# US 8,785,313 B2 · Method of manufacturing device having a blocking structure

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- Number: US 8,785,313 B2
- Document ID: US8785313B2
- Status: Granted
- Kind: B2
- Application number: 14/033,904
- Filed: 2013-09-23
- Published: 2014-01-23
- Granted: 2014-07-22
- Earliest claimed: 2010-04-02
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Bor-Wen Chan; Hsueh Wen Tsau
- Web page: https://patentgrep.com/patent/US8785313B2

## CPC

- H10D 64/035: {comprising conductor-insulator-conductor-insulator-semiconductor structures}
- H10D 64/01316: {the conductor comprising a layer of elemental metal contacting the insulator, e.g. Ta, W, Mo or Al}
- H10D 64/01318: {the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN (comprising a layer of alloys of Si, Ge or C H10D64/01314)}
- H10D 64/017: {using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes}
- H10D 64/666: {the conductor further comprising additional layers}
- H10D 64/667: {the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers (having lateral variation H10D64/671)}
- H10P 72/0468: {comprising a chamber adapted to a particular process}
- H10P 14/44: Physical vapour deposition [PVD]
- H10W 20/035: {combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of manufacturing a semiconductor device, and the method includes forming a stack of a work function layer, a blocking structure, and a metal cap layer sequentially on a substrate. The forming of the blocking structure includes sequentially depositing at least a metal diffusion prevention layer over the work function layer and an electrical performance enhancement layer over the metal diffusion prevention layer before forming the metal cap layer. The electrical performance enhancement layer includes a TiN layer having a Ti/N ratio greater than 1.

## Claims

### Claim 1

A method of manufacturing a semiconductor device, said method comprising:
forming a stack of a work function layer, a blocking structure, and a metal cap layer sequentially on a substrate;
wherein the forming of the blocking structure comprises sequentially depositing at least a metal diffusion prevention layer over the work function layer and an electrical performance enhancement layer over the metal diffusion prevention layer before forming the metal cap layer, and the electrical performance enhancement layer comprises a TiN layer having a Ti/N ratio greater than 1.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the metal diffusion prevention layer comprises a material including poisoned TiN, TaN, TiON, or TaON.

### Claim 3 (depends on 1)

The method according to claim 1, wherein
a poisoned TiN layer is formed as the metal diffusion prevention layer;
a metallic TiN layer is formed as the electrical performance enhancement layer; and
the TiN layers are deposited in a single PVD (physical vapor deposition) chamber.

### Claim 4 (depends on 1)

The method according to claim 1, wherein
a poisoned TiN layer is formed as the metal diffusion prevention layer;
a metallic TiN layer is formed as the electrical performance enhancement layer;
the TiN layers are deposited by a PVD (physical vapor deposition) process comprising generating a plasma in a PVD chamber while flowing a nitrogen gas through the PVD chamber;
a flow rate of the nitrogen gas for forming the metallic TiN layer is in a range from 10 sccm to 100 sccm; and
a flow rate of the nitrogen gas for forming the poisoned TiN layer is in a range from 10 sccm to 200 sccm.

### Claim 5 (depends on 4)

The method according to claim 4, wherein
the depositing of the TiN layers further comprises flowing an inert gas through the PVD chamber;
a flow rate of the inert gas for forming the metallic TiN layer is in a range from 0 sccm to 20 sccm; and
a flow rate of the inert gas for forming the poisoned TiN layer is in a range from 0 sccm to 20 sccm.

### Claim 6 (depends on 4)

The method according to claim 4, wherein
the metallic TiN layer is deposited to a thickness ranging from 5 Å to 50 Å; and
the poisoned TiN layer is deposited to a thickness ranging from 5 Å to 50 Å.

### Claim 7 (depends on 1)

The method according to claim 1, further comprising:
performing a gate replacement process to define an opening in a dielectric layer on the substrate,
wherein the stack is subsequently formed in said opening.

### Claim 8 (depends on 1)

The method according to claim 1, wherein
the work function layer is formed of at least a metal having a work function suitable for a PMOS or an NMOS;
the metal cap layer is formed of Al;
a metallic TiN layer is formed as the electrical performance enhancement layer over the work function layer; and
a poisoned TiN layer is formed as the metal diffusion prevention layer over the metallic TiN layer and under the metal cap layer.

### Claim 9 (depends on 1)

The method according to claim 1, further comprising
depositing at least another electrical performance enhancement or metal diffusion prevention layer to form the blocking structure as a multilayer structure of alternating electrical performance enhancement or metal diffusion prevention layers.

### Claim 10

A method comprising:
forming a blocking structure in an opening, the opening being defined over a channel region in a substrate, the forming the blocking structure comprising:
forming a first layer over the channel region, the first layer comprises a TiN layer having a Ti/N ratio greater than 1; and
forming a second layer over the first layer, the second layer being configured as a diffusion barrier to a metallic material; and
forming a metal layer over the blocking structure, the metal layer comprising the metallic material.

### Claim 11 (depends on 10)

The method of claim 10, wherein the forming the first layer comprises performing a PVD (physical vapor deposition) process, the PVD process comprises generating a plasma in a PVD chamber while flowing a nitrogen gas through the PVD chamber, and a flow rate of the nitrogen gas ranges from 10 sccm to 100 sccm.

### Claim 12 (depends on 11)

The method of claim 11, wherein the generating the plasma comprises using an RF bias power ranging from 100 W to 2000 W.

### Claim 13 (depends on 11)

The method of claim 11, wherein the generating the plasma comprises using a DC power ranging from 5 kW to 100 kW.

### Claim 14 (depends on 10)

The method of claim 10, wherein the second layer comprises a material including TiN, TaN, TiON, or TaON.

### Claim 15 (depends on 10)

The method of claim 10, wherein the second layer comprises a TiN layer having a Ti/N ratio less than 1.

### Claim 16 (depends on 15)

The method of claim 15, wherein the forming the second layer comprises performing a PVD (physical vapor deposition) process, the PVD process comprises generating a plasma in a PVD chamber while flowing a nitrogen gas through the PVD chamber, and a flow rate of the nitrogen gas ranges from 10 sccm to 200 sccm.

### Claim 17 (depends on 16)

The method of claim 16, wherein the generating the plasma comprises using a DC power ranging from 5 kW to 100 kW.

### Claim 18

A method comprising:
forming a dummy gate stack over a substrate;
forming a layer of dielectric material surrounding the dummy gate stack;
removing the dummy gate stack to define an opening;
forming a blocking structure in the opening, the forming the blocking structure comprising:
forming a first layer in the opening extending along a bottom surface and a sidewall of the opening, the first layer being configured to provide a stress to a channel region under the first layer, and the first layer comprising a TiN layer having a Ti/N ratio greater than 1; and
forming a second layer in the opening extending along the bottom surface and the sidewall of the opening, the first layer being between the second layer and the bottom surface and the sidewall of the opening, and the second layer being configured as a diffusion barrier to a metallic material; and
forming a metal layer in the opening, the metal layer comprising the metallic material, and the blocking structure being between the metal layer and the bottom surface and the sidewall of the opening.

### Claim 19 (depends on 18)

The method of claim 18, wherein the second layer comprises a material including TiN, TaN, TiON, or TaON.