Separation by peeling}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

## Claims

### Claim 1

A solution of a temporary adhesive composition comprising:
(A) a cured product of an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between an alkenyl group-containing organopolysiloxane (A1) and a hydrosilyl group-containing compound (A2) in presence of a platinum group metal-based catalyst, wherein
(A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising:
(I) 35 to 99 mol % of siloxane units represented by R1SiO3/2 (T units),
(II) 0 to 49 mol % of siloxane units represented by R2R3SiO2/2 units (D units) and
(III) 1 to 25 mol % of siloxane units represented by R4R5R6SiO1/2 units (M units),
wherein each of R1 to R6 represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 10 carbon atoms,
in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all organic groups bonded to silicon atoms, and
(A2) is a hydrosilyl group-containing compound comprising:
an organohydrogenpolysiloxane represented by an average composition formula (1):
R7aHbSiO(4-a-b)/2 (1)
wherein R7 represents a monovalent hydrocarbon group other than an alkenyl group, and a and b are numbers that respectively satisfy 0.75≦a≦2.5, 0.05≦b≦1.0, and 0.8≦a+b≦2.6,
and having at least two hydrogen atoms bonded to silicon atoms within each molecule, or
a bis-hydrosilyl compound represented by a general formula (2):
wherein each of R8 and R9 independently represents a monovalent hydrocarbon group other than an alkenyl group, and X represents a divalent organic group, or
a combination thereof,
in an amount sufficient to provide 0.4 to 1.0 mols of hydrogen atoms bonded to silicon atoms per 1 mol of all the alkenyl groups within the organopolysiloxane (A1), and
(B) an organic solvent having a boiling point of not more than 220° C.

### Claim 2 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the alkenyl groups within the alkenyl group-containing organopolysiloxane (A1) are vinyl groups, and are contained within the unsubstituted or substituted monovalent hydrocarbon groups of R1, R2, R3, R4, R5 and/or R6.

### Claim 3 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the organohydrogenpolysiloxane represented by the average composition formula (1) is represented by a formula (3):
wherein n represents an integer of 0 to 38, and each of R8 to R11 independently represents a substituted or unsubstituted monovalent hydrocarbon group.

### Claim 4 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the organopolysiloxane of component (A1) is composed of:
(I) 40 to 98.9 mol % of the T units,
(II) 0 to 48.9 mol % of the D units,
(III) 0.1 to 30 mol % of siloxane units represented by SiO4/2 (Q units), and
(IV) 1 to 25 mol % of the M units.

### Claim 5 (depends on 1)

A method of producing a thin wafer, the method comprising:
(a) bonding a circuit-formed surface of a wafer having the circuit-formed surface and a non-circuit-formed surface to a support, with an adhesive layer composed of the temporary adhesive composition according to claim 1 disposed therebetween,
(b) grinding the non-circuit-formed surface of the wafer bonded to the support,
(c) processing the non-circuit-formed surface of the wafer that has undergone grinding of the non-circuit-formed surface,
(d) detaching the processed wafer from the support, and
(e) removing residual adhesive composition from the circuit-formed surface of the detached wafer.

### Claim 6 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the solvent of component (B) is an organic solvent having a boiling point of from 50 to 220° C.

### Claim 7 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the solvent of component (B) is one or more selected from the group consisting of pentane, hexane, cyclohexane, decane, isododecane, limonene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, ethyl acetate, butyl acetate, ethyl lactate, ethyl propionate, propylene glycol monomethyl ether acetate, tetrahydrofuran, cyclopentyl methyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, ethanol, isopropanol, butanol, ethylene glycol, ethylene glycol monomethyl ether, propylene glycol, and propylene glycol monomethyl ether.

### Claim 8 (depends on 1)

The solution of the temporary adhesive composition according to claim 1, wherein the solvent of component (B) is one or more selected from isododecane, cyclopentanone, cyclohexanone, propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether.

### Claim 9 (depends on 1)

A stacked product comprising a wafer, a support and an adhesive layer formed between said wafer and said support, wherein said adhesive layer is formed from the solution of the temporary adhesive composition according to claim 1.