# US 8,772,912 B2 · Electronic device

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- Number: US 8,772,912 B2
- Document ID: US8772912B2
- Status: Granted
- Kind: B2
- Application number: 12/974,166
- Filed: 2010-12-21
- Published: 2011-07-28
- Granted: 2014-07-08
- Earliest claimed: 2010-01-26
- Assignees: Denso Corporation
- Applicants: Shotaro Miyawaki; Katsuhiko Kawashima; Atsushi Kashiwazaki; Takashi Yoshimizu
- Inventors: Shotaro Miyawaki; Katsuhiko Kawashima; Atsushi Kashiwazaki; Takashi Yoshimizu
- Web page: https://patentgrep.com/patent/US8772912B2

## CPC

- H10W 74/114: {by a substrate and the encapsulations}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/468: {Circuit boards}
- H10W 40/778: {in encapsulations}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.

## Claims

### Claim 1

An electronic device comprising:
a heat sink;
a substrate constituting an electronic circuit, the substrate being mounted on the heat sink;
a coating layer disposed on the substrate, the coating layer being made of one of a polyimide-based resin and a polyamideimide-based resin;
a lead frame having a fixing terminal;
an adhesive layer fixing the fixing terminal to the heat sink, the adhesive layer being made of the same material as the coating layer; and
a mold resin sealing the substrate and the lead frame,
the substrate being a hybrid IC substrate having a wiring board and an electronic part integrated with and mounted on the wiring board,
the coating layer being disposed on a surface of the substrate opposite to the heat sink, and
the mold resin being disposed directly on a top and side surfaces of the coating layer and completely surrounding the top and side surfaces of the coating layer.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein
the wiring board is made of alumina.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein
the substrate includes a silicon substrate.

### Claim 4 (depends on 1)

The electronic device according to claim 1, wherein
the adhesive layer has a thickness of at least 17 micrometers and at most 41 micrometers.

### Claim 5 (depends on 4)

The electronic device according to claim 4, wherein
the thickness of the adhesive layer is at least 29 micrometers and at most 41 micrometers.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein
the coating layer is disposed at least on an outer end of the substrate.

### Claim 7 (depends on 6)

The electronic device according to claim 6, wherein
the coating layer is disposed over an entire surface of the substrate.

### Claim 8 (depends on 1)

The electronic device according to claim 1, wherein
the fixing terminal defines a through hole, and
the adhesive layer is disposed to pass through the through hole and cover a periphery of the through hole on a surface of the fixing terminal, the surface being opposite to the heat sink.

### Claim 9 (depends on 1)

The electronic device according to claim 1, wherein
the lead frame has an input/output lead terminal, and
the input/output lead terminal is fixed to the heat sink through an adhesive layer made of the one of the polyimide-based resin and the polyamideimide-based resin.

### Claim 10 (depends on 1)

The electronic device according to claim 1, wherein
the substrate is fixed to the heat sink through another adhesive layer made of the same material as the coating layer.

### Claim 11 (depends on 1)

The electronic device according to claim 1, wherein
the lead frame has a plurality of fixing terminals including the fixing terminal, and
the adhesive layer is disposed over the plurality of fixing terminals.

### Claim 12 (depends on 1)

The electronic device according to claim 1, wherein
the coating layer is disposed on a portion of the surface of the substrate on which the electronic part is not mounted.