# US 8,785,524 B2 · Spray coatable adhesive for bonding silicon dies to rigid substrates

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- Number: US 8,785,524 B2
- Document ID: US8785524B2
- Status: Granted
- Kind: B2
- Application number: 13/168,063
- Filed: 2011-06-24
- Published: 2011-12-29
- Granted: 2014-07-22
- Earliest claimed: 2010-06-24
- Assignees: Funai Electric Co., Ltd.
- Applicants: Xiaoming Wu; Paul Dryer; David Rhine; Anna Pearson; Jeanne Marie Saldanha Singh; Richard Wells; Joel Provence
- Inventors: Xiaoming Wu; Paul Dryer; David Rhine; Anna Pearson; Jeanne Marie Saldanha Singh; Richard Wells; Joel Provence
- Web page: https://patentgrep.com/patent/US8785524B2

## CPC

- B41J 2/1601: {Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence)}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1628: {dry etching}
- B41J 2/1645: {thin film formation by spincoating}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

## Claims

### Claim 1

A spray coatable adhesive composition comprising an epoxy based resin, a thermal acid generator, a photo acid generator and a solvent, wherein the epoxy based resin consists of a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35.

### Claim 2 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the weight ratio of the solid bisphenol A epoxy resin to the liquid or semi-liquid hydrogenated bisphenol A epoxy resin is about 65:35.

### Claim 3 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein a weight ratio of the thermal acid generator to the photoacid generator is about 1:2 to about 2:1.

### Claim 4 (depends on 3)

The spray coatable adhesive composition of claim 3, wherein the weight ratio of the thermal acid generator to the photoacid generator is about 1:1 to about 1:2.

### Claim 5 (depends on 4)

The spray coatable adhesive composition of claim 4, wherein the weight ratio of the thermal acid generator to the photoacid generator is 1:1.

### Claim 6 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the amount of the thermal acid generator is about 1.5 to about 3.0 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 7 (depends on 6)

The spray coatable adhesive composition of claim 6, wherein the amount of the thermal acid generator is about 1.5 to about 2.0 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 8 (depends on 7)

The spray coatable adhesive composition of claim 7, wherein the amount of the thermal acid generator is about 1.5 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 9 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the amount of the photo acid generator is about 1.5 to about 3.0 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 10 (depends on 9)

The spray coatable adhesive composition of claim 9 wherein the amount of the photo acid generator is about 1.5 to about 2.0 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 11 (depends on 10)

The spray coatable adhesive composition of claim 10, wherein the amount of the photo acid generator is about 1.5 parts by weight per 100 parts by weight of the epoxy based resin.

### Claim 12 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the thermal acid generator comprises ammonium hexafluoroantimonate.

### Claim 13 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the photoacid generator comprises tris(trifluoromethanesulfonyl)methide.

### Claim 14 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the solvent comprises methyl ethyl ketone.

### Claim 15 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the solvent comprises propylene glycol methyl ether acetate.

### Claim 16 (depends on 1)

The spray coatable adhesive composition of claim 1, wherein the adhesive composition further comprises a silane adhesion promoter.