# US 8,772,781 B2 · Wiring structure, thin film transistor array substrate including the same, and display device

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- Number: US 8,772,781 B2
- Document ID: US8772781B2
- Status: Granted
- Kind: B2
- Application number: 13/665,412
- Filed: 2012-10-31
- Published: 2013-05-09
- Granted: 2014-07-08
- Earliest claimed: 2011-11-07
- Assignees: Mitsubishi Electric Corporation
- Applicants: Naruhito Hoka; Shingo Nagano; Takeshi Shimamura; Osamu Miyakawa
- Inventors: Naruhito Hoka; Shingo Nagano; Takeshi Shimamura; Osamu Miyakawa
- Web page: https://patentgrep.com/patent/US8772781B2

## CPC

- H10D 86/60: wherein the TFTs are in active matrices
- G02F 1/136286: {Wiring, e.g. gate line, drain line}
- H10D 30/6729: {characterised by the electrodes}
- H10D 30/6737: {characterised by the electrode materials}
- H10D 30/6743: {Silicon}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- G02F 1/134372: {for fringe field switching [FFS] where the common electrode is not patterned}
- G02F 1/1345: Conductors connecting electrodes to cell terminals
- G02F 1/136231: {for reducing the number of lithographic steps}
- G02F 1/136295: {Materials; Compositions; Manufacture processes}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

On each of wiring conversion parts connected to a first conductive film and a second conductive film each functioning as a wiring, a first transparent conductive film does not cover an end surface of the second conductive film in proximity to a corner of the first transparent conductive film, and has a portion covering the end surface of the second conductive film on a portion other than the proximity of the corners. A second transparent conductive film as an upper layer of the first transparent conductive film is connected to the first conductive film and the second conductive film, so that the first conductive film and the second conductive film are electrically connected.

## Claims

### Claim 1

A wiring structure comprising:
an upper layer conductive film; and
a first transparent conductive film formed on said upper layer conductive film to be in contact with said upper layer conductive film, wherein
said first transparent conductive film does not cover an end surface of said upper layer conductive film in proximity to a corner of the first transparent conductive film, and has a portion that covers the end surface of said upper layer conductive film to contact the end surface of said upper layer conductive film on a portion other than said proximity of the corner.

### Claim 2 (depends on 1)

The wiring structure according to claim 1, wherein said upper layer conductive film is a laminated film formed by stacking different types of conductive films.

### Claim 3 (depends on 1)

The wiring structure according to claim 1, further comprising: a semiconductor film electrically connected to the upper layer conductive below said upper layer conductive film.

### Claim 4 (depends on 1)

The wiring structure according to claim 1, wherein no semiconductor film is formed below said upper layer conductive film.

### Claim 5 (depends on 1)

The wiring structure according to claim 1, further comprising:
an insulating film formed on said first transparent conductive film;
a lower layer conductive film as a layer different from said upper layer conductive film, formed below said insulating film;
a first contact hole formed in said insulating film, and reaching said first transparent conductive film;
a second contact hole formed in said insulating film, and reaching said lower layer conductive film; and
a second transparent conductive film formed on said insulating film, connected to said first transparent conductive film through said first contact hole, and connected to said lower layer conductive film through said second contact hole.

### Claim 6 (depends on 1)

A thin film transistor array substrate comprising:
the wiring structure according to claim 1.

### Claim 7 (depends on 6)

A display device comprising:
a display panel formed by using the thin film transistor array substrate according to claim 6.