# US 8,785,251 B2 · Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

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- Number: US 8,785,251 B2
- Document ID: US8785251B2
- Status: Granted
- Kind: B2
- Application number: 14/020,996
- Filed: 2013-09-09
- Published: 2014-01-02
- Granted: 2014-07-22
- Earliest claimed: 2010-09-14
- Assignees: STATS ChipPAC, Ltd.
- Applicants: STATS ChipPAC, Ltd.
- Inventors: SooMoon Park; ByoungWook Jang; DongSoo Moon
- Web page: https://patentgrep.com/patent/US8785251B2

## CPC

- H10W 76/05: Providing fillings in containers, e.g. gas filling
- H10W 72/0113: {Apparatus for manufacturing die-attach connectors}
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.

## Claims

### Claim 1

A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a dispensing needle in fluid communication with the semiconductor die, the dispensing needle including a width substantially equal to a width of the semiconductor die; and
dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.

### Claim 2 (depends on 1)

The method of claim 1, further including dispensing the underfill material simultaneously and uniformly across the width of the semiconductor die.

### Claim 3 (depends on 1)

The method of claim 1, further including dispensing the underfill material under pressure across the width of the semiconductor die.

### Claim 4 (depends on 1)

The method of claim 1, wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.

### Claim 5 (depends on 1)

The method of claim 1, wherein the dispensing needle includes a plurality of pole portions between a shank and an outlet.

### Claim 6 (depends on 1)

The method of claim 1, wherein the dispensing needle includes a plate between a shank and an outlet.

### Claim 7

A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a stationary dispensing needle in fluid communication across a width of the semiconductor die; and
dispensing an underfill material from the stationary dispensing needle between the semiconductor die and substrate.

### Claim 8 (depends on 7)

The method of claim 7, wherein a width of the stationary dispensing needle is substantially equal to the width of the semiconductor die.

### Claim 9 (depends on 7)

The method of claim 7, further including dispensing the underfill material uniformly across the width of the semiconductor die.

### Claim 10 (depends on 7)

The method of claim 7, further including dispensing the underfill material under pressure across the width of the semiconductor die.

### Claim 11 (depends on 7)

The method of claim 7, wherein the stationary dispensing needle includes a plurality of pole portions between a shank and an outlet.

### Claim 12 (depends on 7)

The method of claim 7, wherein the stationary dispensing needle includes a T-shaped shank.

### Claim 13 (depends on 7)

The method of claim 7, wherein the stationary dispensing needle includes a plate between a shank and an outlet.

### Claim 14

A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate; and
disposing a dispensing needle in fluid communication across a width of the semiconductor die and including an outlet disposed adjacent to a gap between the semiconductor die and substrate.

### Claim 15 (depends on 14)

The method of claim 14, further including dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.

### Claim 16 (depends on 15)

The method of claim 15, further including dispensing the underfill material uniformly across the width of the semiconductor die.

### Claim 17 (depends on 15)

The method of claim 15, further including dispensing the underfill material under pressure across the width of the semiconductor die.

### Claim 18 (depends on 15)

The method of claim 15, wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.

### Claim 19 (depends on 14)

The method of claim 14, wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.

### Claim 20

A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate; and
disposing a dispensing needle in fluid communication across a width of the semiconductor die.

### Claim 21 (depends on 20)

The method of claim 20, further including dispensing an underfill material from the dispensing needle between the semiconductor die and substrate.

### Claim 22 (depends on 21)

The method of claim 21, further including dispensing the underfill material uniformly across the width of the semiconductor die.

### Claim 23 (depends on 21)

The method of claim 21, wherein the dispensing needle remains stationary during the dispensing of the underfill material between the semiconductor die and substrate.

### Claim 24 (depends on 20)

The method of claim 20, wherein a width of the dispensing needle is substantially equal to the width of the semiconductor die.

### Claim 25 (depends on 20)

The method of claim 20, wherein the dispensing needle includes a plate between a shank and an outlet.