# US 8,772,794 B2 · Light emitting device package having LED disposed in leadframe cavities > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,794 B2 - Document ID: US8772794B2 - Status: Granted - Kind: B2 - Application number: 13/325,326 - Filed: 2011-12-14 - Published: 2013-03-14 - Granted: 2014-07-08 - Earliest claimed: 2011-07-29 - Assignees: LG Innotek Co., Ltd. - Applicants: Buemyeon Lee - Inventors: Buemyeon Lee - Web page: https://patentgrep.com/patent/US8772794B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10W 90/00: Package configurations - F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings - F21V 29/15: Thermal insulation - F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/835: {Reflective materials} - H10H 20/856: Reflecting means - H10H 20/8582: {characterised by their shape} - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities. ## Claims ### Claim 1 A light emitting device package comprising: a body; a first cavity in a first region of the body; a second cavity in a second region of the body and spaced apart from the first cavity; first and second lead frames spaced apart from each other under the first region and the second region of the body; a first light emitting device on the first and second lead frames disposed in the first cavity; a second light emitting device on the first and second lead frames disposed in the second cavity; and a molding member in the first and second cavities, wherein the first lead frame includes a first base part and a first sidewall part extended from the first base part in the first cavity, wherein the second lead frame includes a second base part and a second sidewall part extended from the second base part in the first cavity, wherein the first lead frame includes a third base part and a third sidewall part extended from the third base part in the second cavity, wherein the second lead frame includes a fourth base part and a fourth sidewall part extended from the fourth base part in the second cavity. ### Claim 2 (depends on 1) The light emitting device package of claim 1, further comprising a third cavity formed on the body, wherein a connection frame of the first lead frame and a connection part of the second lead frame are disposed in the third cavity, and a protective device is disposed on the connection frame of the first lead frame and the connection part of the second lead frame in the third cavity. ### Claim 3 (depends on 1) The light emitting device package of claim 1, wherein lower surfaces of the first to fourth base parts are disposed on a same horizontal plane with a lower surface of the body. ### Claim 4 (depends on 1) A lighting system comprising: a plurality of light emitting device packages; and a module substrate where the light emitting device packages are arrayed, wherein each light emitting device package comprises the light emitting device package of claim 1. ### Claim 5 (depends on 1) The light emitting device package of claim 1, wherein each of the first to fourth sidewall parts is formed in plurality. ### Claim 6 (depends on 1) The light emitting device package of claim 1, wherein the first region and the second region are each disposed in an open region recessed at a top surface of the body. ### Claim 7 (depends on 6) The light emitting device package of claim 6, wherein the open region of the body has a width that is wider than a width of each of the first cavity and the second cavity. ### Claim 8 (depends on 1) The light emitting device package of claim 1, wherein each of the first and second light emitting devices comprises: a light emitting structure; and first and second electrodes under the light emitting structure, wherein the first and second electrodes of the first light emitting device are bonded onto the first base part of the first lead frame and the second base part of the second lead frame, and the first and second electrodes of the second light emitting device are bonded onto the third base part of the first lead frame and the fourth base part of the second lead frame. ### Claim 9 (depends on 8) The light emitting device package of claim 8, wherein each of the first and second light emitting devices comprises a semiconductor layer or a substrate disposed on a top side of the first and second light emitting devices. ### Claim 10 (depends on 8) The light emitting device package of claim 8, wherein each of the first and second light emitting devices comprises: a reflective electrode layer disposed between the light emitting structure and the second electrode; and an insulating support member disposed under the reflective electrode layer and disposed around the first and second electrodes, wherein a lower surface of the insulating support member, a lower surface of the first electrode and a lower surface of the second electrode are disposed on a same plane. ### Claim 11 (depends on 8) The light emitting device package of claim 8, further comprising: a lead part protruding downward of at least one of lateral sides of the body from at least one of the first and second lead frames. ### Claim 12 (depends on 8) The light emitting device package of claim 8, further comprising: a first separation part disposed between the first base part of the first lead frame and the second base part of the second lead frame in the first cavity to separate the first and second lead frames; and a second separation part disposed between the third and fourth base parts of the first and second lead frames in the second cavity to separate the first and second lead frames. ### Claim 13 (depends on 12) The light emitting device package of claim 12, wherein the first separation part is extended between the first sidewall part of the first lead frame and the second sidewall part of the second lead frame, and the second separation part is extended between the third sidewall part of the first lead frame and the fourth sidewall part of the second lead frame. ### Claim 14 (depends on 1) The light emitting device package of claim 1, wherein the first sidewall part and the third sidewall part of the first lead frame are connected to each other. ### Claim 15 (depends on 14) The light emitting device package of claim 14, wherein the first lead frame further includes a first top part extended from the first and third sidewall parts, wherein the second lead frame further includes a second top part extended from the second and fourth sidewall parts. ### Claim 16 (depends on 15) The light emitting device package of claim 15, wherein the first and second top parts are disposed between the first cavity and the second cavity. ### Claim 17 (depends on 15) The light emitting device package of claim 15, wherein the first to fourth sidewall parts and the first to fourth base parts are formed of a metal material. ### Claim 18 (depends on 15) The light emitting device package of claim 15, wherein the first and second top parts are located at a higher position than top surfaces of the first and second light emitting devices. ### Claim 19 (depends on 15) The light emitting device package of claim 15, wherein the first and second top parts are located at a higher position than the first base part of the first lead frame and the second base part of the second lead frame.