# US 8,782,882 B2 · Method of manufacturing multi-layer printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,782,882 B2 - Document ID: US8782882B2 - Status: Granted - Kind: B2 - Application number: 13/169,736 - Filed: 2011-06-27 - Published: 2011-10-20 - Granted: 2014-07-22 - Earliest claimed: 1999-06-02 - Assignees: Ibiden Co., Ltd. - Applicants: Motoo Asai; Dongdong Wang; Takahiro Mori - Inventors: Motoo Asai; Dongdong Wang; Takahiro Mori - Web page: https://patentgrep.com/patent/US8782882B2 ## CPC - H05K 3/423: {characterised by electroplating method} - H05K 3/0038: {combined with laser drilling through a metal layer} - H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)} - H05K 3/387: {for electroless plating (H05K3/4661 takes precedence)} - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H10W 70/095: {of vias therein} - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H05K 1/036: {Multilayers with layers of different types} - H05K 3/0032: {of organic insulating material} - H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom} - H05K 3/181: {by electroless plating (adhesives therefor H05K3/387)} - H05K 3/381: {by special treatment of the substrate} - H05K 3/385: {by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer} - H05K 3/388: {by the use of a metallic or inorganic thin film adhesion layer} - H05K 3/426: {initial plating of through-holes in substrates without metal} - H05K 3/427: {initial plating of through-holes in metal-clad substrates} - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/0352: Differences between the conductors of different layers of a multilayer - H05K 2201/0355: Metal foils - H05K 2201/0394: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts - H05K 2201/09536: Buried plated through-holes, i.e. plated through-holes formed in a core before lamination - H05K 2201/09563: Metal filled via - H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material - H05K 2201/096: Vertically aligned vias, holes or stacked vias - H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses - H05K 2201/09881: Coating only between conductors, i.e. flush with the conductors - H05K 2203/0315: Oxidising metal - H05K 2203/0733: Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls - H05K 2203/0773: Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler - H05K 2203/1476: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning - H10W 70/655: Fan-out layouts - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/90: Bond pads, in general - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49126: Assembling bases - Y10T 29/49144: by metal fusion - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes. ## Claims ### Claim 1 A method of manufacturing a printed circuit board, comprising: laminating a resin insulating layer on each of two sides of a core member to form a core substrate; forming a plurality of penetrating openings in said core substrate by applying laser beams; forming a rough surface on said core substrate; and providing a metal film in each of the penetrating openings to form a plurality of through holes, respectively. ### Claim 2 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, wherein said core member is formed by impregnating a core material with a resin material. ### Claim 3 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, wherein said resin insulating layer is formed by dispersing soluble particles in a refractory resin material. ### Claim 4 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, wherein said core member comprises a core material and a resin material impregnated to the core material. ### Claim 5 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, wherein said resin insulating layer comprises a refractory resin material and soluble particles dispersed in the refractory resin material. ### Claim 6 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising impregnating a core material with a resin material such that the core member comprising the core material and the resin material is formed. ### Claim 7 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising dispersing soluble particles in a refractory resin material such that said resin insulating layer comprising the refractory resin material and the soluble particles is formed. ### Claim 8 (depends on 6) A method of manufacturing a printed circuit board according to claim 6, further comprising dispersing soluble particles in a refractory resin material such that said resin insulating layer comprising the refractory resin material and the soluble particles is formed. ### Claim 9 (depends on 4) A method of manufacturing a printed circuit board according to claim 4, wherein said resin insulating layer comprises a refractory resin material and soluble particles dispersed in the refractory resin material. ### Claim 10 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. ### Claim 11 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, wherein the providing of the metal film in each of the penetrating openings comprises forming an electroless plating layer in each of the penetrating openings. ### Claim 12 (depends on 11) A method of manufacturing a printed circuit board according to claim 11, further comprising forming an electroplated film on the metal film comprising the electroless plating layer formed in each of the penetrating openings. ### Claim 13 (depends on 5) A method of manufacturing a printed circuit board according to claim 5, further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. ### Claim 14 (depends on 9) A method of manufacturing a printed circuit board according to claim 9, further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. ### Claim 15 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising forming a conductor circuit on at least one side of the core substrate. ### Claim 16 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising forming a conductor circuit on at least one side of the core substrate such that the conductor circuit is connected to at least one of the through holes. ### Claim 17 (depends on 1) A method of manufacturing a printed circuit board according to claim 1, further comprising forming a conductor circuit on each of two sides of the core substrate such that the conductor circuits are connected by at least one of the through holes through the core substrate. ### Claim 18 (depends on 5) A method of manufacturing a printed circuit board according to claim 5, further comprising forming a conductor circuit on at least one side of the core substrate. ### Claim 19 (depends on 5) A method of manufacturing a printed circuit board according to claim 5, further comprising forming a conductor circuit on at least one side of the core substrate such that the conductor circuit is connected to at least one of the through holes. ### Claim 20 (depends on 5) A method of manufacturing a printed circuit board according to claim 5, further comprising forming a conductor circuit on each of two sides of the core substrate such that the conductor circuits are connected by at least one of the through holes through the core substrate.