# US 8,772,741 B2 · Ion implantation method and ion implantation apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,741 B2 - Document ID: US8772741B2 - Status: Granted - Kind: B2 - Application number: 13/432,936 - Filed: 2012-03-28 - Published: 2012-10-04 - Granted: 2014-07-08 - Earliest claimed: 2011-03-28 - Assignees: Sen Corporation - Applicants: Shiro Ninomiya; Akihiro Ochi; Yasuhiko Kimura; Yasuharu Okamoto; Toshio Yumiyama - Inventors: Shiro Ninomiya; Akihiro Ochi; Yasuhiko Kimura; Yasuharu Okamoto; Toshio Yumiyama - Web page: https://patentgrep.com/patent/US8772741B2 ## CPC - H01J 37/3171: {for ion implantation} - H01J 37/3023: {Program control} - H01J 37/3172: {Maskless patterned ion implantation} - H01J 2237/30483: Scanning - H01J 2237/31701: Ion implantation - H01J 2237/31706: characterised by the area treated - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract An ion implantation method includes reciprocally scanning an ion beam, mechanically scanning a wafer in a direction perpendicular to a beam scanning direction, and implanting ions into the wafer. The wafer is divided into a plurality of implantation regions, a beam scanning speed in the beam scanning direction is set to be varied for each of the implantation regions, an ion implantation amount distribution for each of the implantation regions is controlled by changing and controlling the beam scanning speed, and the ion implantation amount for each of the implantation regions is controlled and a beam scanning frequency and a beam scanning amplitude in the control of the beam scanning speed for each of the implantation regions is made to be constant by setting a wafer mechanical scanning speed and controlling the wafer mechanical scanning speed for each of the implantation regions. ## Claims ### Claim 1 An ion implantation method comprising: reciprocally scanning an ion beam; mechanically scanning a wafer in a direction perpendicular to a beam scanning direction; and implanting ions into the wafer, wherein the wafer is divided into a plurality of implantation regions in the wafer surface in a wafer mechanical scanning direction, a beam scanning speed in the beam scanning direction is set to be varied for each of the implantation regions, an ion implantation amount distribution for each of the implantation regions is controlled by changing and controlling the beam scanning speed on the basis of a speed pattern calculated through variable setting of the beam scanning speed corresponding to the ion implantation amount distribution for each of the implantation regions, and the ion implantation amount for each of the implantation regions is controlled and a beam scanning frequency and a beam scanning amplitude in the control of the beam scanning speed for each of the implantation regions are made to be constant by setting a wafer mechanical scanning speed so as to correspond to each of the implantation regions and controlling the wafer mechanical scanning speed for each of the implantation regions. ### Claim 2 (depends on 1) The ion implantation method according to claim 1, wherein an ion implantation is continuously performed for the plurality of implantation regions in the wafer where ion implantation amount distribution and ion implantation amount in the beam scanning direction are set for each of the implantation regions. ### Claim 3 (depends on 1) The ion implantation method according to claim 1, wherein the implantation regions are disposed at a uniform interval in the mechanical scanning direction of the wafer. ### Claim 4 (depends on 1) The ion implantation method according to claim 1, wherein the implantation regions are disposed at an arbitrary interval in the mechanical scanning direction of the wafer. ### Claim 5 (depends on 1) The ion implantation method according to claim 1, wherein the speed pattern of the beam scanning speed is separately set so as to correspond to an ion implantation amount distribution for each of the implantation regions. ### Claim 6 (depends on 1) The ion implantation method according to claim 1, wherein an integral value of ion beam currents corresponding to a certain number of beam scanning cycles is measured for each of the implantation regions using a beam measurement device, and the wafer mechanical scanning speed is controlled on the basis of each speed pattern calculated through variable setting for each of the implantation regions so as to correspond to the measured integral value of ion beam currents. ### Claim 7 (depends on 1) The ion implantation method according to claim 1, wherein the wafer mechanical scanning speed is changed according to the change in the beam scanning speed for each of the implantation regions such that a product of the beam scanning speed and the wafer mechanical scanning speed is made to be constant for each speed pattern. ### Claim 8 (depends on 1) The ion implantation method according to claim 1, wherein the speed pattern of the beam scanning speed is maintained and a reference speed thereof is multiplied by a proportional constant so as to change the reference speed for each of the implantation regions, thereby making the beam scanning amplitude and the beam scanning frequency constant. ### Claim 9 (depends on 1) The ion implantation method according to claim 1, wherein a targeted ion implantation amount distribution is an arbitrary non-uniform two-dimensional ion implantation amount distribution of a concentric circle shape. ### Claim 10 (depends on 1) The ion implantation method according to claim 1, wherein a targeted ion implantation amount distribution is an arbitrary non-uniform two-dimensional ion implantation amount distribution of a concentric ring shape. ### Claim 11 (depends on 1) The ion implantation method according to claim 1, wherein a targeted ion implantation amount distribution is an arbitrary non-uniform two-dimensional ion implantation amount distribution where the ion implantation amount is partially increased and decreased at specific in-surface positions in the wafer. ### Claim 12 An ion implantation apparatus which reciprocally scans an ion beam, mechanically scans a wafer in a direction perpendicular to a beam scanning direction, and implants ions into the wafer, comprising: a controller that fixes both a beam scanning frequency and a beam scanning amplitude and realizes desired ion implantation amount distribution and ion implantation amount for each implantation regions in a case where the wafer is divided into a plurality of implantation regions in a mechanical scanning direction, a beam scanning speed in the beam scanning direction is set to be varied for each of the implantation regions, and, on the basis thereof, an ion implantation amount in the wafer is controlled, in order to correct non-uniformity in the wafer surface in other semiconductor manufacturing processes, wherein the controller controls an ion implantation amount distribution for each of the implantation regions by changing and controlling the beam scanning speed on the basis of a speed pattern calculated through variable setting of the beam scanning speed corresponding to the ion implantation amount distribution for each of the implantation regions, and controls the ion implantation amount for each of the implantation regions and makes a beam scanning frequency and a beam scanning amplitude in the control of the beam scanning speed for each of the implantation regions constant by setting a wafer mechanical scanning speed so as to correspond to each of the implantation regions and controlling the wafer mechanical scanning speed for each of the implantation regions. ### Claim 13 (depends on 12) The ion implantation apparatus according to claim 12, further comprising a beam measurement device that measures an integral value of ion beam currents corresponding to a certain number of beam scanning cycles for each of the implantation regions, wherein the controller controls the wafer mechanical scanning speed for each of the implantation regions so as to correspond to the measured integral value of ion beam currents. ### Claim 14 (depends on 12) The ion implantation apparatus according to claim 12, wherein the controller changes the wafer mechanical scanning speed according to the change in the beam scanning speed for each of the implantation regions such that a product of the beam scanning speed and the wafer mechanical scanning speed is made to be constant for each speed pattern. ### Claim 15 (depends on 12) The ion implantation apparatus according to claim 12, wherein the controller maintains the speed pattern of the beam scanning speed and multiplies a reference speed thereof by a proportional constant so as to change the reference speed for each of the implantation regions, thereby making the beam scanning amplitude and the beam scanning frequency constant.