# US 8,772,923 B2 · Semiconductor device having leads with cutout and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,923 B2 - Document ID: US8772923B2 - Status: Granted - Kind: B2 - Application number: 13/581,901 - Filed: 2012-01-19 - Published: 2012-12-27 - Granted: 2014-07-08 - Earliest claimed: 2011-02-15 - Assignees: Panasonic Corporation - Applicants: Masanori Minamio - Inventors: Masanori Minamio - Web page: https://patentgrep.com/patent/US8772923B2 ## CPC - H10W 74/016: {using moulds} - H10W 40/778: {in encapsulations} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H10W 90/811: {Multiple chips on leadframes} - H10W 72/534: {being rectangular} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes: leads (5) in each of which a cutout (5a) is formed; a die pad (11); a power element (1) held on the die pad (11); and a package (6) made of a resin material, and configured to encapsulate inner end portions of the leads (5), and the die pad (11) including the power element (1). The cutout (5a) is located in a region of each of the leads (5) including a portion of the lead (5) located at a boundary between the lead (5) and the package (6), and is filled with a resin material. ## Claims ### Claim 1 A semiconductor device, comprising: leads in each of which a cutout is formed; a die pad; a first element held on the die pad; and a package made of a first resin material, and configured to encapsulate inner end portions of the leads, and the die pad including the first element, wherein a portion of the cutout is inside the package, another portion of the cutout is outside the package, and the portion of the cutout inside the package and the another portion of the cutout outside the package are filled with a second resin material, and the second resin material with which the cutout is filled is connected integrally to the resin material forming the package. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein the second resin material with which the cutout is filled has a composition identical with a composition of the first resin material forming the package. ### Claim 3 (depends on 1) The semiconductor device of claim 1, wherein the cutout is formed in at least one of an adjacent pair of the leads. ### Claim 4 (depends on 1) The semiconductor device of claim 1, wherein the cutout is formed in each of both side surfaces of one of the leads. ### Claim 5 (depends on 1) The semiconductor device of claim 1, wherein the first element is a power element. ### Claim 6 (depends on 5) The semiconductor device of claim 5, further comprising: a control element which is a second element configured to control the power element, wherein the leads in each of which the cutout is formed are connected to the control element. ### Claim 7 (depends on 1) The semiconductor device of claim 1, wherein the cutout is formed in a portion of each of the leads located inwardly from a dam bar connected to the lead. ### Claim 8 (depends on 1) The semiconductor device of claim 1, wherein a groove parallel to a direction in which the leads protrude is formed in the first resin material with which a space between the cutouts of an adjacent pair of the leads is filled. ### Claim 9 (depends on 8) The semiconductor device of claim 8, wherein a portion of the groove is located inside the package. ### Claim 10 (depends on 1) The semiconductor device of claim 1, wherein a distance between resin-filled portions of one of the leads formed by the second resin material with which the cutout is filled is greater than or equal to 0.4 mm. ### Claim 11 (depends on 1) The semiconductor device of claim 1, wherein a portion of the cutout is located inside the package. ### Claim 12 (depends on 11) The semiconductor device of claim 11, wherein a length of a portion of the cutout located inside the package is greater than a diameter of a filler blended into the second resin material. ### Claim 13 (depends on 1) The semiconductor device of claim 1, wherein an inner wall of the cutout is inclined or step-wise. ### Claim 14 (depends on 1) The semiconductor device of claim 1, wherein a length of the portion of the cutout inside the package is greater than or equal to 20 μm. ### Claim 15 (depends on 1) A device comprising: the semiconductor device of claim 1. ### Claim 16 A method of manufacturing a semiconductor device, the method comprising: preparing a die pad on which a first element is held, and leads each having a cutout, said cutout having a portion inside a package and another portion outside the package; and clamping the cutout of each of the leads between molds, and injecting an encapsulating resin material between the molds to fill the portion of the cutout inside the package and the another portion of the cutout outside the package with the resin material so as to integrally encapsulate inner end portions of the leads and the die pad including the first element with the resin material.