# US 8,772,898 B2 · Lateral light shield in backside illuminated imaging sensors > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,898 B2 - Document ID: US8772898B2 - Status: Granted - Kind: B2 - Application number: 13/370,085 - Filed: 2012-02-09 - Published: 2013-08-15 - Granted: 2014-07-08 - Earliest claimed: 2012-02-09 - Assignees: OmniVision Technologies, Inc. - Applicants: Duli Mao; Hsin-Chih Tai; Vincent Venezia; Yin Qian; Gang Chen; Howard E. Rhodes - Inventors: Duli Mao; Hsin-Chih Tai; Vincent Venezia; Yin Qian; Gang Chen; Howard E. Rhodes - Web page: https://patentgrep.com/patent/US8772898B2 ## CPC - H10F 39/805: {Coatings} - H10F 39/024: {of coatings or optical elements} - H10F 39/199: {Back-illuminated image sensors} - H10F 39/8057: {Optical shielding} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A backside illuminated image sensor includes a semiconductor layer and a trench disposed in the semiconductor layer. The semiconductor layer has a frontside surface and a backside surface. The semiconductor layer includes a light sensing element of a pixel array disposed in a sensor array region of the semiconductor layer. The pixel array is positioned to receive external incoming light through the backside surface of the semiconductor layer. The semiconductor layer also includes a light emitting element disposed in a periphery circuit region of the semiconductor layer external to the sensor array region. The trench is disposed in the semiconductor layer between the light sensing element and the light emitting element. The trench is positioned to impede a light path between the light emitting element and the light sensing element when the light path is internal to the semiconductor layer. ## Claims ### Claim 1 A backside illuminated image sensor comprising: a semiconductor layer having a frontside surface and a backside surface, the semiconductor layer including: a light sensing element of a pixel array disposed in a sensor array region of the semiconductor layer, wherein the pixel array is positioned to receive external incoming light through the backside surface of the semiconductor layer; and a light emitting element disposed in a periphery circuit region of the semiconductor layer external to the sensor array region, wherein the periphery circuit region includes circuit elements that facilitate operation of the light sensing element; a trench disposed in the semiconductor layer between the light sensing element and the light emitting element, the trench positioned to impede a light path between the light emitting element and the light sensing element, wherein the light path is internal to the backside illuminated image sensor; and an anti-reflection coating layer disposed in the trench and along sidewalls of the trench, but not completely filling the trench. ### Claim 2 (depends on 1) The backside illuminated image sensor of claim 1 further comprising: a light shield layer disposed on the anti-reflection coating layer and in the trench, wherein the light shield layer includes a first surface and a second surface, the first surface contacting the anti-reflection coating layer. ### Claim 3 (depends on 1) The backside illuminated image sensor of claim 1, wherein a first refractive index of the anti-reflection coating layer is less than a second refractive index of the semiconductor layer which facilitates total internal reflection for light in the light path. ### Claim 4 (depends on 1) The backside illuminated image sensor of claim 1, wherein the trench is disposed in the periphery circuit region of the semiconductor layer. ### Claim 5 (depends on 1) The backside illuminated image sensor of claim 1, wherein a material of the semiconductor layer permits the external incoming light to enter the semiconductor layer through the backside surface and reach the light sensing element. ### Claim 6 (depends on 1) The backside illuminated image sensor of claim 1, wherein the trench penetrates substantially through the semiconductor layer. ### Claim 7 (depends on 1) The backside illuminated image sensor of claim 1 further comprising: a substantially optically opaque element disposed in the trench. ### Claim 8 (depends on 1) The backside illuminated image sensor of claim 1 further comprising: a transparent dielectric element disposed in the trench, wherein sidewalls of the trench and the transparent dielectric element create a trench interface that reflects light in the light path. ### Claim 9 (depends on 8) The backside illuminated image sensor of claim 8, wherein a third refractive index of the transparent dielectric element is less than a second refractive index of the semiconductor layer. ### Claim 10 (depends on 8) The backside illuminated image sensor of claim 8, wherein the transparent dielectric element is an oxide. ### Claim 11 (depends on 8) The backside illuminated image sensor of claim 8, wherein the sidewalls of the trench are angled at a slope that increases the light in the light path that is reflected by the trench interface. ### Claim 12 (depends on 1) The backside illuminated image sensor of claim 1, wherein the trench substantially surrounds the sensor array region of the semiconductor layer. ### Claim 13 (depends on 12) The backside illuminated image sensor of claim 12, wherein the trench also substantially surrounds black level reference pixels of the backside illuminated image sensor. ### Claim 14 (depends on 1) The backside illuminated image sensor of claim 1 further comprising: a metal stack layer disposed above the trench and contacting the frontside surface of the semiconductor layer. ### Claim 15 (depends on 1) The backside illuminated image sensor of claim 1, wherein the anti-reflection coating layer has a first surface opposite a second surface, and wherein the first surface follows contours of the trench and the second surface follows the contour of the trench. ### Claim 16 A backside illuminated image sensor comprising: a semiconductor layer having a frontside surface and a backside surface, the semiconductor layer including: a light sensing element of a pixel array disposed in a sensor array region of the semiconductor layer, wherein the pixel array is positioned to receive external incoming light through the backside surface of the semiconductor layer; and a light emitting element disposed in a periphery circuit region of the semiconductor layer external to the sensor array region, wherein the periphery circuit region includes circuit elements that facilitate operation of the light sensing element; and a trench disposed in the semiconductor layer between the light sensing element and the light emitting element, the trench positioned to impede a light path between the light emitting element and the light sensing element, wherein the light path is internal to the backside illuminated image sensor; and an anti-reflection coating disposed in the trench and along sidewalls of the trench, wherein a first refractive index of the anti-reflection coating is less than a second refractive index of the semiconductor layer. ### Claim 17 (depends on 16) The backside illuminated image sensor of claim 16, wherein the trench penetrates through the periphery circuit region. ### Claim 18 (depends on 16) The backside illuminated image sensor of claim 16 further comprising: a light shield layer disposed on the anti-reflection coating, wherein the light shield layer includes a first surface and a second surface, the first surface contacting the anti-reflection coating.