# US 8,783,911 B2 · LED packaging structure having improved thermal dissipation and mechanical strength > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,783,911 B2 - Document ID: US8783911B2 - Status: Granted - Kind: B2 - Application number: 13/399,027 - Filed: 2012-02-17 - Published: 2013-08-22 - Granted: 2014-07-22 - Earliest claimed: 2012-02-17 - Assignees: TSMC Solid State Lighting Ltd. - Applicants: Yi-Tsuo Wu - Inventors: Yi-Tsuo Wu - Web page: https://patentgrep.com/patent/US8783911B2 ## CPC - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21K 9/20: Light sources comprising attachment means - F21Y 2115/10: Light-emitting diodes [LED] - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 90/753: {between laterally-adjacent chips} - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate. ## Claims ### Claim 1 A lighting apparatus, comprising: a thermally-conductive substrate; a first conductive pad and a second conductive pad each disposed over the thermally-conductive substrate; a printed circuit board located besides the thermally-conductive substrate, the printed circuit board and the thermally-conductive substrate having different material compositions; a third conductive pad disposed over the printed circuit board; a fourth conductive pad disposed over both the second conductive pad and the third conductive pad; a photonic device located over the first conductive pad, the photonic device being thermally coupled to the thermally-conductive substrate via the first conductive pad and electrically coupled to the printed circuit board via the second, third, and fourth conductive pads; and a thermal dissipation structure thermally coupled to the thermally-conductive substrate. ### Claim 2 (depends on 1) The lighting apparatus of claim 1, wherein the thermally-conductive substrate includes a silicon substrate or a ceramic substrate free of electrical routing therein. ### Claim 3 (depends on 1) The lighting apparatus of claim 1, wherein the photonic device is thermally coupled to the thermally-conductive substrate through a thermally conductive but electrically insulating layer. ### Claim 4 (depends on 1) The lighting apparatus of claim 1, wherein the photonic device includes one or more light-emitting diode (LED) dies. ### Claim 5 (depends on 1) The lighting apparatus of claim 1, wherein the thermally-conductive substrate is surrounded by the printed circuit board in a top view. ### Claim 6 (depends on 1) The lighting apparatus of claim 1, wherein a sidewall of the thermally-conductive substrate is spaced apart from a sidewall of the printed circuit board. ### Claim 7 (depends on 1) The lighting apparatus of claim 1, wherein the printed circuit board is attached to the thermal dissipation structure by one or more screws. ### Claim 8 (depends on 1) The lighting apparatus of claim 1, wherein the photonic device and the thermal dissipation structure are located on opposite sides of the thermally-conductive substrate. ### Claim 9 A photonic lighting module, comprising: a heat sink; a substrate disposed over the heat sink and thermally coupled to the heat sink; a printed circuit board substrate disposed over the heat sink, the printed circuit board substrate surrounding the substrate; a plurality of metal pads disposed at least partially over the substrate and over the printed circuit board substrate, wherein at least one of the metal pads is disposed partially over both the substrate and the printed circuit board substrate; and one or more light-emitting devices disposed on a subset of the metal pads; wherein: the one or more light-emitting devices are thermally coupled to the heat sink through the substrate; the one or more light-emitting devices are electrically coupled to the printed circuit board substrate through the metal pads; and the at least one of the metal pads is disposed directly above a first one and a second one of the metal pads, the first one of the metal pads being disposed over the substrate, and the second one of the metal pads being disposed over the printed circuit board substrate. ### Claim 10 (depends on 9) The photonic lighting module of claim 9, wherein the light-emitting devices include light-emitting diodes. ### Claim 11 (depends on 9) The photonic lighting module of claim 9, further comprising: an electrically-insulating layer disposed between the substrate and the one or more light-emitting devices; and a thermally-conductive layer disposed between the substrate and the heat sink, the electrically-insulating layer and the thermally-conductive layer being disposed on opposite sides of the substrate. ### Claim 12 (depends on 9) The photonic lighting module of claim 9, wherein the substrate is free of being in physical contact with the printed circuit board substrate. ### Claim 13 (depends on 9) The photonic lighting module of claim 9, further comprising a cap disposed over the substrate, wherein the cap houses the one or more light-emitting devices therein. ### Claim 14 (depends on 9) The photonic lighting module of claim 9, wherein: the printed circuit board substrate contains electrical routing circuitry; and the substrate contains no electrical routing circuitry, and wherein the substrate contains silicon or ceramic. ### Claim 15 A packaging structure for a light-emitting device, comprising: a printed circuit board structure having an opening extending therethrough; a substrate positioned within the opening of the printed circuit board structure; a heat sink on which the printed circuit board structure and the substrate are located; a first metal pad located over the substrate, wherein the light-emitting device is thermally coupled to the first metal pad; a second metal pad located over the printed circuit board structure, wherein the second metal pad is electrically coupled to the light-emitting device; and a third metal pad disposed partially over both the substrate and the printed circuit board structure, wherein the third metal pad is electrically coupled to the second metal pad through a conductive material or metal and to the light-emitting device through a bonding wire, and wherein the third metal pad is disposed over both the first metal pad and the second metal pad. ### Claim 16 (depends on 15) The packaging structure of claim 15, wherein the light-emitting device includes a light-emitting diode die, and wherein the substrate is one of: a silicon substrate and a ceramic substrate. ### Claim 17 (depends on 15) The packaging structure of claim 15, wherein a sidewall of the substrate is free of being in physical contact with a sidewall of the printed circuit board structure. ### Claim 18 (depends on 15) The packaging structure of claim 15, further comprising a cap disposed over the substrate and housing the light-emitting device therein.