System and method for increasing die yield
AssigneeNVIDIA Corporation
InventorsJames M. Van Dyke, John S. Montrym, Michael B. Nagy, Sean J. Treichler
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AssigneeNVIDIA Corporation
InventorsJames M. Van Dyke, John S. Montrym, Michael B. Nagy, Sean J. Treichler
Estimating the term…
The present invention systems and methods facilitate increased die yields by flexibly changing the operational characteristics of functional components in an integrated circuit die. The present invention system and method enable integrated circuit chips with defective functional components to be salvaged. Defective functional components in the die are disabled in a manner that maintains the basic functionality of the chip. A chip is tested and a functional component configuration process is performed on the chip based upon results of the testing. If an indication of a defective functional component is received, the functional component is disabled. Workflow is diverted from disabled functional components to enabled functional components.
A reduced performance circuit salvage method comprising:
A die classification process comprising:
A die classification process comprising:
Dependencies are inferred from the claim text.