# US 8,772,813 B2 · Light emitting diode package having frame with bottom surface having two surfaces different in height

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- Number: US 8,772,813 B2
- Document ID: US8772813B2
- Status: Granted
- Kind: B2
- Application number: 13/872,688
- Filed: 2013-04-29
- Published: 2013-09-12
- Granted: 2014-07-08
- Earliest claimed: 2005-10-19
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Wan Ho Kim
- Web page: https://patentgrep.com/patent/US8772813B2

## CPC

- H10H 20/856: Reflecting means
- H10H 20/8506: {Containers}
- H10H 20/852: Encapsulations
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/858: Means for heat extraction or cooling
- H10H 20/8582: {characterised by their shape}
- H10H 20/8585: {being an interconnection}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.

## Claims

### Claim 1

A light emitting device, comprising:
a substrate comprising a planar top surface;
a light emitting diode chip on the substrate;
a frame disposed around the light emitting diode chip and configured to reflect light emitted from the light emitting diode chip, the frame having an opening;
a first metal layer disposed on the planar top surface of the substrate, one part of the first metal layer disposed in the opening of the frame such that the light emitting diode chip is disposed thereon, and an other part of the first metal layer disposed beneath the frame;
a second metal layer disposed on the planar top surface of the substrate, one part of the second metal layer disposed in the opening of the frame such that the light emitting diode chip is electrically connected thereto via a wire, and an other part of the second metal layer disposed beneath the frame;
a third metal layer disposed on a bottom surface of the substrate, the third metal layer being connected to the first metal layer via a through hole;
a material being filled in the opening of the frame; and
a lens disposed on the material,
wherein both the first metal layer and the second metal layer are interposed between the substrate and the frame, and
wherein the substrate and the frame are separate from each other.

### Claim 2 (depends on 1)

The light emitting device of claim 1, wherein a top surface of the material is lower than a top surface of the frame.

### Claim 3 (depends on 1)

The light emitting device of claim 1, wherein a bottom surface of the lens is lower than a top surface of the frame.

### Claim 4 (depends on 1)

The light emitting device of claim 1, wherein the one part of the first metal layer where the light emitting diode chip is disposed on is connected to the other part of the first metal layer beneath the frame.

### Claim 5 (depends on 1)

The light emitting device of claim 1, wherein a top surface of the frame is positioned higher than a top surface of the light emitting diode chip.

### Claim 6 (depends on 1)

The light emitting device of claim 1, wherein the frame comprises at least one step portion, and
wherein the at least one step portion is positioned higher than a top surface of the light emitting diode chip.

### Claim 7 (depends on 6)

The light emitting device of claim 6, wherein the lens is disposed on the at least one step portion.

### Claim 8 (depends on 6)

The light emitting device of claim 6, wherein the at least one step portion vertically overlaps with the other part of the first metal layer beneath the frame.

### Claim 9 (depends on 1)

The light emitting device of claim 1, wherein a lateral width of the lens is smaller than a lateral width of the frame.