# US 8,783,915 B2 · Surface-textured encapsulations for use with light emitting diodes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,783,915 B2 - Document ID: US8783915B2 - Status: Granted - Kind: B2 - Application number: 12/978,204 - Filed: 2010-12-23 - Published: 2011-12-29 - Granted: 2014-07-22 - Earliest claimed: 2010-02-11 - Assignees: Bridgelux, Inc. - Applicants: Tao Xu - Inventors: Tao Xu - Web page: https://patentgrep.com/patent/US8783915B2 ## CPC - H10H 20/853: characterised by their shape - H10H 20/85: Packages - H10H 20/8512: {Wavelength conversion materials} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10W 90/00: Package configurations - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H 20/882: {Scattering means (H10H20/82 takes precedence)} - H10W 74/10: characterised by their shape or disposition - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs. ## Claims ### Claim 1 A light emitting diode (LED) array apparatus comprising: a plurality of LEDs mounted to a substrate; and an encapsulation comprising a plurality of regions, the encapsulation covering the plurality of LEDs and each region of the encapsulation having a different surface texture configured to extract light, wherein each surface texture comprises a plurality of light extracting features, each of the light extracting features having a diameter larger than two or more of the LEDs, wherein the light extracting features have varying dimensions. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the diameter is greater than 1 millimeter. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the diameter is less than 50 millimeters. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the plurality of light extracting features comprises first and second light extracting features having respective diameters larger than two or more of the LEDs. ### Claim 5 (depends on 4) The apparatus of claim 4, wherein the respective diameters of the first and second light extracting features are either the same or different. ### Claim 6 (depends on 4) The apparatus of claim 4, wherein each of the first and second light extracting features are selected from a set of features comprising hemispheres, cones, pyramids, and random shapes. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein said encapsulation comprises at least one material selected from silicone and phosphor. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein said encapsulating is formed using a process selected from a set of processes comprising stamping, molding, pattern transferring, and thin film deposition. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the plurality of light extracting features is selected from a set comprising hemispheres, cones, pyramids, and random shapes. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein said encapsulation has an overall shape that is substantially flat. ### Claim 11 (depends on 1) The apparatus of claim 1, wherein said encapsulation has an overall shape that is domed wherein a center portion is higher than side portions. ### Claim 12 A method for forming a light emitting diode (LED) array apparatus comprising: mounting a plurality of LEDs to a substrate; and encapsulating the plurality of LEDs with an encapsulation comprising a plurality of regions, each region of the encapsulation having a different surface texture configured to extract light, wherein each surface texture comprises a plurality of light extracting features, each of the light extracting features having a diameter larger than two or more of the LEDs, wherein the light extracting features have varying dimensions. ### Claim 13 (depends on 12) The method of claim 12, wherein said encapsulating comprises forming the surface texture using at least one process selected from a set of processes comprising stamping, molding, pattern transferring, and thin film deposition. ### Claim 14 (depends on 12) The method of claim 12, further comprising selecting plurality of light extracting features from a set of features comprising hemispheres, cones, pyramids, and random shapes. ### Claim 15 (depends on 12) The method of claim 12, further comprising configuring the plurality of light extracting features to comprises first and second light extracting features having respective diameters larger than two or more of the LEDs. ### Claim 16 (depends on 15) The method of claim 15, further comprising setting the respective diameters of the first and second light extracting features to be either the same or different. ### Claim 17 (depends on 12) The method of claim 12, wherein said encapsulating comprises encapsulating at least one of the plurality of light extracting feature so that the diameter is greater than 1 millimeter. ### Claim 18 (depends on 12) The method of claim 12, wherein said encapsulating comprises encapsulating at least one of the plurality of light extracting feature so that the diameter is less than 50 millimeters. ### Claim 19 (depends on 12) The method of claim 12, wherein said encapsulating comprises encapsulating the plurality of LEDs with at least one material selected from silicone and phosphor. ### Claim 20 A lamp having a light emitting diode (LED) array apparatus comprising: a package; a plurality of LEDs mounted to a substrate; and an encapsulation comprising a plurality of regions, the encapsulation covering the plurality of LEDs and each region of the encapsulation having a different surface texture configured to extract light, wherein each surface texture comprises a plurality of light extracting features, each of the light extracting features having a diameter larger than two or more of the LEDs, wherein the light extracting features have varying dimensions.