# US 8,784,147 B2 · Composite assembly for an electrical connector and method of manufacturing the composite assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,784,147 B2 - Document ID: US8784147B2 - Status: Granted - Kind: B2 - Application number: 13/526,127 - Filed: 2012-06-18 - Published: 2012-12-13 - Granted: 2014-07-22 - Earliest claimed: 2009-06-09 - Assignees: Tyco Electronics Corporation - Applicants: Mary Elizabeth Sullivan; Robert Daniel Hilty - Inventors: Mary Elizabeth Sullivan; Robert Daniel Hilty - Web page: https://patentgrep.com/patent/US8784147B2 ## CPC - C25D 9/08: by cathodic processes - C25D 9/02: with organic materials - C25D 9/04: with inorganic materials - C25D 13/02: with inorganic material - C25D 13/04: with organic material - H01R 13/03: characterised by the material, e.g. plating, or coating materials - H01R 13/6586: for separating multiple connector modules - H10D 1/682: {having dielectrics comprising perovskite structures} - H10D 1/696: {comprising multiple layers, e.g. comprising a barrier layer and a metal layer (barrier layers to prevent diffusion of hydrogen or oxygen in perovskite based capacitors H10D1/688)} - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A method of manufacturing a composite assembly includes providing a fluid bath and adding a ceramic material to the fluid bath. The ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating. The method further includes immersing at least part of a conductive substrate in the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate, whereby the ceramic material is electrodeposited onto the conductive substrate as at least a portion of a dielectric layer. ## Claims ### Claim 1 A method of manufacturing a composite assembly for an electrical connector, the method comprising: providing a fluid bath; adding a ceramic material to the fluid bath, wherein the ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating; immersing at least part of a conductive substrate in the fluid bath; and applying a voltage potential between the fluid bath and the conductive substrate, whereby the ceramic material is electrodeposited onto the conductive substrate as at least a portion of a dielectric layer. ### Claim 2 (depends on 1) The method of claim 1, further comprising adding a polymer to the fluid bath, whereby the polymer and the ceramic material are concurrently electrodeposited onto the conductive substrate. ### Claim 3 (depends on 2) The method of claim 2, wherein the polymer and the ceramic material have substantially similar throw powers, and wherein the polymer and the ceramic material are electrodeposited at about the same rate. ### Claim 4 (depends on 2) The method of claim 2, wherein the polymer and the ceramic material have substantially different throw powers, and wherein the polymer and the ceramic material are electrodeposited at substantially different rates corresponding to the substantially different throw powers. ### Claim 5 (depends on 1) The method of claim 1, wherein the ceramic material comprises a plurality of substantially pure crystal particles less than about 250 nanometers in diameter. ### Claim 6 (depends on 1) The method of claim 1, wherein the ceramic material comprises a plurality of coated particles that have a non-conductive coating. ### Claim 7 (depends on 1) The method of claim 1, further comprising electrodepositing an additional conductive layer onto the dielectric layer. ### Claim 8 (depends on 7) The method of claim 7, further comprising electrodepositing an additional dielectric layer onto the additional conductive layer. ### Claim 9 A method of manufacturing a composite assembly for an electrical connector, the method comprising: providing a fluid bath; adding a ceramic material to the fluid bath, wherein the ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating; adding a polymer to the fluid bath, wherein the polymer comprises a plurality of polymer particles, wherein the plurality of polymer particles is devoid of a conductive coating; immersing at least part of a conductive substrate in the fluid bath; and applying a voltage potential between the fluid bath and the conductive substrate, whereby the plurality of ceramic particles and the plurality of polymer particles are concurrently electrodeposited onto the conductive substrate as a dielectric layer. ### Claim 10 (depends on 9) The method of claim 9, wherein the polymer and the ceramic material have substantially similar throw powers, and wherein the polymer and the ceramic material are electrodeposited at about the same rate. ### Claim 11 (depends on 9) The method of claim 9, wherein the polymer and the ceramic material have substantially different throw powers, and wherein the polymer and the ceramic material are electrodeposited at substantially different rates corresponding to the substantially different throw powers. ### Claim 12 (depends on 9) The method of claim 9, wherein the ceramic material comprises a plurality of substantially pure crystal particles less than about 250 nanometers in diameter. ### Claim 13 (depends on 9) The method of claim 9, wherein the ceramic material comprises a plurality of coated particles that have a non-conductive coating. ### Claim 14 (depends on 9) The method of claim 9, further comprising electrodepositing an additional conductive layer onto the dielectric layer. ### Claim 15 (depends on 14) The method of claim 14, further comprising electrodepositing an additional dielectric layer onto the additional conductive layer. ### Claim 16 An electrical contact, the contact comprising: a first conductive substrate; a second conductive substrate; and an electrodeposited thin film layer interposed between the first and second conductive substrates, the electrodeposited thin film layer comprising a ceramic material, the ceramic material comprising a plurality of ceramic particles devoid of a conductive coating. ### Claim 17 (depends on 16) The electrical contact of claim 16 wherein the electrodeposited thin film layer further comprises a plurality of electrodeposited polymer particles. ### Claim 18 (depends on 16) The electrical contact of claim 16, wherein the ceramic material comprises a plurality of substantially pure crystal particles less than about 250 nanometers in diameter. ### Claim 19 (depends on 16) The electrical contact of claim 16, further comprising one or more additional dielectric layers and one or more additional conductive layers.