# US 8,784,980 B2 · Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles

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- Number: US 8,784,980 B2
- Document ID: US8784980B2
- Status: Granted
- Kind: B2
- Application number: 12/465,090
- Filed: 2009-05-13
- Published: 2010-11-18
- Granted: 2014-07-22
- Earliest claimed: 2009-05-13
- Assignees: E. I. Du Pont de Nemours and Company
- Applicants: Pui-Yan Lin; Govindasamy Paramasivam Rajendran; George Elias Zahr
- Inventors: Pui-Yan Lin; Govindasamy Paramasivam Rajendran; George Elias Zahr
- Web page: https://patentgrep.com/patent/US8784980B2

## CPC

- C08K 9/04: Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)}
- B32B 5/147: {by treatment of the layer}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/08: of synthetic resin
- B32B 15/092: comprising epoxy resins
- B32B 15/18: comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)}
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/18: characterised by the use of special additives
- B32B 27/26: using curing agents
- B32B 27/281: {comprising polyimides}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- B32B 27/38: comprising epoxy resins
- C08J 5/18: Manufacture of films or sheets
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- B32B 2264/10: Inorganic particles
- B32B 2307/206: Insulating
- B32B 2307/302: Conductive
- B32B 2307/538: Roughness
- B32B 2379/00: Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B 2457/08: PCBs, i.e. printed circuit boards
- C08J 2363/00: Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J 2379/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H05K 2201/0245: Flakes, flat particles or lamellar particles
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided is a film having a thickness of less than 500 μm comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

## Claims

### Claim 1

A film having a thickness of less than 500 μm comprising a polymer and a plurality of surface-modified hexagonal boron nitride (“SMhBN”) particles dispersed therewithin, wherein the surface modified boron nitride particles are produced by reacting hexagonal boron nitride particles with a substituted phenyl diazonium chloride represented by the structure (I):
to covalently bond a substituted phenyl radical to a surface of the hexagonal boron nitride particles, the substituted phenyl radical being represented by the structure (II):
wherein X is a radical selected from NH2—, HO—, R2OC(O)—, R2C(O)O—, HSO3—, NH2CO—, halogens, alkyl and substituted or unsubstituted aryl; wherein R1 is hydrogen, alkyl or alkoxy, and R2 is hydrogen, alkyl, or substituted or unsubstituted aryl.

### Claim 2 (depends on 1)

The film of claim 1 wherein R1 is hydrogen, and X is NH2—.

### Claim 3 (depends on 1)

The film of claim 1 wherein R1 is hydrogen, and X is HO—.

### Claim 4 (depends on 1)

The film of claim 1 wherein the polymer is polyamic acid.

### Claim 5 (depends on 1)

The film of claim 1 wherein the polymer is polyimide.

### Claim 6 (depends on 1)

The film of claim 1 wherein the polymer is a cured epoxy resin composition.

### Claim 7 (depends on 1)

The film of claim 1 wherein the polymer is an uncured epoxy resin composition.

### Claim 8 (depends on 1)

The film of claim 1 wherein the SMhBN particles have a size within the range of 0.5 to 50 μm.

### Claim 9 (depends on 8)

The film of claim 8 wherein the concentration of SMhBN is 30 to 70% by weight.

### Claim 10

A process comprising casting onto a release surface a dispersion of a plurality of surface modified hexagonal boron nitride particles in a solution of a polymer in a solvent, forming the thus cast dispersion into a viscous liquid film, and, extracting the solvent to form a film having a thickness of less than 500 μm; wherein the surface modified hexagonal boron nitride particles are produced by reacting hexagonal boron nitride particles with a substituted phenyl diazonium chloride represented by the structure (I):
to covalently bond a substituted phenyl radical to a surface of the hexagonal boron nitride particles, the substituted phenyl radical being represented by the structure (II):
wherein X is a radical selected from NH2—, HO—, R2OC(O)—, R2C(O)O—, HSO3—, NH2CO—, halogens, alkyl and substituted or unsubstituted aryl; wherein R1 is alkyl or alkoxy, and R2 is hydrogen, alkyl, or substituted or unsubstituted aryl.

### Claim 11 (depends on 10)

The process of claim 10 wherein R1 is hydrogen, and X is NH2—.

### Claim 12 (depends on 10)

The process of claim 10 wherein R1 is hydrogen, and X is HO—.

### Claim 13 (depends on 10)

The process of claim 10 wherein the polymer is polyamic acid.

### Claim 14 (depends on 10)

The process of claim 10 wherein the polymer is an uncured epoxy resin composition.

### Claim 15 (depends on 10)

The process of claim 10 wherein the SMhBN particles have a size within the range of 0.5 to 50 μm.