# US 8,785,256 B2 · Method of manufacturing semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,256 B2 - Document ID: US8785256B2 - Status: Granted - Kind: B2 - Application number: 13/736,470 - Filed: 2013-01-08 - Published: 2013-05-16 - Granted: 2014-07-22 - Earliest claimed: 2009-12-04 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Noriyoshi Shimizu; Akio Rokugawa - Web page: https://patentgrep.com/patent/US8785256B2 ## CPC - H10W 74/01: Manufacture or treatment - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 72/0198: {batch processes} - H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/9413: {on encapsulations} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; and (d) polishing the encapsulation resin layer to expose a top surface of the pad. ## Claims ### Claim 1 A method of manufacturing a semiconductor package, the method comprising: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on the supporting substrate through a fixing material such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; (d) polishing the encapsulation resin layer to expose a top surface of the pad; (e) forming an insulating layer on the encapsulation resin layer; (f) forming a wiring layer on the insulating layer, wherein the wiring layer includes a via connected to the pad and a wiring pattern, wherein step (e) and step (f) are alternately repeated; and (g) removing the supporting substrate and the fixing material, wherein the fixing material is a thermally removable adhesive agent, and step (g) includes heating the fixing material after step (f) until the supporting substrate and the fixing material separate from the semiconductor package. ### Claim 2 (depends on 1) The method of claim 1, wherein the encapsulation resin layer is formed by a mold. ### Claim 3 (depends on 1) The method of claim 1, wherein an uppermost wiring layer includes an external connection pad, and the method further comprises: forming a solder resist film on the uppermost wiring layer, the solder resist film formed to have an opening through which the external connection pad is exposed. ### Claim 4 (depends on 3) The method of claim 3, wherein a sum of thickness of all wiring layers and all insulating layers and the solder resist film is smaller than that of the encapsulation resin layer. ### Claim 5 (depends on 4) The method of claim 4, wherein, in step (g), the supporting substrate and the fixing material are removed to expose the second surface of the semiconductor chip from one surface of the encapsulation resin layer so that the second surface of the semiconductor chip is flush with the one surface of the encapsulation resin. ### Claim 6 (depends on 5) The method of claim 5, wherein, in step (d), the encapsulation resin layer is polished to expose the top surface of the pad so that the top surface of the pad is flush with a surface of the encapsulation resin layer that is opposite to said one surface. ### Claim 7 A method of manufacturing a semiconductor package, the method comprising: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; (d) polishing the encapsulation resin layer to expose a top surface of the pad; (e) forming an insulating layer on the encapsulation resin layer; and (f) forming a wiring layer on the insulating layer, wherein the wiring layer includes a via connected to the pad and a wiring pattern, wherein step (e) and step (f) are alternately repeated, an uppermost wiring layer includes an external connection pad, the method further comprises forming a solder resist film on the uppermost wiring layer, the solder resist film formed to have an opening through which the external connection pad is exposed, and a sum of thickness of all wiring layers and all insulating layers and the solder resist film is smaller than that of the encapsulation resin layer. ### Claim 8 (depends on 7) The method of claim 7, wherein the encapsulation resin layer is formed by a mold. ### Claim 9 (depends on 7) The method of claim 7, wherein the method further comprises: (g) removing the supporting substrate to expose the second surface of the semiconductor chip from one surface of the encapsulation resin layer so that the second surface of the semiconductor chip is flush with the one surface of the encapsulation resin. ### Claim 10 (depends on 9) The method of claim 9, wherein, in step (d), the encapsulation resin layer is polished to expose the top surface of the pad so that the top surface of the pad is flush with a surface of the encapsulation resin layer that is opposite to said one surface. ### Claim 11 (depends on 7) The method of claim 7, further comprising: (g) removing the supporting substrate. ### Claim 12 (depends on 11) The method of claim 11, wherein the supporting substrate is made of metal, and wherein step (g) comprises removing the supporting substrate by etching. ### Claim 13 (depends on 11) The method of claim 11, wherein step (b) comprises: disposing the semiconductor chip on the supporting substrate through a fixing material, the fixing material is made of resin, and the method further comprising: (h) removing the fixing material after step (g) by polishing.