# US 8,772,927 B2 · Semiconductor package structures having liquid cooler integrated with first level chip package modules

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- Number: US 8,772,927 B2
- Document ID: US8772927B2
- Status: Granted
- Kind: B2
- Application number: 13/290,824
- Filed: 2011-11-07
- Published: 2012-03-01
- Granted: 2014-07-08
- Earliest claimed: 2008-05-13
- Assignees: International Business Machines Corporation
- Applicants: Raschid Jose Bezama; Evan George Colgan; Michael Gaynes; John Harold Magerlein; Kenneth C. Marston; Xiaojin Wei
- Inventors: Raschid Jose Bezama; Evan George Colgan; Michael Gaynes; John Harold Magerlein; Kenneth C. Marston; Xiaojin Wei
- Web page: https://patentgrep.com/patent/US8772927B2

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/233: {attached to chips}
- H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 70/688: {Flexible insulating substrates}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

## Claims

### Claim 1

An electronic apparatus, comprising:
a flexible chip carrier substrate having an IC (integrated circuit) chip flip-chip mounted on a first surface of the flexible chip carrier substrate and an area array of electrical contacts formed on a second surface of the flexible chip carrier substrate opposite the first surface;
a metallic cooler device having upper and lower opposing surfaces and sidewall surfaces, wherein the lower surface of the metallic cooler device is thermally bonded directly to a backside surface of the IC chip; and
a stiffener member that is bonded to the first surface of the flexible chip carrier substrate and is configured to provide mechanical rigidity to the flexible chip carrier substrate,
wherein the metallic cooler device is mechanically coupled to the flexible chip carrier substrate by the stiffener member, and
wherein the stiffener member comprises:
a planar frame portion that lies substantially flat against the flexible chip carrier substrate; and
a plurality of extended portions that are integrally formed with the planar frame portion and extend toward the metallic cooler device and away from the flexible chip carrier substrate at a first angle,
wherein each the plurality of extended portions includes a bent end portion that is bent with respect to the rest of the extended portions at a second angle, the bent end portions are in contact with the sidewall surfaces of the metallic cooler device, the bent end portions of the plurality of extended portions being integrally formed with the rest of the extended portions.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the metallic cooler device is thermally bonded to the backside of the IC chip using a layer of mechanically compliant thermally conductive material or adhesive thermal bonding material.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the metallic cooler device is thermally bonded to the backside of the IC chip using a soft solder bond.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the planar frame portion of the stiffener member is adhesively bonded to an outer peripheral region of the first surface of the carrier substrate.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the bent end portions of the extended portions of the stiffener member are bonded to the sidewall surfaces of the metallic cooler device using an adhesive bonding material or solder.

### Claim 6

An electronic apparatus, comprising:
a flexible chip carrier substrate having an IC (integrated circuit) chip flip-chip mounted on a surface of the flexible chip carrier;
a metallic cooler device having upper and lower opposing surfaces and sidewall surfaces, wherein the lower surface of the metallic cooler device is thermally bonded directly to a backside surface of the IC chip; and
a stiffener member that is bonded to the first surface of the flexible chip carrier substrate and is configured to provide mechanical rigidity to the flexible carrier substrate,
wherein the metallic cooler device is mechanically coupled to the flexible chip carrier substrate by the stiffener member, and
wherein the stiffener member comprises:
a rectangular planar frame portion that lies substantially flat against the flexible chip carrier substrate; and
a plurality of extended portions that are integrally formed with the rectangular planar frame portion and extend toward the metallic cooler device and away from the flexible chip carrier substrate at a first angle,
wherein each the plurality of extended portions includes a bent end portion that is bent with respect to the rest of the extended portions at a second angle, the bent end portions are in contact with the sidewall surfaces of the metallic cooler device, the bent end portions of the plurality of extended portions being integrally formed with the rest of the extended portions, and
wherein the plurality of extended portions are disposed against the metallic cooler device with a compressive force such that the metallic cooler device is configured to receive a downward tension directly from the plurality of extended portions.

### Claim 7 (depends on 6)

The apparatus of claim 6, wherein the metallic cooler device is thermally bonded to the backside of the IC chip using a layer of mechanically compliant thermally conductive material or adhesive thermal bonding material.

### Claim 8 (depends on 6)

The apparatus of claim 6, wherein the metallic cooler device is thermally bonded to the backside of the IC chip using a soft solder bond.

### Claim 9 (depends on 6)

The apparatus of claim 6, wherein the rectangular planar frame portion of the stiffener member is adhesively bonded to an outer peripheral region of the surface of the carrier substrate.

### Claim 10 (depends on 6)

The apparatus of claim 6, wherein the bent end portions of the extended portions of the stiffener member are bonded to the sidewall surfaces of the metallic cooler device using an adhesive bonding material or solder.