# US 8,782,880 B2 · Apparatus for assembling chip devices on wires > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,782,880 B2 - Document ID: US8782880B2 - Status: Granted - Kind: B2 - Application number: 13/115,419 - Filed: 2011-05-25 - Published: 2012-03-29 - Granted: 2014-07-22 - Earliest claimed: 2010-05-25 - Assignees: Commissariat A L'energie Atomique Et Aux Energies Alternatives - Applicants: Dominique Vicard; Jean Brun - Inventors: Dominique Vicard; Jean Brun - Web page: https://patentgrep.com/patent/US8782880B2 ## CPC - B65B 15/00: Attaching articles to cards, sheets, strings, webs, or other carriers - H10W 90/00: Package configurations - Y10T 29/5187: Wire working - Y10T 29/5193: Electrical connector or terminal - Y10T 29/53178: Chip component - Y10T 29/53213: Assembled to wire-type conductor - Y10T 29/53261: Means to align and advance work part - B65B: MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING (bundling and pressing devices for cigars A24C1/44; devices for tensioning and securing binders adapted to be supported by the article or articles to be bound B25B25/00; applying closure members to bottles, jars or similar containers B67B1/00-B67B6/00; concurrent cleaning, filling and closing of bottles B67C7/00; emptying bottles, jars, cans, casks, barrels or similar containers B67C9/00) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers. ## Claims ### Claim 1 Apparatus for assembling chip devices on at least one wire, each chip device comprising two substantially parallel lateral walls, and a groove in at least one of the lateral walls for receiving said at least one wire, the apparatus comprising: a pinching device fixed in a first direction, comprising two opposing surfaces, the distance between the opposing surfaces being measured in a second direction perpendicular to the first direction, and being substantially constant and substantially equal to the distance between the two lateral walls of a chip device, the pinching device being configured to have both the chip device and the wire pass through an area in between the two opposing surfaces; a wire feeder adapted to continuously feed said wire in contact with one of the opposing surfaces of the pinching device; and a chip device feeder adapted to drive chip devices in the first direction, one at a time, between said opposing surfaces, with their grooves turned towards the wire. ### Claim 2 (depends on 1) Apparatus according to claim 1, wherein the chip device feeder comprises: a storage groove adapted to lead a series of chip devices in contact with each other to the pinching device; a separator arranged near the pinching device for creating a gap between the last and penultimate chip devices in the storage groove; and a hook having an alternating movement between a first position in said gap, where it hooks said last chip device, and a second position near said opposing surfaces of the pinching device, where it releases said last chip device. ### Claim 3 (depends on 2) Apparatus according to claim 2, wherein the separator comprises a series of retractable pins arranged along the feed groove near the pinching device. ### Claim 4 (depends on 3) Apparatus according to claim 3, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 5 (depends on 2) Apparatus according to claim 2, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 6 (depends on 1) Apparatus according to claim 1, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 7 (depends on 1) Apparatus according to claim 1, wherein the pinching device comprises two cylindrical rollers. ### Claim 8 (depends on 7) Apparatus according to claim 7, the cylindrical rollers having rotation axes substantially perpendicular to the wire, said opposing surfaces being formed by respective surfaces of the rollers. ### Claim 9 (depends on 8) Apparatus according to claim 8, wherein one of said rollers is spring biased towards the other roller. ### Claim 10 (depends on 9) Apparatus according to claim 9, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 11 (depends on 8) Apparatus according to claim 8, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 12 (depends on 1) Apparatus according to claim 1, wherein the two opposing surfaces are flat. ### Claim 13 Apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire, wherein the apparatus comprises: a pinching device comprising two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device, the pinching device being configured to pinch both each chip device and the wire; and a wire feeder adapted to continuously feed said wire in contact with one of the opposing surfaces of the pinching device; and a chip device feeder adapted to drive chip devices, one at a time, between said opposing surfaces, with their grooves turned towards the wire, the device feeder including: a storage groove adapted to lead a series of chip devices in contact with each other to the pinching device; a separator arranged near the pinching device for creating a gap between the last and penultimate chip devices in the storage groove; and a hook having an alternating movement between a first position in said gap, where it hooks said last chip device, and a second position near said opposing surfaces of the pinching device, where it releases said last chip device. ### Claim 14 (depends on 13) Apparatus according to claim 13, wherein the separator comprises a series of retractable pins arranged along the feed groove near the pinching device. ### Claim 15 (depends on 14) Apparatus according to claim 14, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 16 (depends on 13) Apparatus according to claim 13, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 17 (depends on 13) Apparatus according to claim 13, wherein the pinching device comprises two cylindrical rollers having rotation axes substantially perpendicular to the wire, said opposing surfaces being formed by respective surfaces of the rollers. ### Claim 18 (depends on 17) Apparatus according to claim 17, wherein one of said rollers is spring biased towards the other roller. ### Claim 19 (depends on 18) Apparatus according to claim 18, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device. ### Claim 20 (depends on 17) Apparatus according to claim 17, for assembling chip devices between two wires, each chip device comprising a groove in each of its lateral walls, the apparatus comprising two wire feeders, each adapted to continuously feed a respective one of the two wires in contact with a respective one of the opposing surfaces of the pinching device.