# US 8,784,638 B2 · Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board

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- Number: US 8,784,638 B2
- Document ID: US8784638B2
- Status: Granted
- Kind: B2
- Application number: 13/654,873
- Filed: 2012-10-18
- Published: 2013-02-14
- Granted: 2014-07-22
- Earliest claimed: 2007-05-22
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Applicants: Toyota Jidosha Kabushiki Kaisha; Kabushiki Kaisha Toyota Jidoshokki
- Inventors: Takeshi Bessho; Kyoko Kumagai; Takashi Yoshida; Manabu Osamura; Toshihisa Shimo
- Web page: https://patentgrep.com/patent/US8784638B2

## CPC

- C23C 18/2086: {with use of organic or inorganic compounds other than metals, first}
- C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
- C23C 18/1694: {Sequential heat treatment}
- C23C 18/2006: {by other methods than those of C23C18/22 - C23C18/30}
- C23C 18/2033: {Heat}
- H05K 3/381: {by special treatment of the substrate}
- H05K 3/181: {by electroless plating (adhesives therefor H05K3/387)}
- H05K 2203/087: Using a reactive gas
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

## Claims

### Claim 1

A method of manufacturing a wiring board, wherein the wiring board comprises:
a resin board treated with an ozone solution, the resin board comprising a mixture of a plurality of types of resins, the mixture containing an aromatic cyanate compound and an aromatic epoxy resin,
a resin-metal composite layer which is formed integrally on a surface of the resin board and in which fine metal particles are uniformly dispersed in a resin matrix; and
a wiring portion that comprises a plating film formed in a predetermined pattern on the resin-metal composite layer, wherein
the resin-metal composite layer has a thickness of 10 to 200 nm and the wiring portion includes a fine wiring pattern having L/S =10/10 μm or less,
the method comprising:
an ozone treatment step of treating the resin board with the ozone solution so as to form a reformed layer having polar groups on a surface thereof;
an adsorption step of bringing the reformed layer into contact with a metal compound solution so that at least one of colloidal particles and ions of a catalyst metal are attached to the polar groups and fine particles of the catalyst metal are dispersed in the reformed layer, thereby forming the resin-metal composite layer; and
a plating step of performing a plating process on the resin-metal composite layer so as to form the wiring portion;
a heat treating step of heating the resin board; and
an etching step of removing an unnecessary portion of the resin-metal composite layer other than the wiring portion, wherein
the ozone treatment step, the adsorption step and the plating step, the heat treatment step, and the etching step are carried out in the order of description.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the aromatic cyanate compound is selected from the group consisting of bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylenecyanate)), 4,4′-methylenebis (2,6-dimethyl-phenylcyanate), and 4,4′-ethylidenephenyldicyanate, hexafluorobisphenol A dicyanate.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the aromatic epoxy resin is selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, epoxides of condensation compounds of phenols and aromatic aldehyde having a phenolic hydroxyl group, naphthalene type epoxy resin, triglycidyl isocyanurate, brominated epoxy resins thereof, and phosphorous modified epoxy resins thereof.