# US 8,784,702 B2 · Copper-containing nanoparticles and manufacturing method therefor

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- Number: US 8,784,702 B2
- Document ID: US8784702B2
- Status: Granted
- Kind: B2
- Application number: 13/058,681
- Filed: 2009-08-06
- Published: 2011-08-11
- Granted: 2014-07-22
- Earliest claimed: 2008-08-11
- Assignees: Osaka Municipal Technical Research Institute; Daiken Chemical Co., Ltd.
- Applicants: Masami Nakamoto; Mari Yamamoto; Yukiyasu Kashiwagi; Yukio Yoshida; Hiroshi Kakiuchi; Shinsuke Matsumura
- Inventors: Masami Nakamoto; Mari Yamamoto; Yukiyasu Kashiwagi; Yukio Yoshida; Hiroshi Kakiuchi; Shinsuke Matsumura
- Web page: https://patentgrep.com/patent/US8784702B2

## CPC

- B22F 9/18: with reduction of metal compounds
- B22F 1/054: Nanosized particles
- B22F 1/102: Metallic powder coated with organic material
- B22F 9/30: with decomposition of metal compounds, e.g. by pyrolysis
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- C01G 3/02: Oxides; Hydroxides
- C07F 1/005: {without C-Metal linkages}
- C09C 1/622: {Comminution, shaping or abrasion of initially uncoated particles, possibly in presence of grinding aids, abrasives or chemical treating or coating agents; Particle solidification from melted or vaporised metal; Classification}
- B22F 2999/00: Aspects linked to processes or compositions used in powder metallurgy
- C01P 2002/72: by d-values or two theta-values, e.g. as X-ray diagram
- C01P 2002/88: by thermal analysis data, e.g. TGA, DTA, DSC
- C01P 2004/04: obtained by TEM, STEM, STM or AFM
- C01P 2004/51: Particles with a specific particle size distribution
- C01P 2004/64: Nanometer sized, i.e. from 1-100 nanometer
- Y10T 428/12181: Composite powder [e.g., coated, etc.]
- Y10T 428/2991: Coated
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- C01G: COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F (metal hydrides {monoborane, diborane or addition complexes thereof} C01B6/00; salts of oxyacids of halogens C01B11/00; peroxides, salts or peroxyacids C01B15/00; thiosulfates, dithionites, polythionates C01B17/64; compounds containing selenium, or tellurium C01B19/00; binary compounds of nitrogen with metals C01B21/06; azides C01B21/08; {compounds containing nitrogen, other non-metals and metal C01B21/082}; metal amides C01B21/092; nitrites C01B21/50; {compounds of noble gases C01B23/0005}; phosphides C01B25/08; salts of oxyacids of phosphorus C01B25/16; carbides C01B32/90; compounds containing silicon C01B33/00; compounds containing boron C01B35/00; compounds having molecular sieve properties but not having base-exchange properties C01B37/00; compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites, C01B39/00; cyanides C01C3/08; salts of cyanamide C01C3/16; thiocyanates C01C3/20)
- C07F: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins C07D487/22)
- C09C: TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES (treatment of materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone C04B14/00, C04B18/00, C04B20/00); PREPARATION OF CARBON BLACK {; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS}
- C01P: INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Copper-containing nanoparticles with excellent oxidation resistance is provided. The present invention relates to a method for manufacturing copper-containing nanoparticles including obtaining copper-containing nanoparticles that contain an organic component by heat treating an organic copper compound at a temperature equal to or higher than a decomposition initiation temperature of the compound and lower than a complete decomposition temperature of the compound in a non-oxidative atmosphere in the presence of an organic material containing a 1,2-alkanediol having 5 or more carbon atoms and/or a derivative thereof.

## Claims

### Claim 1

A method for manufacturing copper-containing nanoparticles, comprising a step of obtaining nanoparticles containing an organic component, copper and cuprous oxide by heat treating an organic copper compound at a temperature equal to or higher than a decomposition initiation temperature of the compound and lower than a complete decomposition temperature of the compound in a non-oxidative atmosphere in the presence of an organic material containing (1) a tertiary amine compound and (2) a 1,2-alkanediol and/or a derivative thereof, wherein the number of carbon atoms in the 1,2-alkanediol or a derivative thereof is 8 to 30.

### Claim 2 (depends on 1)

The manufacturing method according to claim 1, wherein the organic copper compound is a copper salt of an organic acid having 5 or more carbon atoms.

### Claim 3 (depends on 1)

The manufacturing method according to claim 1, wherein heat treatment is performed under conditions with no primary amine or secondary amine present.

### Claim 4

Copper-containing, nanoparticles comprising an organic component, Cu and Cu2O in each particle, wherein an intensity ratio of Cu2O in an X-ray diffraction pattern is 50% or less given 100% as the total of intensities of Cu and Cu2O, and wherein the organic component contains at least one of a 1,2-alkanediol with 5 or more carbon atoms, a derivative thereof and a component derived from these.

### Claim 5 (depends on 4)

The copper-containing nanoparticles according to claim 4, wherein the content of the organic component is 25 wt % or less.

### Claim 6 (depends on 4)

The copper-containing nanoparticles according to claim 4, wherein the change in the intensities of the Cu and Cu2O in the X-ray diffraction pattern immediately after oxidation resistance testing in which the copper-containing nanoparticles immediately after synthesis is left for 1 month at a temperature of 25° C. and a humidity of 60% in air is no more than 3% of intensities of the Cu and Cu2O in the X-ray diffraction pattern of the copper-containing nanoparticles immediately after synthesis.

### Claim 7 (depends on 1, 4)

The copper-containing nanoparticles according to claim 4, which is obtained by the manufacturing method according to claim 1.

### Claim 8 (depends on 4)

A paste comprising the copper-containing nanoparticles according to claim 4 and at least one of a solvent and a viscosity modifying resin.