# US 8,772,807 B2 · Light emitting diode package structure and manufacturing method thereof

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- Number: US 8,772,807 B2
- Document ID: US8772807B2
- Status: Granted
- Kind: B2
- Application number: 13/118,007
- Filed: 2011-05-27
- Published: 2012-04-05
- Granted: 2014-07-08
- Earliest claimed: 2010-09-30
- Assignees: Everlight Electronics Co., Ltd.
- Applicants: Hsien Chia Lin
- Inventors: Hsien Chia Lin
- Web page: https://patentgrep.com/patent/US8772807B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/0364: {of interconnections}
- H10H 20/8506: {Containers}
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/8515: {not being in contact with the bodies}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 90/00: Package configurations
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.

## Claims

### Claim 1

A light emitting diode (LED) package structure, comprising:
a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate comprising a fluorescent material and a glass material, the fluorescent substrate having a through hole that traverses through the fluorescent substrate from the first surface to the second surface;
a first electrically conductive pattern disposed on the first surface of the fluorescent substrate;
a second electrically conductive pattern disposed on the second surface of the fluorescent substrate;
an electrically conductive component filled in the through hole and connecting the first electrically conductive pattern and the second electrically conductive pattern; and
a plurality of LED chips including first and second LED chips disposed on the second surface of the fluorescent substrate with the first LED chip aligned with the through hole and the second LED chip not aligned with the through hole, each of the first and second LED chips having a light extraction surface coupled to the second electrically conductive pattern such that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component.

### Claim 2 (depends on 1)

The LED package structure of claim 1, wherein a thickness of the fluorescent substrate is approximately constant throughout the fluorescent substrate.

### Claim 3 (depends on 1)

The LED package structure of claim 1, wherein the fluorescent material comprises yellow phosphor.

### Claim 4 (depends on 1)

The LED package structure of claim 1, wherein the fluorescent material comprises phosphors of at least two different wavelengths.

### Claim 5 (depends on 4)

The LED package structure of claim 4, wherein the phosphors comprise at least two of yellow phosphor, red phosphor, and green phosphor.

### Claim 6 (depends on 1)

The LED package structure of claim 1, further comprising an underfill disposed between the light extraction surface of the first and second LED chips and the second surface of the fluorescent substrate, the underfill covering at least partially the light extraction surface of the first and second LED chips.

### Claim 7 (depends on 6)

The LED package structure of claim 6, wherein the underfill covers a plurality of side surfaces of the first and second LED chips partially and not completely.

### Claim 8 (depends on 7)

The LED package structure of claim 7, wherein the first and second LED chip comprise a sapphire substrate.

### Claim 9 (depends on 1)

The LED package structure of claim 1, further comprising a circuit line substrate, a back surface of each of the first and second LED chips opposite the light extraction surface disposed on the circuit line substrate.

### Claim 10 (depends on 9)

The LED package structure of claim 9, further comprising at least one bonding wire that electrically couples the circuit line substrate and the first electrically conductive pattern.