# US 8,785,292 B2 · Anodic bonding method and method of producing acceleration sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,292 B2 - Document ID: US8785292B2 - Status: Granted - Kind: B2 - Application number: 12/544,480 - Filed: 2009-08-20 - Published: 2009-12-17 - Granted: 2014-07-22 - Earliest claimed: 2005-04-08 - Assignees: Lapis Semiconductor Co., Ltd. - Applicants: Shinichi Sueyoshi - Inventors: Shinichi Sueyoshi - Web page: https://patentgrep.com/patent/US8785292B2 ## CPC - B81C 3/001: {Bonding of two components} - B81C 2203/031: Anodic bondings - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area. ## Claims ### Claim 1 An anodic bonding method of bonding a laminated substrate having a first planner dimension, comprising the steps of: preparing an anodic bonding apparatus having a first electrode and a second electrode, said first electrode having a first surface, said second electrode having a second surface facing the first surface and having a second planner dimension greater than the first planner dimension, said second electrode being formed of a material containing carbon as a main component, said first surface including a first central area; a first substrate placing area for placing the laminated substrate and containing the first central area; and a first peripheral area surrounding the first substrate placing area, said second surface including a second central area corresponding to the first central area; a second substrate placing area corresponding to the first substrate placing area and surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area, said second electrode further including a curved portion curved toward the first electrode so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area; placing the laminated substrate over the first central area and the first substrate placing area of the first electrode; a first contact step of contacting the second central area of the second electrode with the laminated substrate to form a contact area; a second contact step of contacting the second substrate placing area of the second electrode with the laminated substrate to enlarge the contact area with a stress applied by a fixing member disposed in the second peripheral area so that the second electrode is pressed against the laminated substrate until the second electrode becomes substantially flat; and a bonding step of applying a voltage to the first electrode and the second electrode to bond the laminated substrate, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by first to fourth fixing units disposed at four corners of the second electrode, said second contact step including a first step of applying the stress at two of the four corners with the first and third fixing units and a second step of applying the stress at the other two of the four corners with the second and fourth fixing units. ### Claim 2 (depends on 1) The anodic bonding method according to claim 1, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a plurality of fixing units disposed in the second peripheral area along the second substrate placing area. ### Claim 3 (depends on 1) The anodic bonding method according to claim 1, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a plurality of fixing units disposed at corners of the second electrode. ### Claim 4 (depends on 1) The anodic bonding method according to claim 1, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a fixing member disposed in the first peripheral area and the second peripheral area such that a distance between the first surface and the second surface decreases. ### Claim 5 An anodic bonding method of bonding a laminated substrate having a first planner dimension, comprising the steps of: preparing an anodic bonding apparatus having a first electrode and a second electrode, said first electrode having a first surface, said second electrode having a second surface facing the first surface and having a second planner dimension greater than the first planner dimension, said second electrode being formed of a material containing carbon as a main component, said first surface including a first central area; a first substrate placing area for placing the laminated substrate and containing the first central area; and a first peripheral area surrounding the first substrate placing area, said second surface including a second central area corresponding to the first central area; a second substrate placing area corresponding to the first substrate placing area and surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area, said second electrode further including a curved portion curved toward the first electrode so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area; placing the laminated substrate over the first central area and the first substrate placing area of the first electrode; a first contact step of contacting the second central area of the second electrode with the laminated substrate to form a contact area; a second contact step of contacting the second substrate placing area of the second electrode with the laminated substrate to enlarge the contact area with a stress applied by a fixing member disposed in the second peripheral area so that the second electrode is pressed against the laminated substrate until the second electrode becomes substantially flat; and a bonding step of applying a voltage to the first electrode and the second electrode to bond the laminated substrate, wherein, in the step of placing the laminated substrate, said laminated substrate is formed of a semiconductor substrate and a glass substrate directly contacting the semiconductor substrate; and a plurality of protective layers is placed over the first central area and the first substrate placing area of the first electrode. ### Claim 6 A method of producing an acceleration sensor including a laminated substrate having a first planner dimension, comprising the steps of: preparing an anodic bonding apparatus having a first electrode and a second electrode, said first electrode having a first surface, said second electrode having a second surface facing the first surface and having a second planner dimension greater than the first planner dimension, said second electrode being formed of a material containing carbon as a main component, said first surface including a first central area; a first substrate placing area for placing the laminated substrate formed of an acceleration sensor substrate with an acceleration sensor element formed thereon and a glass substrate contacting with the acceleration sensor substrate, and containing the first central area; and a first peripheral area surrounding the first substrate placing area, said second surface including a second central area corresponding to the first central area; a second substrate placing area corresponding to the first substrate placing area and surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area, said second electrode further including a curved portion curved toward the first electrode so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area; placing the laminated substrate on the first substrate placing area of the first electrode; a first contact step of contacting the second central area of the second electrode with the laminated substrate to form a contact area; a second contact step of contacting the second substrate placing area of the second electrode with the laminated substrate to enlarge the contact area with a stress applied by a fixing member disposed in the second peripheral area so that the second electrode is pressed against the laminated substrate until the second electrode becomes substantially flat; and a bonding step of applying a voltage to the first electrode and the second electrode to bond the acceleration sensor substrate and the glass substrate, wherein, in the step of placing the laminated substrate, said laminated substrate is formed of a semiconductor substrate and a glass substrate directly contacting the semiconductor substrate; and a plurality of protective layers is placed over the first central area and the first substrate placing area of the first electrode. ### Claim 7 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a plurality of fixing units disposed in the second peripheral area along the second substrate placing area. ### Claim 8 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a plurality of fixing units disposed at corners of the second electrode. ### Claim 9 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by first to fourth fixing units disposed at four corners of the second electrode, said second contact step including a first step of applying the stress at two of the four corners with the first and third fixing units and a second step of applying the stress at the other two of the four corners with the second and fourth fixing units. ### Claim 10 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by a fixing member disposed in the first peripheral area and the second peripheral area such that a distance between the first surface and the second surface decreases. ### Claim 11 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the step of placing the laminated substrate, said laminated substrate further including a plurality of protective layers is placed on the first substrate placing area of the first electrode. ### Claim 12 (depends on 1) The method of producing an acceleration sensor according to claim 1, wherein, in the second contact step, said second electrode is pressed against the laminated substrate until the curved portion becomes substantially flat. ### Claim 13 (depends on 6) The method of producing an acceleration sensor according to claim 6, wherein, in the second contact step, said second electrode is pressed against the laminated substrate until the curved portion becomes substantially flat.