# US 8,772,793 B2 · Light emitting diodes and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,793 B2 - Document ID: US8772793B2 - Status: Granted - Kind: B2 - Application number: 13/272,229 - Filed: 2011-10-13 - Published: 2012-07-12 - Granted: 2014-07-08 - Earliest claimed: 2011-01-10 - Assignees: Advanced Optoelectronic Technology, Inc. - Applicants: Shih-Cheng Huang; Po-Min Tu; Ya-Wen Lin - Inventors: Shih-Cheng Huang; Po-Min Tu; Ya-Wen Lin - Web page: https://patentgrep.com/patent/US8772793B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10H 20/8314: {extending at least partially onto an outer side surface of the bodies} - H10H 20/833: Transparent materials - H10H 20/853: characterised by their shape - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An exemplary LED includes an electrode layer, an LED die, a transparent electrically conductive layer, and an electrically insulating layer. The electrode layer includes a first section and a second section electrically insulated from the first section. The LED die is arranged on and electrically connected to the second section of the electrode layer. The transparent electrically conductive layer is formed on the LED die and electrically connects the LED die to the first section of the electrode layer. The electrically insulating layer is located between the LED die and the transparent electrically conductive layer to insulate the transparent electrically conductive layer from the second section of the electrode layer. ## Claims ### Claim 1 A light emitting diode (LED) comprising: an electrode layer comprising a first section and a second section electrically insulated from the first section; an LED die arranged on and electrically connected to the second section of the electrode layer; a transparent electrically conductive layer formed on the LED die, the transparent electrically conductive layer electrically connecting the LED die to the first section of the electrode layer; an electrically insulating layer located between the LED die and the transparent electrically conductive layer to insulate the transparent electrically conductive layer from the second section of the electrode layer; and an electrically insulating base located below the electrode layer, the electrically insulating base comprising a first electrode part and a second electrode part attached thereon, the electrode layer being arranged on the base and the first and second sections of the electrode layer respectively electrically contacting the first and second electrode parts; wherein bottom surfaces of the first section and the second section are coplanar, top surfaces of the first electrode part and the second electrode part are coplanar and respectively contact the bottom surfaces of the first section and the second section; wherein a through hole is defined in the electrode layer, an electrically insulating material is filled in the through hole to divide the electrode layer into the first and second sections, the through hole is below the LED die and entirely surrounded by the first and second sections, a gap is defined between the first electrode part and the second electrode to make the first electrode and the second electrode electrically insulate from each other, the through hole is coaxial with the gap, and the through hole has a width smaller than a width of the gap of the base. ### Claim 2 (depends on 1) The LED of claim 1, wherein the electrically insulating layer totally covers lateral sides of the LED die, and covers a periphery of a top side of the LED die with a through hole defined above of the LED die, the transparent electrically conductive layer fills the through hole of the electrically insulating layer to electrically connect with the LED die, and the LED die is arranged on the second section of the electrode layer. ### Claim 3 (depends on 2) The LED of claim 2, wherein the electrically insulating layer covers a part of the first section of the electrode layer to make the other part of the first section be exposed and electrically connect with the transparent electrically conductive layer. ### Claim 4 (depends on 2) The LED of claim 2, wherein the transparent electrically conductive layer comprises a first covering portion, a second covering portion, and a connecting portion interconnecting the first covering portion and the second covering portion, the first covering portion fills in the through hole and electrically connects with the LED die, and the second covering portion contacts the exposed portion of the first section of the electrode layer. ### Claim 5 (depends on 1) The LED of claim 1, wherein a packaging layer is formed on the electrode layer and encapsulates the LED die, the electrically insulating layer, and the transparent electrically conductive layer therein. ### Claim 6 (depends on 1) The LED of claim 1, wherein the electrically insulating layer is transparent. ### Claim 7 (depends on 1) The LED of claim 1, wherein the LED die comprising a substrate, a P-doped region, an active layer, and an N-doped region, the substrate, the P-doped region, the active layer, and the N-doped region being stacked one on the other along a vertical direction of the LED, and the substrate is arranged on the second section of the electrode layer. ### Claim 8 (depends on 7) The LED of claim 7, wherein a reflecting layer is located between the P-doped region and the substrate of the LED die. ### Claim 9 (depends on 7) The LED of claim 7, wherein the P-doped region comprises two stacked P-type gallium nitrogen layers. ### Claim 10 (depends on 7) The LED of claim 7, wherein the N-doped region is an N-type gallium nitrogen layer.