# US 8,783,899 B2 · Light bar assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,783,899 B2 - Document ID: US8783899B2 - Status: Granted - Kind: B2 - Application number: 13/688,983 - Filed: 2012-11-29 - Published: 2013-08-22 - Granted: 2014-07-22 - Earliest claimed: 2012-02-21 - Assignees: Lextar Electronics Corporation - Applicants: Lextar Electronics Corporation - Inventors: Ming-Hua Tsai; Chen-I Lu - Web page: https://patentgrep.com/patent/US8783899B2 ## CPC - F21V 21/00: Supporting, suspending, or attaching arrangements for lighting devices (F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00); Hand grips - F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers - F21V 31/00: Gas-tight or water-tight arrangements - H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit} - F21V 23/06: the elements being coupling devices {, e.g. connectors} - F21Y 2103/10: comprising a linear array of point-like light-generating elements - F21Y 2113/00: Combination of light sources - F21Y 2115/10: Light-emitting diodes [LED] - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 3/3405: {Edge mounted components, e.g. terminals} - H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10287: Metal wires as connectors or conductors - H05K 2201/10363: Jumpers, i.e. non-printed cross-over connections - Y10S 362/80: Light emitting diode - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate. ## Claims ### Claim 1 A light bar assembly, comprising: a first substrate, comprising: a first edge and a second edge parallel to each other and arranged along a first direction; a first connecting end connected to the first edge and the second edge, the first connecting end having a first connecting portion and a second connecting portion, the edge of the first connecting portion protruding further outward than the edge of the second connecting portion; a first bonding pad and a second bonding pad disposed on the first substrate, wherein the first bonding pad and the second bonding pad are disposed near the edge of the first connecting portion and the edge of the second connecting portion, respectively; and a plurality of first solid-state semiconductor light sources disposed interlacedly on the first substrate along the first edge and the second edge, wherein at least one first solid-state semiconductor light source is located beside the first bonding pad of the first connecting portion and partially overlaps the second bonding pad, and at least one first solid-state semiconductor light source is located beside the second bonding pad of the second connecting portion; a second substrate, comprising: a third edge and a fourth edge parallel to each other and arranged along a first direction; a second connecting end connected to the third edge and the fourth edge, the second connecting end having a third connecting portion and a fourth connecting portion, the edge of the third connecting portion protruding further outward than the edge of the fourth connecting portion; a third bonding pad and a fourth bonding pad disposed on the second substrate, wherein the third bonding pad and the fourth bonding pad are disposed near the edge of the third connecting portion and the edge of the fourth connecting portion, respectively; and a plurality of second solid-state semiconductor light sources disposed interlacedly on the second substrate along the third edge and the fourth edge, wherein at least one second solid-state semiconductor light source is located beside the third bonding pad of the third connecting portion and partially overlaps the fourth bonding pad and at least one second solid-state semiconductor light source is located beside the fourth bonding pad of the fourth connecting portion. a first connecting device electrically connected to the first bonding pad and the fourth bonding pad, wherein the first connecting device, the first bonding pad, and the fourth bonding pad overlap the second solid-state semiconductor light source closest to the third bonding pad; and a second connecting device electrically connected to the second bonding pad and the third bonding pad, wherein the second connecting device, the second bonding pad, and the third bonding pad overlap the first solid-state semiconductor light source closest to the first bonding pad; wherein the first connecting portion and the second connecting portion of the first substrate complementarily join the fourth connecting portion and the third connecting portion of the second substrate to form a light bar assembly. ### Claim 2 (depends on 1) The light bar assembly of claim 1, wherein the first connecting end and the second connecting end are complementary inclined faces or inlay faces. ### Claim 3 (depends on 2) The light bar assembly of claim 2, wherein the first solid-state semiconductor light sources and the second solid-state semiconductor light sources are light emitting diodes. ### Claim 4 (depends on 3) The light bar assembly of claim 3, wherein the first solid-state semiconductor light sources and the second solid-state semiconductor light sources each has a longitudinal axis arranged along the first direction. ### Claim 5 (depends on 1) The light bar assembly of claim 1, wherein the first connecting device and the second connecting device are conducting wires or connectors. ### Claim 6 (depends on 5) The light bar assembly of claim 5, wherein the wavelength of the first solid-state semiconductor light sources and the wavelength of the second solid-state semiconductor light sources are the same or different.