# US 8,772,908 B2 · Conductive pads defined by embedded traces

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- Number: US 8,772,908 B2
- Document ID: US8772908B2
- Status: Granted
- Kind: B2
- Application number: 13/589,359
- Filed: 2012-08-20
- Published: 2012-12-06
- Granted: 2014-07-08
- Earliest claimed: 2010-11-15
- Assignees: Tessera, Inc.
- Applicants: Belgacem Haba
- Inventors: Belgacem Haba
- Web page: https://patentgrep.com/patent/US8772908B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/019: {of bond pads}
- H10W 72/01904: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/344: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/931: {Shapes of bond pads}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 90/00: Package configurations
- H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips}
- H10W 90/721: {of bump connectors}
- H10W 90/722: {between stacked chips}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

## Claims

### Claim 1

An assembly comprising:
a first component including a dielectric region having an exposed surface;
a continuous groove extending in a path along the surface, the groove having a floor disposed below the surface;
a conductive pad exposed at the surface permitting electrical interconnection of the first component with a second component, the conductive pad defined by a conductive element having cross-sectional dimensions at least partly defined by the groove, extending from the floor of the groove to a height above the floor, and having at least a portion extending in at least one of an oscillating or spiral path along the surface, the path being formed so as to intersect a straight line along the surface more than three times, the conductive element having at least two adjacent portions separated by a portion of the surface of the dielectric region, and the conductive element having a length along the surface that is at least ten times greater than the height; and
an electrically conductive bonding material having a melting temperature below 300° C. joined to the conductive pad and bridging the portion of the surface between the at least two adjacent portions of the conductive element.

### Claim 2 (depends on 1)

The assembly of claim 1, further comprising the second component, the bonding material joining the conductive pad with a terminal of the second component.

### Claim 3 (depends on 1)

The assembly of claim 1, wherein the first component is a microelectronic element having a plurality of contacts at a surface thereof and a plurality of active semiconductor devices adjacent the surface of the first component, the assembly further comprising a trace electrically connecting the conductive pad with at least one of the plurality of contacts.

### Claim 4 (depends on 3)

The assembly of claim 3, further comprising the second component, the bonding material joining the conductive pad with a terminal of the second component.

### Claim 5 (depends on 1)

The assembly of claim 1, wherein the first component is a dielectric element having a plurality of traces thereon, wherein the conductive pad is electrically connected with at least one of the traces.

### Claim 6 (depends on 5)

The assembly of claim 5, further comprising the second component, the bonding material joining the conductive pad with a terminal of the second component.

### Claim 7 (depends on 1)

The assembly of claim 1, wherein the first component includes a first surface, the first component is a microelectronic element having a plurality of contacts at a second surface remote from the first surface, and a plurality of active semiconductor devices adjacent the second surface, and the conductive pad is electrically connected with at least one of the plurality of contacts.

### Claim 8 (depends on 7)

The assembly of claim 7, further comprising the second component, the bonding material joining the conductive pad with a terminal of the second component.

### Claim 9 (depends on 1)

The assembly of claim 1, wherein the bonding material is solder.

### Claim 10 (depends on 1)

The assembly of claim 1, wherein the first component includes a first surface, a second surface remote from the first surface, and an opening extending between the first and second surfaces and at least a portion of the conductive element extends along an interior surface of the opening, at least a portion of the groove extends along the interior surface, the conductive element extending within the portion of the groove.

### Claim 11 (depends on 10)

The assembly of claim 10, wherein the first component includes a plurality of contacts at the second surface, at least one of the plurality of contacts being electrically connected to the conductive element through the opening.

### Claim 12 (depends on 1)

The assembly of claim 1, wherein the height of the conductive element is greater than a distance between the floor and the surface of the dielectric region.

### Claim 13 (depends on 1)

The assembly of claim 1, wherein the height of the conductive element is equal to or less than a distance between the floor and the surface of the dielectric region.

### Claim 14 (depends on 1)

The assembly of claim 1, wherein outermost edges of the pad define a circular or square-shaped boundary with respect to the surface.

### Claim 15 (depends on 14)

The assembly of claim 14, wherein the path of the conductive element does not overlap or cross itself.

### Claim 16 (depends on 14)

The assembly of claim 14, wherein the path of the conductive element does at least one of overlap or cross itself.

### Claim 17 (depends on 14)

The assembly of claim 14, wherein the conductive element occupies less than seventy-five percent of the surface area of the surface within the boundary.

### Claim 18 (depends on 1)

The assembly of claim 1, wherein the height of the conductive element is greater than a distance between the floor and the surface such that the conductive element has top surface exposed at the surface of the dielectric region and side surfaces extending away from the top surface, the bonding material contacting the top and side surfaces of the conductive element.

### Claim 19 (depends on 1)

The assembly of claim 1, wherein the pad includes a surface layer including at least one of nickel or gold.

### Claim 20 (depends on 1)

The assembly of claim 1, wherein the surface of the dielectric region is exposed at an exposed surface of the first component, the first component further having a bottom surface opposed from the exposed surface thereof, an opening extending between the exposed and bottom surfaces thereof, and a second conductive element overlying the bottom surface, the pad being electrically connected to the second conductive element through the opening in the first component and an opening in the dielectric region.

### Claim 21 (depends on 1)

The assembly of claim 1, wherein the dielectric region includes a solder mask.

### Claim 22 (depends on 1)

The assembly of claim 1, wherein the dielectric region is a polymeric material.

### Claim 23 (depends on 1)

The assembly of claim 1, wherein the dielectric region is an inorganic material.

### Claim 24 (depends on 1)

The assembly of claim 1, wherein the dielectric region comprises two or more stacked layers of dielectric materials, at least two adjacent layers thereof including different materials.

### Claim 25 (depends on 1)

A system comprising an assembly according to claim 1 and one or more other electronic components electrically connected to the assembly.

### Claim 26 (depends on 25)

A system as claimed in claim 25 further comprising a housing, the assembly and the other electronic components being mounted to the housing.