# US 8,772,812 B2 · Curable organopolysiloxane composition and optical semiconductor device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,772,812 B2
- Document ID: US8772812B2
- Status: Granted
- Kind: B2
- Application number: 13/806,879
- Filed: 2011-06-28
- Published: 2013-05-30
- Granted: 2014-07-08
- Earliest claimed: 2010-06-29
- Assignees: Dow Corning Toray Co., Ltd.
- Applicants: Makoto Yoshitake; Mieko Yamakawa
- Inventors: Makoto Yoshitake; Mieko Yamakawa
- Web page: https://patentgrep.com/patent/US8772812B2

## CPC

- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08L 83/04: Polysiloxanes
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/16: to hydroxy groups
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A curable organopolysiloxane composition can be used as a sealant or a bonding agent for optical semiconductor elements. The composition comprises at least the following components: (A) a multi-constituent, alkenyl-containing organopolysiloxane; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms, and, if necessary, constituent (B-3), an organopolysiloxane; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

## Claims

### Claim 1

A curable organopolysiloxane composition comprising at least the following components:
(A) an alkenyl-containing organopolysiloxane that comprises 15 to 35 wt. % of constituent (A-1) and 65 to 85 wt. % of constituent (A-2), wherein
constituent (A-1) comprises an organopolysiloxane of the following average compositional formula:
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d
where R1 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms; 0.4 to 50 mole % of all R1 groups are alkenyl groups having 2 to 10 carbon atoms; methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R1; “a”, “b”, “c”, and “d” are numbers that satisfy the following conditions: 0≦a≦0.05; 0.9≦b≦1; 0≦c≦0.03; 0≦d≦0.03; and a+b+c+d=1;
constituent (A-2) comprises an organopolysiloxane of the following average compositional formula:
(R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h(HO1/2)i
where R2 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms; 5 to 10 mole % of all R2 groups are alkenyl groups having 2 to 10 carbon atoms; methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R2; “e”, “f”, “g”, “h” and “i” are numbers that satisfy the following conditions: 0.4≦e≦0.6; 0≦f≦0.05; 0≦g≦0.05; 0.4≦h≦0.6; 0.01≦i≦0.05; and e+f+g+h=1;
(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises 10 to 50 wt. % of constituent (B-1), 50 to 90 wt. % of constituent (B-2), and 0 to 30 wt. % of constituent (B-3); in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), wherein
constituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula:
R33SiO(R32SiO)j(R3HSiO)kSiR33
where R3 designates phenyl groups or methyl groups; methyl groups constitute 90 mole % or more of all groups contained in R3; “j” is a number in the range of 0 to 35; and “k” is a number in the range of 5 to 100;
constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula:
(HR42SiO1/2)l(R43SiO1/2)m(R42SiO2/2)n(R4SiO3/2)o(SiO4/2)p(R5O1/2)q
where R4 designates phenyl groups or methyl groups; methyl groups constitute 90 mole % or more of all groups contained in R4; R5 designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and “l”, “m”, “n”, “o”, “p” and “q” are numbers that satisfy the following conditions: 0.4≦l≦0.7; 0≦m≦0.2; 0≦n≦0.05; 0≦o≦0.5; 0.3≦p≦0.6; 0≦q≦0.05; and l+m+n+o+p=1;
constituent (B-3) is an organopolysiloxane represented by the following average molecular formula:
HR62SiO(R62SiO)rSiR62H
where R6 represents phenyl or methyl groups; methyl groups constitute at least 90% of all groups contained in R6; and “r” is a number in the range of 10 to 100; and
(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition.

### Claim 2 (depends on 1)

The curable organopolysiloxane composition of claim 1, further comprising (D) fumed silica having BET specific area of 20 to 200 m2/g and added in an amount of 1 to 10 parts by weight per 100 parts by weight of the sum of components (A) to (C).

### Claim 3 (depends on 1)

A cured body of the curable organopolysiloxane composition of claim 1, wherein the cured body has a type D durometer hardness in the range of 30 to 70 according to JIS K 6253.

### Claim 4 (depends on 1)

The curable organopolysiloxane composition of claim 1, further comprising a sealant or a bonding agent for optical semiconductor elements.

### Claim 5 (depends on 4)

The curable organopolysiloxane composition of claim 4, wherein the optical semiconductor elements are light emitting diodes.

### Claim 6 (depends on 1)

An optical semiconductor device, comprising at least one optical semiconductor element, wherein the at least one optical semiconductor element is sealed and/or bonded with a cured body of the curable organopolysiloxane composition of claim 1.

### Claim 7 (depends on 6)

The optical semiconductor device of claim 6, wherein the at least one optical semiconductor element is a light emitting diode.

### Claim 8 (depends on 1)

An optical semiconductor device, comprising a plurality of optical semiconductor elements, wherein each optical semiconductor element is sealed and/or bonded with a cured body of the curable organopolysiloxane composition of claim 1.

### Claim 9 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein constituent (A-1) has a viscosity at 25° C. in the range of 3 to 1,000,000 mPa·s.

### Claim 10 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (A) has a viscosity at 25° C. in the range of 100 to 5,000,000 mPa·s.

### Claim 11 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein constituent (B-1) has a viscosity at 25° C. in the range of 3 to 10,000 mPa·s.

### Claim 12 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (B) has a viscosity at 25° C. in the range of 5 to 100,000 mPa·s.

### Claim 13 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein constituent (B-1) is an interfacial bonding improver.

### Claim 14 (depends on 1)

The curable organopolysiloxane composition of claim 1, further comprising a pot life extender in an amount of 0.0001 to 5 parts by weight of the sum of components (A), (B) and (C).

### Claim 15 (depends on 1)

The curable organopolysiloxane composition of claim 1, further comprising an adhesion promoter that does not contain active nitrogen atoms.

### Claim 16

A curable organopolysiloxane composition comprising at least the following components:
(A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) and constituent (A-2), wherein
constituent (A-1) comprises an organopolysiloxane of the following average compositional formula:
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d
where R1 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms; 0.4 to 50 mole % of all R1 groups are alkenyl groups having 2 to 10 carbon atoms; methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R1; “a”, “b”, “c”, and “d” are numbers that satisfy the following conditions: 0≦a≦0.05; 0.9≦b≦1; 0≦c≦0.03; 0≦d≦0.03; and a+b+c+d=1;
constituent (A-2) comprises an organopolysiloxane of the following average compositional formula:
(R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h(HO1/2)i
where R2 designates phenyl groups, methyl groups, or alkenyl groups having 2 to 10 carbon atoms; 5 to 10 mole % of all R2 groups are alkenyl groups having 2 to 10 carbon atoms; methyl groups constitute 90 mole % or more of the sum of methyl and phenyl groups contained in R2; “e”, “f”, “g”, “h” and “i” are numbers that satisfy the following conditions: 0.4≦e≦0.6; 0≦f≦0.05; 0≦g≦0.05; 0.4≦h≦0.6; 0.01≦i≦0.05; and e+f+g+h=1;
(B) an organopolysiloxane that contains silicon-bonded hydrogen atom and comprises constituent (B-1) and constituent (B-2); in an amount that the silicon-bonded hydrogen atoms in component (B) are in the range of 0.5 to 2.0 moles per 1 mole of the total content of alkenyl groups in component (A), wherein
constituent (B-1) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average molecular formula:
R33SiO(R32SiO)j(R3HSiO)kSiR33
where R3 designates phenyl groups or methyl groups; methyl groups constitute 90 mole % or more of all groups contained in R3; “j” is a number in the range of 0 to 35; and “k” is a number in the range of 5 to 100;
constituent (B-2) comprises an organopolysiloxane that contains at least 0.5 wt. % of silicon-bonded hydrogen atoms and that is represented by the following average compositional formula:
(HR42SiO1/2)l(R43SiO1/2)m(R42SiO2/2)n(R4SiO3/2)o(SiO4/2)p(R5O1/2)q
where R4 designates phenyl groups or methyl groups; methyl groups constitute 90 mole % or more of all groups contained in R4; R5 designates hydrogen atoms or alkyl groups having 1 to 10 carbon atoms; and “l”, “m”, “n”, “o”, “p” and “q” are numbers that satisfy the following conditions: 0.4≦l≦0.7; 0≦m≦0.2; 0≦n≦0.05; 0≦o≦0.5; 0.3≦p≦0.6; 0≦q≦0.05; and l+m+n+o+p=1; and
(C) a hydrosilylation-reaction catalyst, in an amount sufficient for curing the composition.

### Claim 17 (depends on 16)

A curable organopolysiloxane composition of claim 16, wherein component (A) comprises 20 to 30 wt. % of constituent (A-1) and 70 to 80 wt. % of constituent (A-2).

### Claim 18 (depends on 16)

A curable organopolysiloxane composition of claim 16, wherein component (B) comprises 25 to 45 wt. % of constituent (B-1) and 55 to 75 wt. % of constituent (B-2).