# US 8,772,926 B2 · Production method of cooler > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,926 B2 - Document ID: US8772926B2 - Status: Granted - Kind: B2 - Application number: 13/888,460 - Filed: 2013-05-07 - Published: 2013-11-14 - Granted: 2014-07-08 - Earliest claimed: 2012-05-08 - Assignees: Showa Denko K.K. - Applicants: Showa Denko K.K. - Inventors: Atsushi Otaki; Shigeru Oyama - Web page: https://patentgrep.com/patent/US8772926B2 ## CPC - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - B23K 1/00: Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) - B23K 1/0012: {Brazing of heat exchangers} - B23K 1/19: taking account of the properties of the materials to be soldered - B23K 20/023: {Thermo-compression bonding} - B23K 20/04: by means of a rolling mill - F28F 21/084: {from aluminium or aluminium alloys} - F28F 21/087: {from nickel or nickel alloys} - H10W 40/10: Arrangements for heating - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - B23K 2101/14: Heat exchangers - B23K 2103/10: Aluminium or alloys thereof - B23K 2103/14: Titanium or alloys thereof - B23K 2103/18: Dissimilar materials - B23K 2103/26: {Alloys of Nickel and Cobalt and Chromium} - H10W 72/07336: {Soldering or alloying} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing. ## Claims ### Claim 1 A production method of a cooler, comprising: a laminated material production step of producing a laminated material formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner; and a brazing joining step of joining a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body by brazing. ### Claim 2 (depends on 1) The production method of a cooler as recited in claim 1, wherein, in the brazing joining step, the joining is performed by brazing using a brazing sheet as a brazing material. ### Claim 3 (depends on 1) The production method of a cooler as recited in claim 1, wherein, in the brazing joining step, the joining is performed by brazing using a plate-shaped brazing material as a brazing material. ### Claim 4 (depends on 1) The production method of a cooler as recited in claim 1, further comprising a Ni oxide film removal step of removing a Ni oxide film formed on the upper surface of the Ni layer of the laminated material after the brazing joining step. ### Claim 5 (depends on 1) The production method of a cooler as recited in claim 1, wherein the laminated material production step includes a first diffusion joining step of joining the Ni layer and the Ti layer by diffusion joining to thereby form a Ni—Ti series superelastic alloy layer in which Ni in the Ni layer and Ti in the Ti layer are alloyed at a bonded interface of the Ni layer and the Ti layer. ### Claim 6 (depends on 5) The production method of a cooler as recited in claim 5, wherein the laminated material production step includes a second diffusion joining step of joining the Ti layer and the Al layer by diffusion joining after the first diffusion joining step. ### Claim 7 (depends on 1) A production method of a semiconductor module, comprising the step of: joining an insulating substrate as a member to be cooled to which a semiconductor element is to be mounted to the upper surface of the Ni layer of the laminated material of the cooler obtained by the production method of claim 1 by soldering. ### Claim 8 A cooler comprising: a laminated material formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner, wherein a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined via a brazing material layer. ### Claim 9 (depends on 8) The cooler as recited in claim 8, wherein a Ni—Ti series superelastic alloy layer in which Ni in the Ni layer and Ti in the Ti layer are alloyed is formed at a bonded interface of the Ni layer and the Ti layer. ### Claim 10 (depends on 8) A semiconductor module, wherein an insulating substrate as a member to be cooled to which a semiconductor element is to be mounted is joined to the upper surface of the Ni layer of the laminated material of claim 8 via a soldering layer.