# US 8,772,925 B2 · Bonding structure and bonding method of heat diffusion member, and cooling unit using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,925 B2 - Document ID: US8772925B2 - Status: Granted - Kind: B2 - Application number: 13/325,423 - Filed: 2011-12-14 - Published: 2012-06-21 - Granted: 2014-07-08 - Earliest claimed: 2010-12-16 - Assignees: Denso Corporation; Nippon Soken, Inc. - Applicants: Koji Noda; Satoshi Sakimichi; Masahiro Sakamoto; Kimio Kohara - Inventors: Koji Noda; Satoshi Sakimichi; Masahiro Sakamoto; Kimio Kohara - Web page: https://patentgrep.com/patent/US8772925B2 ## CPC - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - B23K 1/0016: {Soldering of electronic components} - B23K 35/025: {Pastes, creams or slurries} - H10W 40/25: characterised by their materials - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 70/20: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40) - H10W 72/30: Die-attach connectors - B23K 2101/42: Printed circuits - H10W 40/10: Arrangements for heating - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 72/07331: {Connecting techniques} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - Y10T 428/12014: having metal particles - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source. ## Claims ### Claim 1 A cooling unit comprising: a first member having a plate shape and being made of a carbon-base material, the first member serving as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape; a heat source disposed at a first side of the first member; a second member disposed at least at one of the first side and a second side of the first member; a cooler disposed at the second side of the first member for cooling the heat source; and a bonding member bonding the first member and the second member to each other, wherein: the first member has a metal thin film at least on an opposed surface that is opposed to the second member, the bonding member is disposed between the opposed surface of the first member and the second member, the bonding member is provided by a sintered body of metal particle, the heat diffusion member provided by the first member is a first heat diffusion member; the second member has a plate shape and is made of a carbon-base material, and the second member has a metal thin film at least on an opposed surface opposed to the first heat diffusion member and serves as a second heat diffusion member to transfer heat in the thickness direction. ### Claim 2 (depends on 1) The cooling unit according to claim 1, wherein: each of the first member and the second member is provided by a stack of carbon-base plates, each carbon-base plate having a higher coefficient of thermal conductivity in a direction parallel to a plane of the carbon-base plate than in a direction perpendicular to the plane of the carbon-base plate; and the first member and the second member are disposed on top of the other such that the coefficient of thermal conductivity in a direction perpendicular to the opposed surfaces is higher than a coefficient of thermal conductivity in a direction parallel to the opposed surfaces, and a stacking direction of the carbon-base plates of the first member is different from a stacking direction of the carbon-base plates of the second member. ### Claim 3 (depends on 1) The cooling unit according to claim 1, wherein the metal thin film includes at least a base layer and a surface layer, the base layer forming chemical bonding with the second member, and the surface layer being disposed on the base layer and forming metal bonding with the bonding member. ### Claim 4 (depends on 3) The cooling unit according to claim 3, wherein the base layer contains at least one of Ti, Al, Cr, Mo, and W. ### Claim 5 (depends on 3) The cooling unit according to claim 3, wherein the surface layer is made of at least one of Au, Ag, Pt, Pd, Ni, Sn, Fe, Cu, and Pb. ### Claim 6 (depends on 3) The cooling unit according to claim 3, wherein: the metal thin film further includes a middle layer between the base layer and the surface layer; and the middle layer is made of at least one of Au, Ag, Pt, Pd, Ni, Sn, Fe, Cu and Pb, which is different from the one of the surface layer, and forms alloy layers at interfaces with the base layer and the surface layer.