# US 8,772,817 B2 · Electronic device submounts including substrates with thermally conductive vias > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,817 B2 - Document ID: US8772817B2 - Status: Granted - Kind: B2 - Application number: 12/976,664 - Filed: 2010-12-22 - Published: 2012-06-28 - Granted: 2014-07-08 - Earliest claimed: 2010-12-22 - Assignees: Cree, Inc. - Applicants: Zhimin Jamie Yao - Inventors: Zhimin Jamie Yao - Web page: https://patentgrep.com/patent/US8772817B2 ## CPC - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10H 20/8582: {characterised by their shape} - H10W 70/635: {Through-vias} - H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon - H10H 20/8581: {characterised by their material} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A submount for an electronic device includes a substrate formed of a bulk material including first and second major surfaces on opposite sides of the substrate, a surface insulating layer on the first major surface of the substrate, and a die attach pad on the surface insulating layer. The die attach pad may be electrically insulated from the substrate by the surface insulating layer. The submount further includes a heatsink contact pad on the second major surface of the substrate, and a thermal conduction member extending from the second major surface of the conductive semiconductor substrate through the substrate toward the first major surface of the substrate. The thermal conduction member has a higher thermal conductivity than a thermal conductivity of the bulk material of the substrate. ## Claims ### Claim 1 A submount for an electronic device, the submount comprising: a substrate including first and second major surfaces on opposite sides of the substrate; a surface insulating layer on the first major surface of the semiconductor substrate; an electrically conductive die attach pad on the surface insulating layer, wherein the electrically conductive die attach pad is electrically insulated from the substrate by the surface insulating layer; a heatsink contact pad on the second major surface of the substrate; and a thermal conduction member extending from the second major surface of the substrate through the substrate toward the first major surface of the substrate, wherein the thermal conduction member is between the electrically conductive die attach pad and the heatsink contact pad and is electrically insulated from the electrically conductive die attach pad, and wherein the thermal conduction member has a higher thermal conductivity than a thermal conductivity of the substrate. ### Claim 2 (depends on 1) The submount of claim 1, wherein the substrate is electrically conductive, the submount further comprising an electrically insulating sidewall spacer between the thermal conduction member and the substrate, wherein the thermal conduction member is insulated from the substrate by the electrically insulating sidewall spacer. ### Claim 3 (depends on 1) The submount of claim 1, wherein the thermal conduction member is in direct contact with the surface insulating layer and is insulated from the electrically conductive die attach pad by the surface insulating layer. ### Claim 4 (depends on 1) The submount of claim 1, wherein the thermal conduction member is in direct contact with the heatsink contact pad. ### Claim 5 (depends on 1) The submount of claim 1, wherein the thermal conduction member extends at least halfway through the substrate toward the first major surface of the substrate. ### Claim 6 (depends on 1) The submount of claim 1, wherein the surface insulating layer comprises a first surface insulating layer, the submount further comprising: a second surface insulating layer on the second major surface of the substrate; wherein the second surface insulating layer is between the heatsink contact pad and the substrate. ### Claim 7 (depends on 6) The submount of claim 6, wherein the thermal conduction member extends through the second surface insulating layer to contact the heatsink contact pad. ### Claim 8 (depends on 6) The submount of claim 6, wherein the thermal conduction member is electrically isolated from the heatsink contact pad by the second surface insulating layer. ### Claim 9 (depends on 1) The submount of claim 1, further comprising a plurality of thermal conduction members extending from the second major surface of the substrate toward the first major surface of the substrate. ### Claim 10 (depends on 9) The submount of claim 9, wherein the surface insulating layer comprises a first surface insulating layer, the submount further comprising: a second surface insulating layer on the second major surface of the substrate; wherein the second surface insulating layer is between the heatsink contact pad and the substrate. ### Claim 11 (depends on 10) The submount of claim 10, wherein the plurality of thermal conduction members extend through the second surface insulating layer to contact the heatsink contact pad. ### Claim 12 (depends on 10) The submount of claim 10, wherein the plurality of thermal conduction members are electrically isolated from the heatsink contact pad by the second surface insulating layer. ### Claim 13 (depends on 1) The submount of claim 1, wherein the substrate has a smoothness of about 10 nm or less. ### Claim 14 (depends on 1) The submount of claim 1, wherein the substrate has a smoothness of about 2 nm or less. ### Claim 15 (depends on 1) The submount of claim 1, wherein the heatsink contact pad and/or the electrically conductive die attach pad has a smoothness of about 50 nm or less. ### Claim 16 (depends on 1) The submount of claim 1, wherein the heatsink contact pad and/or the electrically conductive die attach pad has a smoothness of about 30 nm or less. ### Claim 17 (depends on 1) The submount of claim 1, wherein the heatsink contact pad and/or the electrically conductive die attach pad has a thickness of about 10 micrometers or less. ### Claim 18 (depends on 1) The submount of claim 1, wherein the heatsink contact pad and/or the electrically conductive die attach pad has a thickness of about 2 micrometers or less. ### Claim 19 (depends on 1) The submount of claim 1, wherein the heatsink contact pad and/or the electrically conductive die attach pad has a thickness of about 1 micrometer. ### Claim 20 (depends on 1) The submount of claim 1, wherein the surface insulating layer comprises a first surface insulating layer, the submount further comprising: a second surface insulating layer on the second major surface of the substrate; a contact pad on the second major surface of the substrate, wherein the contact pad is electrically isolated from the substrate by the second surface insulating layer; and an electrically conductive thermal conduction member extending through the substrate, the first surface insulating layer and the second surface insulating layer, wherein the electrically conductive thermal conduction member electrically connects the electrically conductive die attach pad and the contact pad. ### Claim 21 (depends on 20) The submount of claim 20, wherein the electrically conductive thermal conduction member is insulated from the substrate by an electrically insulating sidewall spacer. ### Claim 22 (depends on 20) The submount of claim 20, wherein the electrically conductive thermal conduction member comprises a first electrically conductive thermal conduction member and the contact pad comprises a first contact pad, the submount further comprising: a bonding pad on the first major surface of the substrate, wherein the bonding pad is electrically insulated from the substrate by the first surface insulating layer; a second contact pad on the second major surface of the substrate, wherein the second contact pad is electrically isolated from the substrate by the second surface insulating layer; and a second electrically conductive thermal conduction member extending through the substrate, the first surface insulating layer and the second surface insulating layer, wherein the second electrically conductive thermal conduction member electrically connects the bonding pad and the second contact pad. ### Claim 23 (depends on 22) The submount of claim 22, wherein the first electrically conductive thermal conduction member is insulated from the substrate by a first electrically insulating sidewall spacer and the second electrically conductive thermal conduction member is insulated from the substrate by a second electrically insulating sidewall spacer. ### Claim 24 (depends on 1) A light emitting device, comprising: a submount as recited in claim 1; and a solid state light emitting device on the submount; wherein the solid state light emitting device is on the electrically conductive die attach pad.