# US 8,785,252 B2 · Resin sealed semiconductor device and manufacturing method therefor

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,785,252 B2
- Document ID: US8785252B2
- Status: Granted
- Kind: B2
- Application number: 13/757,231
- Filed: 2013-02-01
- Published: 2013-06-06
- Granted: 2014-07-22
- Earliest claimed: 2008-02-27
- Assignees: Mitsubishi Electric Corporation
- Applicants: Masafumi Matsumoto; Tatsuya Iwasa; Junji Yamada; Masaru Furukawa
- Inventors: Masafumi Matsumoto; Tatsuya Iwasa; Junji Yamada; Masaru Furukawa
- Web page: https://patentgrep.com/patent/US8785252B2

## CPC

- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 72/015: {of bond wires}
- H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.

## Claims

### Claim 1

A method for manufacturing a semiconductor device, comprising:
mounting a metal terminal on a thermoplastic resin case at a predetermined location such that a portion of said metal terminal is in contact with said thermoplastic resin case;
heating said mounted metal terminal by induction heating to a temperature higher than the melting point of said thermoplastic resin case so that said portion of said metal terminal is thermoplastically bonded to said thermoplastic resin case;
mounting a semiconductor chip within said thermoplastic resin case; and
connecting said bonded metal terminal to said semiconductor chip by wire bonding,
wherein said metal terminal has a wire bonding surface and an opposing contact surface, said portion of said metal terminal thermoplastically bonded to said thermoplastic resin case including the opposing contact surface of said metal terminal.

### Claim 2 (depends on 1)

The method as claimed in claim 1, wherein:
said wire bonding includes wire bonding on said wire bonding surface of said metal terminal; and
said thermoplastic bonding includes:
placing an AC magnetic field generator within said thermoplastic resin case; and
thermoplastically bonding said opposing contact surface of said metal terminal to an inner bottom of said thermoplastic resin case by induction heating using said AC magnetic field generator.

### Claim 3 (depends on 1)

The method as claimed in claim 1, wherein:
said metal terminal has a concave portion; and
said thermoplastic bonding is performed in such a manner that a solidified molten portion of said thermoplastic resin case fills said concave portion.

### Claim 4 (depends on 1)

The method as claimed in claim 1, wherein said metal terminal has a first engagement portion in the form of a first recessed notch and a second engagement portion in the form of a second recessed notch.

### Claim 5 (depends on 1)

The method as claimed in claim 1, wherein said thermoplastic resin case has a sidewall with a plurality of protrusions, each said protrusion having a T-shaped cross-section as seen from a direction perpendicular to a bottom portion of said thermoplastic resin case.

### Claim 6 (depends on 1)

The method as claimed in claim 1, wherein said metal terminal is sandwiched between two protrusions extending from a sidewall of said thermoplastic resin case such that a first engagement portion of said metal terminal in the form of a first recessed notch and a second engagement portion of said metal terminal in the form of a second recessed notch are between the two protrusions in a side view.