# US 8,783,333 B1 · Cooling system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,783,333 B1 - Document ID: US8783333B1 - Status: Granted - Kind: B1 - Application number: 12/638,673 - Filed: 2009-12-15 - Granted: 2014-07-22 - Earliest claimed: 2009-12-15 - Assignees: EMC Corporation - Applicants: John K. Bowman; Stephen J. Keefe - Inventors: John K. Bowman; Stephen J. Keefe - Web page: https://patentgrep.com/patent/US8783333B1 ## CPC - G06F 1/20: Cooling means - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - G11B 33/1413: {by fluid cooling} - G06F 2200/201: Cooling arrangements using cooling fluid - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) ## Abstract A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly. ## Claims ### Claim 1 A cooling system comprising: an evaporator assembly configured to thermally contact a plurality of memory modules and absorb thermal energy from the plurality of memory modules; and a condenser assembly thermally coupled to the evaporator assembly via a plurality of tubing assemblies, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent memory modules, wherein the condenser assembly is configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly, and wherein each of the plurality of tubing assemblies include a plurality of thermally-conductive deflectable members spaced apart from one another, wherein the plurality of thermally-conductive deflectable members partially encase each of the plurality of tubing assemblies and conform to a shape of each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members separate the plurality of memory modules from directly contacting the plurality of tubing assemblies. ### Claim 2 (depends on 1) The cooling system of claim 1 wherein the cooling system is a heatpipe cooling system. ### Claim 3 (depends on 1) The cooling system of claim 1 further comprising a cooling fluid configured to be at least partially evaporated within the evaporator assembly and at least partially condensed within the condenser assembly. ### Claim 4 (depends on 3) The cooling system of claim 3 wherein the cooling fluid is chosen from the group consisting of water, ethanol, acetone, sodium, and mercury. ### Claim 5 (depends on 1) The cooling system of claim 1 wherein the plurality of thermally-conductive deflectable members are configured to contact a surface of the plurality of memory modules. ### Claim 6 (depends on 1) The cooling system of claim 1 wherein at least one of the plurality of memory modules includes an inline memory module. ### Claim 7 A cooling system comprising: an evaporator assembly configured to thermally contact a plurality of heat-producing devices and absorb thermal energy from the plurality of heat-producing devices; and a condenser assembly thermally coupled to the evaporator assembly via a plurality of tubing assemblies, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent heat-producing devices, wherein the condenser assembly is configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly; wherein each of the plurality of tubing assemblies is partially encased in a plurality of thermally-conductive deflectable members spaced apart from one another, wherein the plurality of thermally-conductive deflectable members conform to a shape of each of the plurality of tubing assemblies; wherein the plurality of thermally-conductive deflectable members separate the plurality of heat-producing devices from directly contacting the plurality of tubing assemblies. ### Claim 8 (depends on 7) The cooling system of claim 7 wherein the cooling system is a heatpipe cooling system. ### Claim 9 (depends on 7) The cooling system of claim 7 further comprising a cooling fluid configured to be at least partially evaporated within the evaporator assembly and at least partially condensed within the condenser assembly. ### Claim 10 (depends on 7) The cooling system of claim 7 wherein the cooling fluid is chosen from the group consisting of water, ethanol, acetone, sodium, and mercury. ### Claim 11 (depends on 7) The cooling system of claim 7 wherein at least one of the plurality of heat-producing devices is chosen from the group consisting of: a memory module, a processor assembly, an integrated circuit assembly, an electro-mechanical storage device, and a solid state storage device. ### Claim 12 (depends on 11) The cooling system of claim 11 wherein the memory module is an inline memory module. ### Claim 13 A cooling system comprising: an evaporator assembly configured to thermally contact a plurality of memory modules and absorb thermal energy from the plurality of memory modules; a condenser assembly thermally coupled to the evaporator assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly; and a plurality of tubing assemblies configured to thermally couple the evaporator assembly with the condenser assembly, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent memory modules; wherein each of the plurality of tubing assemblies include a plurality of thermally-conductive deflectable members spaced apart from one another configured to partially encase each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members conform to a shape of each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members contact a surface of the one or more memory modules; wherein the plurality of thermally-conductive deflectable members separate the plurality of memory modules from directly contacting the plurality of tubing assemblies. ### Claim 14 (depends on 13) The cooling system of claim 13 wherein the cooling system is a heatpipe cooling system. ### Claim 15 (depends on 13) The cooling system of claim 13 further comprising a cooling fluid configured to be at least partially evaporated within the evaporator assembly and at least partially condensed within the condenser assembly. ### Claim 16 (depends on 13) The cooling system of claim 13 wherein the cooling fluid is chosen from the group consisting of water, ethanol, acetone, sodium, and mercury. ### Claim 17 (depends on 13) The cooling system of claim 13 wherein at least one of the plurality of memory modules is an inline memory module. ### Claim 18 (depends on 7) The cooling system of claim 7 wherein the plurality of thermally-conductive deflectable members contact a surface of the plurality of heat-producing devices.