# US 8,784,618 B2 · Working electrode design for electrochemical processing of electronic components

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- Number: US 8,784,618 B2
- Document ID: US8784618B2
- Status: Granted
- Kind: B2
- Application number: 12/806,719
- Filed: 2010-08-19
- Published: 2012-02-23
- Granted: 2014-07-22
- Earliest claimed: 2010-08-19
- Assignees: International Business Machines Corporation
- Applicants: Charles L. Arvin; Raschid J. Bezama; Glen N. Biggs; Hariklia Deligianni; Tracy A. Tong
- Inventors: Charles L. Arvin; Raschid J. Bezama; Glen N. Biggs; Hariklia Deligianni; Tracy A. Tong
- Web page: https://patentgrep.com/patent/US8784618B2

## CPC

- C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells}
- C25D 5/04: Electroplating with moving electrodes
- C25D 17/02: Tanks; Installations therefor
- C25D 17/12: Shape or form (C25D17/14 takes precedence)
- C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer}
- C25D 17/004: {Sealing devices}
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

## Claims

### Claim 1

An electrode system of an electroplating apparatus, the electrode system comprising:
a working electrode comprising a supported portion and an exposed portion, wherein the exposed portion defines a plating surface;
a thief electrode that is separated from the working electrode, wherein an exterior face of the thief electrode is offset from the plating surface of the working electrode; and
a holder configured to support the working electrode, the holder comprising a lip portion comprising:
a first surface extending over and directly contacting the supported portion of the working electrode, and
a second surface opposing the first surface and directly contacting the thief electrode,
wherein the thief electrode comprises a rim portion extending beyond an edge of the lip portion of the holder and overlapping the plating surface of the working electrode about a perimeter of the working electrode, and
wherein the working electrode and the thief electrode are configured to be in electrical communication with at least one power supply.

### Claim 2 (depends on 1)

The electrode system of claim 1, wherein the thief electrode comprises a window that exposes a centralized portion of the plating surface of the working electrode.

### Claim 3 (depends on 1)

The electrode system of claim 1, wherein the working electrode has a circular geometry and the thief electrode has a circular geometry.

### Claim 4 (depends on 1)

The electrode system of claim 1, wherein the working electrode is multi-sided and the thief electrode is multi-sided.

### Claim 5 (depends on 1)

The electrode system of claim 1, wherein the thief electrode is a mesh electrode.

### Claim 6 (depends on 1)

The electrode system of claim 1, wherein the thief electrode is a solid electrode.

### Claim 7 (depends on 1)

The electrode system of claim 1, wherein the working electrode is composed of Cu, Cu, Ag, Ni, Fe, Al, Zn, Pd, platinized Ti, Co, Mo, Sn Ta, Ir, Pt, Pb, Bi, Cr, Nb, Zr, Au, SS 304, SS 316, Ti or combinations or alloys thereof.

### Claim 8 (depends on 1)

The electrode system of claim 1, wherein the thief electrode is composed of Cu, Ag, Ni, Fe, Al, Zn, Pd, platinized Ti, Co, Mo, Sn Ta, Ir, Pt, Pb, Bi, Cr, Nb, Zr, Au, SS 304, SS 316, Ti or combinations or alloys thereof.

### Claim 9 (depends on 1)

The electrode system of claim 1, wherein the electrode system is employed in a continuous roll to roll plating system, wherein the thief electrode is mounted to the holder and is continuously traversed through a plating tank, wherein a counter electrode is stationary and is mounted to the plating tank.