# US 8,785,103 B2 · Photosensitive novolac resin, positive photosensitive resin composition including same, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,785,103 B2 - Document ID: US8785103B2 - Status: Granted - Kind: B2 - Application number: 13/590,440 - Filed: 2012-08-21 - Published: 2013-07-04 - Granted: 2014-07-22 - Earliest claimed: 2011-12-29 - Assignees: Cheil Industries Inc. - Applicants: Jong-Hwa Lee; Hyun-Yong Cho; Min-Kook Chung; Ji-Young Jeong; Myoung-Hwan Cha - Inventors: Jong-Hwa Lee; Hyun-Yong Cho; Min-Kook Chung; Ji-Young Jeong; Myoung-Hwan Cha - Web page: https://patentgrep.com/patent/US8785103B2 ## CPC - G03F 7/0233: {characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides} - C08G 8/28: Chemically modified polycondensates - C08G 73/22: Polybenzoxazoles - C08L 61/14: Modified phenol-aldehyde condensates - C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors - G03F 7/023: Macromolecular quinonediazides; Macromolecular additives, e.g. binders {(G03F7/0226 takes precedence)} - H10W 74/47: comprising organic materials, e.g. plastics or resins - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition. ## Claims ### Claim 1 A positive photosensitive resin composition comprising: (A) a polybenzoxazole precursor including a structural unit represented by the following Chemical Formula 3, a structural unit represented by the following Chemical Formula 4, or a combination thereof; (B) a photosensitive novolac resin comprising a structural unit represented by the following Chemical Formula 1 and a structural unit represented by the following Chemical Formula 2; and (C) a solvent: wherein, in Chemical Formulae 3 and 4, X1 is independently a substituted or unsubstituted C6 to C30 aromatic organic group or a substituted or unsubstituted C1 to C30 alicyclic organic group, X2 is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted C3 to C30 alicyclic organic group, or a functional group represented by the following Chemical Formula 5, Y1 and Y2 are the same or different and are independently a substituted or unsubstituted C6 to C30 aromatic organic group or a substituted or unsubstituted C3 to C30 alicyclic organic group, and when the mol % of the structural unit of Chemical Formula 3 is m, and the mol % of the structural unit of Chemical Formula 4 is n in the polybenzoxazole precursor, and m+n is 100 mol %, m ranges from about 60 mol % to about 95 mol %, and n ranges from about 5 mol % to about 40 mol %, wherein, in Chemical Formula 5, R21 to R24 are the same or different and are independently hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C1 to C30 alkoxy, or hydroxy, R25 to R26 are the same or different and are independently a single bond, substituted or unsubstituted C1 to C30 alkylene, or substituted or unsubstituted C6 to C30 arylene, and k is an integer ranging from 1 to 50, wherein, in Chemical Formulae 1 and 2, R11 and R12 are the same or different and are independently hydrogen or a quinone diazide sulfonyl group, wherein 50% or more of R11 and R12 in the photosensitive novolac resin is a quinone diazide sulfonyl group, R13 and R14 are the same or different and are independently C1 to C7 alkyl, and when the number of the structural unit of Chemical Formula 1 is x, and the number of the structural unit of Chemical Formula 2 is y in the photosensitive novolac resin, x+y ranges from about 2 to about 30, and x/(x+y) ranges from about 0.6 to about 0.95. ### Claim 2 (depends on 1) The positive photosensitive resin composition of claim 1, wherein the polybenzoxazole precursor has a weight average molecular weight (Mw) of about 3,000 to about 300,000. ### Claim 3 (depends on 1) The positive photosensitive resin composition of claim 1, wherein the positive photosensitive resin composition comprises: about 5 parts by weight to about 150 parts by weight of the photosensitive novolac resin (B); and a balance amount of the solvent (C), based on about 100 parts by weight of the polybenzoxazole precursor (A). ### Claim 4 (depends on 1) The positive photosensitive resin composition of claim 1, wherein the positive photosensitive resin composition further comprises about 0.1 parts by weight to about 30 parts by weight of a silane compound based on about 100 parts by weight of the polybenzoxazole precursor. ### Claim 5 (depends on 1) A photosensitive resin film fabricated by using the positive photosensitive resin composition according to claim 1. ### Claim 6 (depends on 5) A semiconductor device comprising the photosensitive resin film according to claim 5. ### Claim 7 (depends on 1) The positive photosensitive resin composition of claim 1, wherein the photosensitive novolac resin has a weight average molecular weight (Mw) of about 500 to about 15,000. ### Claim 8 (depends on 1) The positive photosensitive resin composition of claim 1, wherein the quinone diazide sulfonyl group of the photosensitive novolac resin comprises a 1,2-naphthoquinone diazide-4-sulfonyl group represented by the following Chemical Formula 6, a 1,2-naphthoquinone diazide-5-sulfonyl group represented by the following Chemical Formula 7, a 1,2-benzoquinone diazide-4-sulfonyl group represented by the following Chemical Formula 8, or a combination thereof: