MTJ MRAM with stud patterning

An MRAM cell comprising:

• a contact stud with an upper surface that is coplanar with an upper surface of a first dielectric material surrounding the contact stud, the contact stud having a first width;
• a bottom electrode with a generally flat lower surface in contact with the upper surface of the contact stud and the upper surface of the first dielectric material surrounding the contact stud, the lower surface of the bottom electrode having a second width that is greater than the first width of the contact stud;
• an MTJ in contact with the bottom electrode, the MTJ having a third width that is less than the second width of bottom electrode;
• a dielectric capping layer in contact with the MTJ;
• and
• a stud etching mask with a lower surface in contact with an upper surface of the dielectric capping layer, the lower surface of the stud etching mask being coextensive with the upper surface of the dielectric capping layer.

An MRAM cell comprising:

• a contact stud with an upper surface that is coplanar with an upper surface of a first dielectric material surrounding the contact stud, the contact stud having a first width;
• a bottom electrode with a generally flat lower surface in contact with the upper surface of the contact stud and the upper surface of the first dielectric material surrounding the contact stud, the lower surface of the bottom electrode having a second width that is greater than the first width of the contact stud;
• an MTJ in contact with the bottom electrode, the MTJ having a third width that is less than the second width of bottom electrode;
• a capping layer in contact with the MTJ;
• a top electrode in contact with the capping layer;
• and
• a stud etching mask with a lower surface in contact with an upper surface of the top electrode, the lower surface of the stud etching mask being coextensive with the upper surface of the top electrode.

An MRAM cell comprising:

• a contact stud with an upper surface that is coplanar with an upper surface of a first dielectric material surrounding the contact stud, the contact stud having a first width;
• a bottom electrode with a generally flat lower surface in contact with the upper surface of the contact stud and the upper surface of the first dielectric material surrounding the contact stud, the lower surface of the bottom electrode having a second width that is greater than the first width of the contact stud;
• an MTJ in contact with the bottom electrode, the MTJ having a third width that is less than the second width of bottom electrode;
• a capping layer in contact with the MTJ;
• and
• a stud etching mask with a lower surface in contact with an upper surface of the capping layer, the lower surface of the stud etching mask being coextensive with the upper surface of the capping layer.