# US 8,772,745 B1 · X-ray obscuration film and related techniques

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,772,745 B1
- Document ID: US8772745B1
- Status: Granted
- Kind: B1
- Application number: 13/827,297
- Filed: 2013-03-14
- Granted: 2014-07-08
- Earliest claimed: 2013-03-14
- Assignees: Lockheed Martin Corporation
- Applicants: Lockheed Martin Corporation
- Inventors: Stephen Gonya; Jesse Iannon
- Web page: https://patentgrep.com/patent/US8772745B1

## CPC

- G21F 3/00: Shielding characterised by its physical form, e.g. granules, or shape of the material
- H05K 1/02: Details
- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 1/0275: {Security details, e.g. tampering prevention or detection}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/40: protecting against tampering, e.g. unauthorised inspection or reverse engineering
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/09681: Mesh conductors, e.g. as a ground plane
- G21F: PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR (radiation protection by pharmaceutical means A61K8/00, A61Q17/04; in cosmonautic vehicles B64G1/54; combined with a reactor G21C11/00; combined with X-ray tubes H01J35/16; combined with X-ray apparatus H05G1/02)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

## Claims

### Claim 1

An obscured electronic device comprising:
an electronic circuit including a plurality of circuit lines; and
an obscuration film coupled to said electronic circuit, said obscuration film comprising
a first wire mesh, and
a second wire mesh,
wherein said obscuration film is configured to absorb at least a portion of electromagnetic radiation energy and to create an interference pattern obscuring said plurality of circuit lines of said electronic circuit when said device is placed between an electromagnetic radiation source and an electromagnetic radiation detector.

### Claim 2 (depends on 1)

The device of claim 1, wherein said obscuration film further comprises:
a layer of material having portions which extend into openings of the first and second wire meshes and in contact with portions thereof.

### Claim 3 (depends on 1)

The device of claim 1, wherein said obscuration film further comprises:
a layer of material configured between the first and second wire meshes and in contact with portions thereof.

### Claim 4 (depends on 1)

The device of claim 1, wherein said first wire mesh has a first mesh size and said second wire mesh has a second mesh size, said first mesh size being different from said second mesh size.

### Claim 5 (depends on 2)

The device of claim 2, wherein said material comprises indium, said first wire mesh comprises copper, and said second wire mesh comprises copper.

### Claim 6 (depends on 1)

The device of claim 1, wherein said obscuration film is less than 10 mils thick.

### Claim 7 (depends on 1)

The device of claim 1, wherein said interference pattern is a moiré interference pattern.

### Claim 8

An obscuration film comprising:
a metallic wire mesh; and
an adjacent layer of material having portions which extend into openings of the metallic wire mesh and in contact with metallic portions thereof,
wherein said obscuration film is configured to absorb at least a portion of electromagnetic radiation energy and to create an interference pattern when said obscuration film is placed between an electromagnetic radiation source and an electromagnetic radiation detector.

### Claim 9 (depends on 8)

The obscuration film of claim 8, further comprising:
a second metallic wire mesh,
wherein the layer of material has portions which extend into openings of the second metallic wire mesh and in contact with metallic portions thereof.

### Claim 10 (depends on 9)

The obscuration film of claim 9, further comprising:
a third metallic wire mesh,
wherein the layer of material has portions which extend into openings of the third metallic wire mesh and in contact with metallic portions thereof.

### Claim 11 (depends on 10)

The obscuration film of claim 10, wherein said metallic wire mesh, said second metallic wire mesh, and said third metallic wire mesh each comprises a copper wire mesh.

### Claim 12 (depends on 9)

The obscuration film of claim 9, wherein said obscuration film is less than 10 mils thick.

### Claim 13 (depends on 9)

The obscuration film of claim 9, wherein said obscuration film is no more than 5 mils thick.

### Claim 14 (depends on 7)

The obscuration film of claim 7, wherein said wire mesh and said second wire mesh each comprise copper wire mesh.

### Claim 15 (depends on 8)

The obscuration film of claim 8, wherein said obscuration film is no more than 5 mils thick.

### Claim 16 (depends on 8)

The obscuration film of claim 8, wherein said interference pattern is a moiré interference pattern.

### Claim 17 (depends on 8)

The obscuration film of claim 8 configured to be moldable to conform to an electronic device.

### Claim 18 (depends on 9)

The obscuration film of claim 9, wherein said first metallic wire mesh layer has a first mesh size and said second metallic wire mesh layer has a second mesh size, said first mesh size being different than said second mesh size.

### Claim 19

A method of manufacturing an obscuration film, comprising:
overlaying two or more metallic wire mesh layers in an orientation;
solid-state bonding said wire mesh layers together using a foil sheet to create said obscuration film,
wherein said metallic wire mesh layers are configured in said orientation to absorb at least a portion of electromagnetic radiation energy and create an interference pattern when said obscuration film is coupled to an electronic circuit and placed between an electromagnetic radiation source and an electromagnetic radiation detector, said interference pattern obscuring lines in said electronic circuit.

### Claim 20 (depends on 19)

The method of claim 19, wherein said obscuration film is less than 10 mils thick.

### Claim 21 (depends on 19)

The method of claim 19, wherein each of said two or more metallic wire mesh layers is a different size.

### Claim 22 (depends on 19)

The method of claim 19, wherein said solid-state bonding includes solid-state bonding said wire mesh layers together using a foil sheet under high pressure to extrude a portion of the material of said foil sheet into openings of said two or more metallic wire mesh layers.

### Claim 23 (depends on 19)

The method of claim 19, wherein each of said metallic wire mesh layers comprises a copper alloy wire mesh.

### Claim 24 (depends on 19)

The method of claim 19, wherein said foil sheet comprises indium.

### Claim 25 (depends on 19)

The method of claim 19, wherein said foil sheet comprises indium and lead.

### Claim 26 (depends on 19)

The method of claim 19, wherein said foil sheet and said metallic wire mesh layers are configured to provide heat dissipation when said obscuration film is coupled to an electronic circuit.

### Claim 27 (depends on 19)

The method of claim 19, wherein said foil sheet and said metallic wire mesh layers are configured to provide electromagnetic shielding when said obscuration film is coupled to an electronic circuit.

### Claim 28 (depends on 19)

The method of claim 19, wherein said obscuration film can be formed to a complex surface contour.