# US 8,772,916 B2 · Integrated circuit package system employing mold flash prevention technology

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,772,916 B2
- Document ID: US8772916B2
- Status: Granted
- Kind: B2
- Application number: 13/536,382
- Filed: 2012-06-28
- Published: 2012-10-25
- Granted: 2014-07-08
- Earliest claimed: 2006-12-22
- Assignees: STATS ChipPAC, Ltd.
- Applicants: Ki Youn Jang; Sungmin Song; JoHyun Bae
- Inventors: Ki Youn Jang; Sungmin Song; JoHyun Bae
- Web page: https://patentgrep.com/patent/US8772916B2

## CPC

- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/016: {using moulds}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.

## Claims

### Claim 1

An integrated circuit package system comprising:
a support structure including an electrical contact;
a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface;
an integrated circuit over the support structure; and
encapsulant over the integrated circuit and in contact with the solder mask flange.

### Claim 2 (depends on 1)

The system as claimed in claim 1 further comprising an encapsulant flash adjacent the encapsulant and on the solder mask.

### Claim 3 (depends on 1)

The system as claimed in claim 1 wherein the solder mask is around the integrated circuit and the electrical contact.

### Claim 4 (depends on 1)

The system as claimed in claim 1 wherein the solder mask flange faces the encapsulant.

### Claim 5 (depends on 1)

The system as claimed in claim 1 wherein the solder mask flange is in contact with the encapsulant.